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Showing items 227636-227660 of 2310639  (92426 Page(s) Totally)
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Institution Date Title Author
國立臺灣大學 2003 Bond Characteristics of Deformed Reinforcing Bars in Reactive Powder Concrete Chan, Y.W.; Chen, K.X.; Cheng, R.B.
國立臺灣大學 1997 Bond Characterization of Chromium?Fischer Carbene Complexes: A Combined Study of Experiment and Theory Wang, Chih-Chieh; Wang, Yu; Liu, Hui-Jean; Lin, Kuan-Jiuh; Chou, Liang-Kuei; Chan, Kin-Shing
國立臺灣大學 1999 Bond Characterization of Metal Squarate Complexes [MII(C4O4)(H2O)4; M = Fe, Co, Ni, Zn] Lee, Chi-Rung; Wang, Chih-Chieh; Chen, Ko-Chun; Lee, Gene-Hsiang; Wang, Yu
國立臺灣大學 2011 Bond Characterization on a Cr-Cr Quintuple Bond: A Combined Experimental and Theoretical Study Wu, Lai-Chin; Hsu, Chia-Wei; Chuang, Yu-Chun; Lee, Gene-Hsiang; Tsai, Yi-Chou; Wang, Yu
國立臺灣海洋大學 2003-06 Bond Degradation Due to The Desalination Process 張建智
臺大學術典藏 2018-09-10T15:00:11Z Bond distortion in GaPSb alloys studied by reciprocal space mapping and extended X-ray absorption fine structure C. Y. Tsai;M. C. Liu;Y. C. Chin;Z. C. Feng;H. H. Lin; C. Y. Tsai; M. C. Liu; Y. C. Chin; Z. C. Feng; H. H. Lin; HAO-HSIUNG LIN
臺大學術典藏 2021-05-13T06:27:02Z Bond energy effects on strength, cooperativity and robustness of molecular structures CHOU CHIA-CHING
國立交通大學 2014-12-08T15:46:05Z Bond length order parameter of conjugated polymers Lai, CM; Meng, HF
臺大學術典藏 2018-09-10T09:24:39Z Bond lengths and lattice structure of InP0.52Sb0.48 grown on GaAs C. J. Wu;Z. C. Feng;W. M. Chang;C. C. Yang;H. H. Lin; C. J. Wu; Z. C. Feng; W. M. Chang; C. C. Yang; H. H. Lin; HAO-HSIUNG LIN; CHIH-CHUNG YANG
淡江大學 1989-06 Bond lengths in Hg1-xCdxTe and II-VI diluted magnetic semiconductors Pong, Way-Faung; Mayanovic, Robert A.; Bunker, Bruce A.
朝陽科技大學 2022-01-01 Bond Load-Slip Behaviors of Strand Assemblies-in-Cement 許世宗
國立成功大學 2002-01 Bond orbital model with microscopic interface effects Chen, Chun-Nan; Wang, Yeong-Her; Houng, Mau-Phon; Chiang, Jih-Chen
國立中山大學 2002 Bond Orbital Mondel with Microscopic Interface Effects Chun-Nan Chen;Yeonng-Her Wang;Mou-Phon Houng;Jih-Chen Chiang
國立交通大學 2014-12-08T15:15:10Z Bond pad design with low capacitance in CMOS technology for RF applications Hsiao, Yuan-Wen; Ker, Ming-Dou
國立成功大學 2021-02-19 Bond Performance between Ultra-High Performance Concrete and High Strength Steel using Pull-out tests 沙瓦瑪; Kumar, Sarah Ravi
臺大學術典藏 2003 Bond Price Volatility Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
臺大學術典藏 2004 Bond Price Volatility Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
國立臺灣大學 2003 Bond Price Volatility Lyuu, Yuh-Dauh
國立臺灣大學 2004 Bond Price Volatility Lyuu, Yuh-Dauh
朝陽科技大學 2023-08-18 BOND RESISTANCE OF REPAIRED CRACKED-CONCRETE EMBEDDED WITH REBAR IN VARYING SIZE UNDER CYCLIC LOAD 干裕成; KAN, YU-CHENG; PEI, KUANG-CHIH
國立臺灣大學 1986 Bond Selective Photochemistry in CH2BrI Through Electronic Excitation at 210 nm Butler, L. J.; Hintsa, E. J.; 李遠哲; Butler, L. J.; Hintsa, E. J.; Lee, Yuan-Tseh
國立成功大學 2005-12 Bond strength and debonding characteristics of a new ceramic bracket Liu, Jia-Kuang; Chung, Ching-Hung; Chang, Chuan-Yang; hieh, Dar-Bin
大葉大學 2007-11 Bond strength of binary Ti-Cr alloys to porcelain Hsu, H.C.;Chiang, T.Y.;Wu, S.C.;Lin, H.C.;Ho, W.F.
臺北醫學大學 2006 Bond strength of light curing composite resin with various lights. 王蔚南; Hwang SD; Teng CM; Tsai NC; Hwang HM; Wang WN;
臺北醫學大學 2006 Bond strength of light curing composite resin with various lights.In press. 鄧乃嘉; 李勝揚; 蔡志孟; Hwang SD; Teng NC; Tsai CM; Hwang HM; Wang WN;

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