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机构	日期	题名	作者
國立臺灣大學	2008	Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal	Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.
國立臺灣大學	2008	Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.
國立臺灣大學	2008	Formation of Whiskers and Hillocks on the Surface of Sn-6.6RE Alloys	Chuang, T.H.; Chi, C.C.; Lin, H.J.
國立臺灣大學	2008	Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads	Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.
國立臺灣大學	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學	2008	Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum	Liu, C. Y.; Datta, A.; Liu, N. W.; Wu, Y. R.; Wang, H. H.; Chuang, T. H.; Wang, Y. L.
臺大學術典藏	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學	2007	Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy	Chuang, T.H.; Lin, H.J.; Chi, C.C.
國立臺灣大學	2007	Abnormal Tin Whisker Growth in Rare Earth Element-Doped Sn-3Ag-0.5Cu Solder Joints	Chuang, T. H.; Yen, S. F.
國立臺灣大學	2007	Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler	Chang, S.Y.; Chuang, T.H.; Yang, C.L.
國立臺灣大學	2007	Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads	Lin, W.H.; Wu, Albert T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N.
國立臺灣大學	2006-02	Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
國立臺灣大學	2006	Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates	Wang, S. S.; Tseng, Y. H.; Chuang, T. H.
國立臺灣大學	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
國立臺灣大學	2006	Active Soldering of ITO to Copper	Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2006	Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques	Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.
臺大學術典藏	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth
臺大學術典藏	2006	Mechanical properties of intermetallic compounds on lead-free solder by Moire techniques	Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG
國立成功大學	2004	Bioassay-guided isolation and cytotoxicity of phenylpropanoid esters from the stems of Hibiscus taiwanensis	Wu, P. L.; Chuang, T. H.; He, C. X.; Wu, Tian-Shung
國立臺灣大學	2004	Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad	Chiang, M. J.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2004	Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates	Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.
國立臺灣大學	2004	Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages	Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.
國立臺灣大學	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	Chuang, T. H.; Huang, K. W.; Lin, W. H.
國立臺灣大學	2004	Morphology and Growth Kinetics of Intermetallics Formed during the Interfacial Reactions of Solder Joints	Chuang, T.H.; Wu, H.F.; Huang, K.W.; Yen, S.F.; Lin, H.J.
臺大學術典藏	2004	Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates	Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH
臺大學術典藏	2004	Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions	ChuangTH; Chuang, T. H.; Huang, K. W.; Lin, W. H.; Chuang, T. H.; Huang, K. W.; Lin, W. H.
臺大學術典藏	2004	Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180))	Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2003	Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy	Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2003	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學	2003	Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers	Liang, M. W.; Hsieh, T. E.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H.
國立臺灣大學	2003	Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal	Chang, S. Y.; Hung, Y. T.; Chuang, T. H.
臺大學術典藏	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y.
臺大學術典藏	2003	Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers	Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2002	Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates	Chan, Y. C.; Chiu, M. Y.; Chuang, T. H.
國立臺灣大學	2002	Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals	Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H.
國立臺灣大學	2002	Soldering reactions between In49Sn and Ag thick films	Cheng, M. D.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates	Chiu, M. Y.; Chang, S. Y.; Tseng, Y. H.; Chan, Y. C.; Chuang, T. H.
國立臺灣大學	2002	Intermetallic compounds formed at the interface between liquid indium and copper substrates	Yu, C. L.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates	Chiu, M. Y.; Wang, S. S.; Chuang, T. H.
國立臺灣大學	2002	Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing	Tsao, L. C.; Su, T. L.; Chuang, T. H.
國立臺灣大學	2002	Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions	Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.
國立臺灣大學	2002	Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements	Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S.
國立臺灣大學	2002	Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals	Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.
國立臺灣大學	2002	Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2002	Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2002	Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate	Chiang, M. J.; Chuang, T. H.
臺大學術典藏	2002	Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions	ChuangTH; Wang, S. S.; Chang, S. Y.; Yu, C. L.; Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; Chuang, T. H.
臺大學術典藏	2002	Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates	Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chiu, M.Y.; Chang, S.Y.
國立臺灣大學	2001	Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals	Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H.

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