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Showing items 251-260 of 384 (39 Page(s) Totally)
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| 國立臺灣大學 |
2008 |
Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal
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Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
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Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys
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Chuang, T.H.; Chi, C.C.; Lin, H.J. |
| 國立臺灣大學 |
2008 |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2008 |
Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum
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Liu, C. Y.; Datta, A.; Liu, N. W.; Wu, Y. R.; Wang, H. H.; Chuang, T. H.; Wang, Y. L. |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2007 |
Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy
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Chuang, T.H.; Lin, H.J.; Chi, C.C. |
| 國立臺灣大學 |
2007 |
Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints
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Chuang, T. H.; Yen, S. F. |
| 國立臺灣大學 |
2007 |
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler
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Chang, S.Y.; Chuang, T.H.; Yang, C.L. |
Showing items 251-260 of 384 (39 Page(s) Totally)
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