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"tsao l c"的相關文件
顯示項目 31-40 / 81 (共9頁)
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| 臺大學術典藏 |
2018-06-28T22:23:24Z |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
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ChuangTH; Chang, S.Y.; Chung, Chien-Han; Tsao, L.C.; Chuang, T.H.; Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 臺大學術典藏 |
2018-06-28T22:11:27Z |
Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages
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Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH |
| 國立成功大學 |
2013-12 |
Formation of ultrafine structure in as cast Ti7CuXSn alloys
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Tsao, L. C.; Wu, R. W.; Wu, M. W.; Huang, C. H.; Chen, R. S. |
| 國立成功大學 |
2013-09 |
Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
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Tsao, L. C.; Wu, R. W.; Cheng, Te-Hsien; Fan, Kuo-Huan; Chen, R. S. |
| 國立成功大學 |
2012-05-30 |
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
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Tsao, L. C.; Huang, C. H.; Chung, C. H.; Chen, R. S. |
| 國立臺灣大學 |
2012 |
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
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Chuang, T.H.; Tsao, L.C.; Chung, Chien-Han; Chang, S.Y. |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
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Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
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Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
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