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Institution Date Title Author
臺北醫學大學 2010 Bond strength of orthodontic light-cured resin-modified glass ionomer cement CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang
臺北醫學大學 2011 Bond strength of orthodontic light-cured resin-modified glass ionomer cement CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang
臺北醫學大學 2011 Bond strength of orthodontic light-cured resin-modified glass ionomer cement Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN
臺北醫學大學 2010 Bond strength of orthodontic light-cured resin-modified glass ionomer cement Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN
大葉大學 2013-01 Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition. HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan
臺北醫學大學 2004 Bond strength of various bracket base designs 林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin
臺北醫學大學 2004 Bond strength of various bracket base designs 王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT
大葉大學 2013-10-19 Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain. Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang
國立臺灣大學 2003-10 Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP
臺大學術典藏 2018-09-10T04:25:44Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN
臺大學術典藏 2018-09-10T04:25:46Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE
臺大學術典藏 2018-09-10T04:25:50Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE
臺大學術典藏 2021-07-05T07:35:52Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P.
臺大學術典藏 2021-07-26T06:53:20Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN
臺大學術典藏 2021-07-05T03:41:30Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P.
國立成功大學 2008-03 Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon
國立成功大學 2001-01-05 Bond types of molecular orbitals and the photoelectron spectrum Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang
國立成功大學 2020 Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3 Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S.
國立成功大學 2016-01 Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures Lin, Wallace
國立臺灣科技大學 2017 Bond-slip responses of stainless reinforcing bars in grouted ducts Zhou, Y;Ou, Y.-C;Lee, G.C.
臺大學術典藏 2018-09-10T06:25:23Z Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues Kawakami, T. and Kamo, M. and Takamoto, K. and Miyazaki, K. and Chow, L.-P. and Ueno, Y. and Tsugita, A.; LU-PING CHOW
臺大學術典藏 2020-01-22T04:48:05Z Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues Kawakami T.; Kamo M.; Takamoto K.; Miyazaki K.; LU-PING CHOW; Ueno Y.; Tsugita A.
國立交通大學 2014-12-08T15:03:31Z BOND-STRUCTURE CHANGES OF LIQUID-PHASE DEPOSITED OXIDE (SIO2-XFX) ON N2 ANNEALING YEH, CF; CHEN, CL; LUR, W; YEN, PW
義守大學 2007-10 Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh
中華大學 2008 Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder 陳精一; Chen, Ching-I

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