English  |  正體中文  |  简体中文  |  Total items :2822924  
Visitors :  30041763    Online Users :  1117
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"tsao l c"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 31-40 of 81  (9 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 9 > >>
View [10|25|50] records per page

Institution Date Title Author
臺大學術典藏 2018-06-28T22:23:24Z Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.
臺大學術典藏 2018-06-28T22:11:27Z Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH
國立成功大學 2013-12 Formation of ultrafine structure in as cast Ti7CuXSn alloys Tsao, L. C.; Wu, R. W.; Wu, M. W.; Huang, C. H.; Chen, R. S.
國立成功大學 2013-09 Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads Tsao, L. C.; Wu, R. W.; Cheng, Te-Hsien; Fan, Kuo-Huan; Chen, R. S.
國立成功大學 2012-05-30 Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder Tsao, L. C.; Huang, C. H.; Chung, C. H.; Chen, R. S.
國立臺灣大學 2012 Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.
國立成功大學 2011-08 Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S.
國立臺灣大學 2011 Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.
國立臺灣大學 2011 Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.
國立臺灣大學 2011 Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S.

Showing items 31-40 of 81  (9 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 9 > >>
View [10|25|50] records per page