| 國立高雄大學 |
2012-08-14 |
BOM製作與MRP流程優化之研究：以C公司為例
|
蔡青松 |
| 育達科技大學 |
2006 |
BOM進銷存管理系統 : 以PC組裝為例
|
朱桂慶;高啟堯;陳永展;許敦凱;張禹平;莊維鵬 |
| 育達商業科技大學 |
2006/12/1 |
BOM進銷存管理系統-以PC組裝為例
|
朱桂慶;高啟堯;陳永展;許敦凱;張禹平;莊維鵬 |
| 國立政治大學 |
2009 |
Bon Marche: Sustaining technology-use and organizing principles of market-making
|
蕭瑞麟 |
| 國立臺灣科技大學 |
2011-05-20 |
Bon Voyage
|
鄭慈勻 |
| 致理技術學院 |
2018-05 |
Bon Voyage Caf'e 企劃案
|
邱昱慈; 王羿婷; 黃姵穎; 蘇富真; 童郁晴 |
| 朝陽科技大學 |
2019-02-25 |
Bond Behavior of Low-activated High Aluminate Concrete with Reinforcement under Cyclic Load
|
干裕成 |
| 國立臺灣大學 |
2003 |
Bond Characteristics of Deformed Reinforcing Bars in Reactive Powder Concrete
|
Chan, Y.W.; Chen, K.X.; Cheng, R.B. |
| 國立臺灣大學 |
1997 |
Bond Characterization of Chromium?Fischer Carbene Complexes: A Combined Study of Experiment and Theory
|
Wang, Chih-Chieh; Wang, Yu; Liu, Hui-Jean; Lin, Kuan-Jiuh; Chou, Liang-Kuei; Chan, Kin-Shing |
| 國立臺灣大學 |
1999 |
Bond Characterization of Metal Squarate Complexes [MII(C4O4)(H2O)4; M = Fe, Co, Ni, Zn]
|
Lee, Chi-Rung; Wang, Chih-Chieh; Chen, Ko-Chun; Lee, Gene-Hsiang; Wang, Yu |
| 國立臺灣大學 |
2011 |
Bond Characterization on a Cr-Cr Quintuple Bond: A Combined Experimental and Theoretical Study
|
Wu, Lai-Chin; Hsu, Chia-Wei; Chuang, Yu-Chun; Lee, Gene-Hsiang; Tsai, Yi-Chou; Wang, Yu |
| 國立臺灣海洋大學 |
2003-06 |
Bond Degradation Due to The Desalination Process
|
張建智 |
| 臺大學術典藏 |
2018-09-10T15:00:11Z |
Bond distortion in GaPSb alloys studied by reciprocal space mapping and extended X-ray absorption fine structure
|
C. Y. Tsai;M. C. Liu;Y. C. Chin;Z. C. Feng;H. H. Lin; C. Y. Tsai; M. C. Liu; Y. C. Chin; Z. C. Feng; H. H. Lin; HAO-HSIUNG LIN |
| 臺大學術典藏 |
2021-05-13T06:27:02Z |
Bond energy effects on strength, cooperativity and robustness of molecular structures
|
CHOU CHIA-CHING |
| 國立交通大學 |
2014-12-08T15:46:05Z |
Bond length order parameter of conjugated polymers
|
Lai, CM; Meng, HF |
| 臺大學術典藏 |
2018-09-10T09:24:39Z |
Bond lengths and lattice structure of InP0.52Sb0.48 grown on GaAs
|
C. J. Wu;Z. C. Feng;W. M. Chang;C. C. Yang;H. H. Lin; C. J. Wu; Z. C. Feng; W. M. Chang; C. C. Yang; H. H. Lin; HAO-HSIUNG LIN; CHIH-CHUNG YANG |
| 淡江大學 |
1989-06 |
Bond lengths in Hg1-xCdxTe and II-VI diluted magnetic semiconductors
|
Pong, Way-Faung; Mayanovic, Robert A.; Bunker, Bruce A. |
| 朝陽科技大學 |
2022-01-01 |
Bond Load-Slip Behaviors of Strand Assemblies-in-Cement
|
許世宗 |
| 國立成功大學 |
2002-01 |
Bond orbital model with microscopic interface effects
|
Chen, Chun-Nan; Wang, Yeong-Her; Houng, Mau-Phon; Chiang, Jih-Chen |
| 國立中山大學 |
2002 |
Bond Orbital Mondel with Microscopic Interface Effects
|
Chun-Nan Chen;Yeonng-Her Wang;Mou-Phon Houng;Jih-Chen Chiang |
| 國立交通大學 |
2014-12-08T15:15:10Z |
Bond pad design with low capacitance in CMOS technology for RF applications
|
Hsiao, Yuan-Wen; Ker, Ming-Dou |
| 國立成功大學 |
2021-02-19 |
Bond Performance between Ultra-High Performance Concrete and High Strength Steel using Pull-out tests
|
沙瓦瑪; Kumar, Sarah Ravi |
| 臺大學術典藏 |
2003 |
Bond Price Volatility
|
Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh |
| 臺大學術典藏 |
2004 |
Bond Price Volatility
|
Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh |
| 國立臺灣大學 |
2003 |
Bond Price Volatility
|
Lyuu, Yuh-Dauh |
| 國立臺灣大學 |
2004 |
Bond Price Volatility
|
Lyuu, Yuh-Dauh |
| 朝陽科技大學 |
2023-08-18 |
BOND RESISTANCE OF REPAIRED CRACKED-CONCRETE EMBEDDED WITH REBAR IN VARYING SIZE UNDER CYCLIC LOAD
|
干裕成; KAN, YU-CHENG; PEI, KUANG-CHIH |
| 國立臺灣大學 |
1986 |
Bond Selective Photochemistry in CH2BrI Through Electronic Excitation at 210 nm
|
Butler, L. J.; Hintsa, E. J.; 李遠哲; Butler, L. J.; Hintsa, E. J.; Lee, Yuan-Tseh |
| 國立成功大學 |
2005-12 |
Bond strength and debonding characteristics of a new ceramic bracket
|
Liu, Jia-Kuang; Chung, Ching-Hung; Chang, Chuan-Yang; hieh, Dar-Bin |
| 大葉大學 |
2007-11 |
Bond strength of binary Ti-Cr alloys to porcelain
|
Hsu, H.C.;Chiang, T.Y.;Wu, S.C.;Lin, H.C.;Ho, W.F. |
| 臺北醫學大學 |
2006 |
Bond strength of light curing composite resin with various lights.
|
王蔚南; Hwang SD; Teng CM; Tsai NC; Hwang HM; Wang WN; |
| 臺北醫學大學 |
2006 |
Bond strength of light curing composite resin with various lights.In press.
|
鄧乃嘉; 李勝揚; 蔡志孟; Hwang SD; Teng NC; Tsai CM; Hwang HM; Wang WN; |
| 臺北醫學大學 |
2005 |
Bond strength of light-cured composite resin using various light sources
|
黃豪銘; Hwang SD; Tsai CM; Teng NC; Huang HM; Lee SY; Wang WN |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 大葉大學 |
2013-01 |
Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition.
|
HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT |
| 大葉大學 |
2013-10-19 |
Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain.
|
Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang |
| 國立臺灣大學 |
2003-10 |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP |
| 臺大學術典藏 |
2018-09-10T04:25:44Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN |
| 臺大學術典藏 |
2018-09-10T04:25:46Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE |
| 臺大學術典藏 |
2018-09-10T04:25:50Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE |
| 臺大學術典藏 |
2021-07-05T07:35:52Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 臺大學術典藏 |
2021-07-26T06:53:20Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN |
| 臺大學術典藏 |
2021-07-05T03:41:30Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 國立成功大學 |
2008-03 |
Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation
|
Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2001-01-05 |
Bond types of molecular orbitals and the photoelectron spectrum
|
Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang |
