| 臺大學術典藏 |
2021-07-26T06:53:24Z |
Bonded amalgam restorations: using a glass-ionomer as an adhesive liner.
|
Chen R.S.; Liu C.C.; Cheng M.R.; CHUN-PIN LIN |
| 國立交通大學 |
2014-12-08T15:10:06Z |
Bonding anisotropy in multiferroic TbMnO(3) probed by polarization dependent x-ray absorption spectroscopy
|
Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z. |
| 國立臺灣大學 |
2009-01 |
Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy
|
Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R.S. |
| 國立交通大學 |
2019-04-02T05:59:44Z |
Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy
|
Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z. |
| 臺大學術典藏 |
2018-09-10T07:28:09Z |
Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy
|
Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.; Chen, J. M.; RU-SHI LIUet al. |
| 國立臺灣大學 |
2011 |
Bonding between Chromium Atoms in Metal-String Complexes from Raman Spectra and Surface-Enhanced Raman Scattering: Vibrational Frequency of the Chromium Quadruple Bond
|
Huang, Yu-Min; Tsai, Huei-Ru; Lai, Szu-Hsueh; Lee, Sheng Jui; Chen, I-Chia; Huang, Cheng Liang; Peng, Shie-Ming; Wang, Wen-Zhen |
| 臺大學術典藏 |
2018-09-10T08:38:27Z |
Bonding between chromium atoms in metal-string complexes from Raman spectra and surface-enhanced Raman scattering: Vibrational frequency of the chromium quadruple bond
|
Huang, Y.-M.;Tsai, H.-R.;Lai, S.-H.;Lee, S.J.;Chen, I.-C.;Huang, C.L.;Peng, S.-M.;Wang, W.-Z.; Huang, Y.-M.; Tsai, H.-R.; Lai, S.-H.; Lee, S.J.; Chen, I.-C.; Huang, C.L.; Peng, S.-M.; Wang, W.-Z.; SHIE-MING PENG |
| 臺北醫學大學 |
1995 |
Bonding Characteristic of CD Spinal Instrumentation Component
|
黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立臺灣海洋大學 |
2018-05 |
Bonding characteristics and chemical inertness of Zr–Si–N coatings with a high Si content in glass molding
|
Li-Chun Chang; Yu-Zhe Zheng; Yung-I Chen; Shan-Chun Chang; Bo-Wei Liu |
| 國立臺灣大學 |
2001-01 |
Bonding Characterization and Nano-indentation Study of Amorphous SiCxNy Films with and without Hydrogen Incorporation
|
Lo, H. C.; Wu, J.-J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C. |
| 國立臺灣科技大學 |
2001 |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
K.H. Chen;L.C. Chen;S.T. Lin;H.C. Lo;C.Y. Wen;T.S. Wong;J.J. Wu |
| 臺大學術典藏 |
2020-01-06T03:11:08Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
Lo, H. C.; Wu, J. J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C.; SHIANG-TAI LIN |
| 臺大學術典藏 |
2022-08-09T03:50:44Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; LI-CHYONG CHEN |
| 國立臺灣大學 |
2002-11 |
Bonding Characterization, Density Measurement and Thermal Diffusivity Studies of Amorphous Silicon Carbon Nitride and Boron Carbon Nitride Thin Films
|
Chattopadhyay S; Chen LC; Chien SC |
| 臺大學術典藏 |
2020-01-06T03:11:07Z |
Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films
|
Chattopadhyay, S.; Chen, L. C.; Chien, S. C.; Lin, S. T.; Chen, K. H.; SHIANG-TAI LIN |
| 朝陽科技大學 |
2010 |
BONDING FRACTIONATION OF ANIONIC / CATIONIC CHROMIUM IN SOIL AND INFLUENCE OF pH ON SOIL WASHING EFFICIENCY
|
章日行; S. F. Cheng; Y. T. Tu; C. M. Kao; J. H. Chang; C. Y. Huang ; C.W. Chen |
| 國立成功大學 |
2000-08-18 |
Bonding geometry and reactivity of methoxy and ethoxy groups adsorbed on powdered TiO2
|
Wu, Wen-Chun; Chuang, Chih-Chung; Lin, Jong-Liang |
| 臺大學術典藏 |
2003 |
Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4)
|
Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures
|
Liu, PC; Wu, YCS |
| 臺北醫學大學 |
1994 |
Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations
|
黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
|
Chen Kuan-Neng; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-16T06:15:00Z |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
|
CHEN KUAN-NENG; Hsu Sheng-Yao |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen, Guan Ren; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:27:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:56Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 國立成功大學 |
2009-11 |
Bonding of a complicated polymer microchannel system for study of pressurized liquid flow characteristics with the electric double effect
|
Ko, H. S.; Gau, C. |
| 臺大學術典藏 |
2019-11-27T02:02:19Z |
Bonding of copper pillars using electroless Au plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A.; Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:13Z |
Bonding of Copper Pillars Using Electroless Cu Plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y.; Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:24Z |
Bonding of copper pillars using electroless Ni plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO |
| 國立臺灣大學 |
1992-05 |
Bonding of Structural Plywood with PMF System
|
蔡金木; Tsai, Ching-Mu |
| 中國文化大學 |
2012-11 |
Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters
|
Hung, YM (Hung, Yu-Ming); Ho, GM (Ho, Gong-Ming); Zhang, ZF (Zhang, Zhen-Feng) |
| 中國文化大學 |
2012-09-19 |
Bonding Properties and Isomeric Conversion Pathways from Exohedral to Endohedral BeGe8 Clusters
|
Hung, Yu-Ming; Ho, Gong-Ming; Zhang, Zhen-Feng |
| 中國文化大學 |
2012 |
Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters
|
洪祐明等著 |
| 中國文化大學 |
2012 |
Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters
|
洪祐明 |
| 中國文化大學 |
2013-03-15 |
Bonding properties and isomeric conversion pathways of singlet BeSi4 clusters
|
Hung, YM (Hung, Yu-Ming); Chen, SS (Chen, Shih-Sun); Huang, YC (Huang, Yen-Chang) |
| 淡江大學 |
2005-04-18 |
Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy
|
Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; 彭維鋒; Pong, W. F.; Tsai, M. H.; Jong, C. A.; Chin, T. S. |
| 淡江大學 |
2005-04 |
Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy
|
Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; Pong, W. F.; Tsai, M.-H.; Jong, C. A.; Chin, T. S. |
| 國立中山大學 |
2005 |
Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy
|
J.C. Jan;P.D. Babu;H.M. Tsai;C.W. Pao;J.W. Chiou;S.C. Ray;K.P. Krishna Kumar;W.F. Pong;M.H. Tsai;C.A. Jong;T.S. Chin |
| 高雄醫學大學 |
1998 |
Bonding properties of permanent soft lining materials
|
洪純正 |
| 國立政治大學 |
2004-05 |
Bonding Shirking and Adverse Selection
|
林忠正 |
| 大葉大學 |
2008-02 |
Bonding Strength of Dental Ti-Zr Alloys to Dental Porcelain
|
HO, WEN-FU;Hsu, H.C.;Chen, W.K.;Wu, S.C. |
| 元智大學 |
2010-10 |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
|
Guan-Wei Wu; Wen-Pin Shih; Chung-Yuen Hui; Sih-Li Chen; Chi-Yuan Lee |
| 國立臺灣大學 |
2010 |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
|
Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan |
| 臺大學術典藏 |
2018-09-10T08:11:13Z |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
|
Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH;Lee, C.-Y.;Chen, S.-L.;Hui, C.-Y.;Shih, W.-P.;Wu, G.-W.;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan; Wu, G.-W.; Shih, W.-P.; Hui, C.-Y.; Chen, S.-L.; Lee, C.-Y.; WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan |
| 大葉大學 |
2009-02 |
Bonding strength of Ti-20Cr and Ti-10Zr alloys to dental porcelain.
|
Wu, S.C.;HO, WEN-FU;Lin, H.C.;Kikuchi, H.;Hsu, H.C. |
| 國立成功大學 |
2011-12-01 |
Bonding Structure, Dehydrogenation, and Dimerization of 1,3-C(6)H(4) from Decomposition of 1,3-C(6)H(4)I(2) on Cu(100)
|
Liao, Yung-Hsuan; Lin, Yi-Shiue; Wu, Tz-Shiuan; Lin, Shu-Kuan; Lin, Jong-Liang; Fan, Liang-Jen; Yang, Yaw-Wen; Lin, Jiing-Chyuan |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
