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机构	日期	题名	作者
臺大學術典藏	2018-06-28T22:23:24Z	Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging	ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.
臺大學術典藏	2018-06-28T22:11:27Z	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH
國立成功大學	2013-12	Formation of ultrafine structure in as cast Ti7CuXSn alloys	Tsao, L. C.; Wu, R. W.; Wu, M. W.; Huang, C. H.; Chen, R. S.
國立成功大學	2013-09	Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads	Tsao, L. C.; Wu, R. W.; Cheng, Te-Hsien; Fan, Kuo-Huan; Chen, R. S.
國立成功大學	2012-05-30	Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder	Tsao, L. C.; Huang, C. H.; Chung, C. H.; Chen, R. S.
國立臺灣大學	2012	Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging	Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y.
國立成功大學	2011-08	Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates	Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S.
國立臺灣大學	2011	Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder	Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.
國立臺灣大學	2011	Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder	Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.
國立臺灣大學	2011	Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates	Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S.
臺大學術典藏	2011	Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder	Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH; Chuang, T.H.; Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.
國立臺灣大學	2008-08	A comparison of polymer composites for development of flexible sensor array	Shih, W.-P.; Lee, C.-L.; Lee, C.-W.; Tsao, L.-C.; Yang, Y.-J.; Fan, K.-C.
國立臺灣大學	2008-07	Fabrication and characterization od electro-active polymer for flexible tactile sensing array	Tsao, L.C.; Chang, D.R.; Shih, W.P.; Fan, K.C.
國立臺灣科技大學	2008	An Integrated Flexible Temperature and Tactile Sensing Array using PI-copper films	Yang, Y.J. ; Cheng, M.Y. ; Chang, W.Y. ; Tsao, L.C. ; Yang, S.A. ; Shih, W.P. ; Chang, F.Y. ; Chang, S. H. ; Fan, K.C.
國立臺灣科技大學	2008	On applying fair queuing discipline to schedule requests at access gateway for downlink differential QoS	Tsao, S.-C.;Lai, Y.-C.;Tsao, L.-C.;Lin, Y.-D.
國立臺灣大學	2008	Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal	Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.
國立臺灣大學	2008	Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.
國立臺灣大學	2008	A comparison of polymer composites for development of flexible sensor array	Shih, W.-P.; Lee, C.-L.; Lee, C.-W.; Tsao, L.-C.; Yang, Y.-J.; Fan, K.-C.
國立臺灣大學	2008	A comparison of polymer composites for development of flexible sensor array	Lee, C.-W.; Lee, C.-L.; Tsao, L.-C.; Shih, W.-P.; Fan, K.-C.
國立臺灣大學	2008	Porous nylon with electro-active dopants as flexible sensors and actuators	Yu, S.L.; Chang, Duo-Ru; Tsao, L.C.; Shih, Wen-Pin; Chang, Pei-Zen
國立臺灣大學	2007-01	A Large Area Temperature and Tactile Sensing Array	Yang, Y.-J.; Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Shih, W.-P.; Chang, F.-Y.; Chang, S.-H.; Fan, K.-C.
國立臺灣大學	2007	A large area temperature and tactile sensing array	Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Yang, Y.-J.; Shih, W.-P.; Chang, F.-Y.; Chang, S.-H.; Fan, K.-C.
國立臺灣大學	2007	Fabrication and characterization of electro-active polymer for flexible tactile sensing array	Tsao, L.-C.; Chang, D.-R.; Shih, W.-P.; Fan, K.-C.
國立臺灣大學	2007	Flexible temperature sensor array using electro-resistive polymer for humanoid artificial skin	Tsao, L.C.; Cheng, Ming-Yuan; Chen, I.L.; Shih, Wen-Pin; Yang, Yao-Joe Joseph; Chang, Fu-Yu; Fan, Kuang-Chao; Chang, Shuo-Hung
國立臺灣大學	2007	Self-aligned stylus with high sphericity for micro coordinate measurement	Tsai, Yao-Chuan; Chang, D.R.; Tsao, L.C.; Wu, Ming-Dao; Shih, Po-Jen; Shih, Wen-Pin
國立臺灣大學	2007	Design and fabrication of an artificial skin using PI-copper films	Cheng, Ming-Yuan; Chang, Wan-Yi; Tsao, L.-C.; Yang, S.-A.; Yang, Yao-Joe Joseph; Shih, Wen-Pin; Chang, Fu-Yu; Chang, Shuo-Hung; Fan, Kuang-Chao
臺大學術典藏	2007	Flexible temperature sensor array using electro-resistive pouymer for humanoid artificial skin	YAO-JOE YANG; Chang, S.-H.; Fan, K.-C.; Chang, F.-Y.; Yang, Y.-J.; Shih, W.-P.; Chen, L-L.; Tsao, L.-C.; Cheng, M.-Y.
國立臺灣大學	2006	Active Soldering of ITO to Copper	Chang, S. Y.; Lu, M. H.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2006	Characterization of pressure sensitive rubber for artificial skin of robotics	Cheng, C.-H.; Chang, F.-Y.; Tsao, L.-C.; Shih, W.-P.; Chang, S.-H.; Fan, K.-C.
國立臺灣大學	2006	Integrated temperature and tactile sensing arrays on a flexible substrate	Cheng, M.-Y.; Chang, W.-Y.; Tsao, L.-C.; Yang, S.-A.; Yang, Y.-J.; Shih, W.-P.; Chang, F.-Y.; Fan, K.-C.
國立臺灣大學	2003	Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy	Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2003	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Chang, S. Y.; Tsao, L. C.; Chiang, M. J.; Chuang, T. H.; Tung, C. N.; Pan, G. H.
臺大學術典藏	2003	Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler	Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG; Chiang, M.J.; Tsao, L.C.; Chang, S.Y.
國立臺灣大學	2002	Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals	Tsao, L. C.; Chiang, M. J.; Lin, W. H.; Cheng, M. D.; Chuang, T. H.
國立臺灣大學	2002	Evaluation of the Formability of Plastic/Zn22AI/Plastic Sandwiched Structures by Gas Blowing	Tsao, L. C.; Su, T. L.; Chuang, T. H.
國立臺灣大學	2002	Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements	Su, T. L.; Wang, S. S.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.; Yeh, M. S.
國立臺灣大學	2002	Brazeability of a 3003 Aluminum alloy with Al-Si-Cu-based filler metals	Tsao, L. C.; Weng, W. P.; Cheng, M. D.; Tsao, C. W.; Chuang, T. H.
國立臺灣大學	2002	Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2002	Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films	Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H.
國立臺灣大學	2001	Corrosion behavior of Al–Si–Cu–(Sn, Zn) brazing filler metals	Wang, S. S.; Cheng, M. D.; Tsao, L. C.; Chuang, T. H.
國立臺灣大學	2001	AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint	Chuang, T. H.; Huang, Y. T.; Tsao, L. C.
國立臺灣大學	2001	Evaluation of Superplastic Formability of the AZ31, Magnesium Alloy	Tsao, L. C.; Wu, C. F.; Chuang, T. H.
國立臺灣大學	2001	Surface Self-Cleaning Effect of Zn-22 Alloy during Superplastic Deformation	Chuang, T. H.; Tsao, L. C.
國立臺灣大學	2001	Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu Based Filler Metals	Tsao, L. C.; Tsai, T. C.; Wu, C. S.; Chuang, T. H.
國立臺灣大學	2001	The Ultra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material	Tsao, L. C.; Wang, S. S.; Yang, C. F.; Chuang, T. H.
臺大學術典藏	2001	AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint	ChuangTH; Huang, Y. T.; Tsao, L. C.; Chuang, T. H.; Chuang, T. H.; Huang, Y. T.; Tsao, L. C.
國立臺灣大學	2000	Evaluation of Low Temperature Superplastic Formability for Zn-22Ae Thin Sheets	Tsao, L. C.; Yeh, M. S.; Lo, C. J.; Wu, F. C.; Chuang, T. H.
國立臺灣大學	2000	Development of a low-melting-point filler metal for brazing aluminum alloys	Chuang, T. H.; Tsao, L. C.; Tsai, T. C.; Yeh, M. S.; Wu, C. S.
國立臺灣大學	2000	Effects of Microstructures on Corrosion and Stress Corrosion Behaviors of an Al-12.1 at.% Zn Alloy	Yeh, M. S.; Tsao, L. C.; Chuang, T. H.

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