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Institution Date Title Author
國立中山大學 2002 Bond Orbital Mondel with Microscopic Interface Effects Chun-Nan Chen;Yeonng-Her Wang;Mou-Phon Houng;Jih-Chen Chiang
國立交通大學 2014-12-08T15:15:10Z Bond pad design with low capacitance in CMOS technology for RF applications Hsiao, Yuan-Wen; Ker, Ming-Dou
國立成功大學 2021-02-19 Bond Performance between Ultra-High Performance Concrete and High Strength Steel using Pull-out tests 沙瓦瑪; Kumar, Sarah Ravi
臺大學術典藏 2003 Bond Price Volatility Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
臺大學術典藏 2004 Bond Price Volatility Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
國立臺灣大學 2003 Bond Price Volatility Lyuu, Yuh-Dauh
國立臺灣大學 2004 Bond Price Volatility Lyuu, Yuh-Dauh
朝陽科技大學 2023-08-18 BOND RESISTANCE OF REPAIRED CRACKED-CONCRETE EMBEDDED WITH REBAR IN VARYING SIZE UNDER CYCLIC LOAD 干裕成; KAN, YU-CHENG; PEI, KUANG-CHIH
國立臺灣大學 1986 Bond Selective Photochemistry in CH2BrI Through Electronic Excitation at 210 nm Butler, L. J.; Hintsa, E. J.; 李遠哲; Butler, L. J.; Hintsa, E. J.; Lee, Yuan-Tseh
國立成功大學 2005-12 Bond strength and debonding characteristics of a new ceramic bracket Liu, Jia-Kuang; Chung, Ching-Hung; Chang, Chuan-Yang; hieh, Dar-Bin
大葉大學 2007-11 Bond strength of binary Ti-Cr alloys to porcelain Hsu, H.C.;Chiang, T.Y.;Wu, S.C.;Lin, H.C.;Ho, W.F.
臺北醫學大學 2006 Bond strength of light curing composite resin with various lights. 王蔚南; Hwang SD; Teng CM; Tsai NC; Hwang HM; Wang WN;
臺北醫學大學 2006 Bond strength of light curing composite resin with various lights.In press. 鄧乃嘉; 李勝揚; 蔡志孟; Hwang SD; Teng NC; Tsai CM; Hwang HM; Wang WN;
臺北醫學大學 2005 Bond strength of light-cured composite resin using various light sources 黃豪銘; Hwang SD; Tsai CM; Teng NC; Huang HM; Lee SY; Wang WN
臺北醫學大學 2010 Bond strength of orthodontic light-cured resin-modified glass ionomer cement CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang
臺北醫學大學 2011 Bond strength of orthodontic light-cured resin-modified glass ionomer cement CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang
臺北醫學大學 2011 Bond strength of orthodontic light-cured resin-modified glass ionomer cement Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN
臺北醫學大學 2010 Bond strength of orthodontic light-cured resin-modified glass ionomer cement Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN
大葉大學 2013-01 Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition. HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan
臺北醫學大學 2004 Bond strength of various bracket base designs 林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin
臺北醫學大學 2004 Bond strength of various bracket base designs 王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT
大葉大學 2013-10-19 Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain. Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang
國立臺灣大學 2003-10 Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP
臺大學術典藏 2018-09-10T04:25:44Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN
臺大學術典藏 2018-09-10T04:25:46Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE
臺大學術典藏 2018-09-10T04:25:50Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE
臺大學術典藏 2021-07-05T07:35:52Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P.
臺大學術典藏 2021-07-26T06:53:20Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN
臺大學術典藏 2021-07-05T03:41:30Z Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P.
國立成功大學 2008-03 Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon
國立成功大學 2001-01-05 Bond types of molecular orbitals and the photoelectron spectrum Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang
國立成功大學 2020 Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3 Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S.
國立成功大學 2016-01 Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures Lin, Wallace
國立臺灣科技大學 2017 Bond-slip responses of stainless reinforcing bars in grouted ducts Zhou, Y;Ou, Y.-C;Lee, G.C.
臺大學術典藏 2018-09-10T06:25:23Z Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues Kawakami, T. and Kamo, M. and Takamoto, K. and Miyazaki, K. and Chow, L.-P. and Ueno, Y. and Tsugita, A.; LU-PING CHOW
臺大學術典藏 2020-01-22T04:48:05Z Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues Kawakami T.; Kamo M.; Takamoto K.; Miyazaki K.; LU-PING CHOW; Ueno Y.; Tsugita A.
國立交通大學 2014-12-08T15:03:31Z BOND-STRUCTURE CHANGES OF LIQUID-PHASE DEPOSITED OXIDE (SIO2-XFX) ON N2 ANNEALING YEH, CF; CHEN, CL; LUR, W; YEN, PW
義守大學 2007-10 Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh
中華大學 2008 Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder 陳精一; Chen, Ching-I
國立臺灣大學 2000 Bonded Amalgam Restorations: Using a Glass-Ionomer as an Adhesive Liner 陳瑞松; 林俊彬; CHEN, RUEY-SONG; LIN, CHUN-PIN
臺大學術典藏 2018-09-10T03:24:21Z Bonded amalgam restorations: using a glass-ionomer as an adhesive liner. CHUN-PIN LIN; Chen, R.S.;Liu, C.C.;Cheng, M.R.;Lin, C.P.
臺大學術典藏 2021-07-26T06:53:24Z Bonded amalgam restorations: using a glass-ionomer as an adhesive liner. Chen R.S.; Liu C.C.; Cheng M.R.; CHUN-PIN LIN
國立交通大學 2014-12-08T15:10:06Z Bonding anisotropy in multiferroic TbMnO(3) probed by polarization dependent x-ray absorption spectroscopy Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.
國立臺灣大學 2009-01 Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R.S.
國立交通大學 2019-04-02T05:59:44Z Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.
臺大學術典藏 2018-09-10T07:28:09Z Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.; Chen, J. M.; RU-SHI LIUet al.
國立臺灣大學 2011 Bonding between Chromium Atoms in Metal-String Complexes from Raman Spectra and Surface-Enhanced Raman Scattering: Vibrational Frequency of the Chromium Quadruple Bond Huang, Yu-Min; Tsai, Huei-Ru; Lai, Szu-Hsueh; Lee, Sheng Jui; Chen, I-Chia; Huang, Cheng Liang; Peng, Shie-Ming; Wang, Wen-Zhen
臺大學術典藏 2018-09-10T08:38:27Z Bonding between chromium atoms in metal-string complexes from Raman spectra and surface-enhanced Raman scattering: Vibrational frequency of the chromium quadruple bond Huang, Y.-M.;Tsai, H.-R.;Lai, S.-H.;Lee, S.J.;Chen, I.-C.;Huang, C.L.;Peng, S.-M.;Wang, W.-Z.; Huang, Y.-M.; Tsai, H.-R.; Lai, S.-H.; Lee, S.J.; Chen, I.-C.; Huang, C.L.; Peng, S.-M.; Wang, W.-Z.; SHIE-MING PENG
臺北醫學大學 1995 Bonding Characteristic of CD Spinal Instrumentation Component 黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M.
國立臺灣海洋大學 2018-05 Bonding characteristics and chemical inertness of Zr–Si–N coatings with a high Si content in glass molding Li-Chun Chang; Yu-Zhe Zheng; Yung-I Chen; Shan-Chun Chang; Bo-Wei Liu

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