| 國立臺灣大學 |
2011 |
Bonding between Chromium Atoms in Metal-String Complexes from Raman Spectra and Surface-Enhanced Raman Scattering: Vibrational Frequency of the Chromium Quadruple Bond
|
Huang, Yu-Min; Tsai, Huei-Ru; Lai, Szu-Hsueh; Lee, Sheng Jui; Chen, I-Chia; Huang, Cheng Liang; Peng, Shie-Ming; Wang, Wen-Zhen |
| 臺大學術典藏 |
2018-09-10T08:38:27Z |
Bonding between chromium atoms in metal-string complexes from Raman spectra and surface-enhanced Raman scattering: Vibrational frequency of the chromium quadruple bond
|
Huang, Y.-M.;Tsai, H.-R.;Lai, S.-H.;Lee, S.J.;Chen, I.-C.;Huang, C.L.;Peng, S.-M.;Wang, W.-Z.; Huang, Y.-M.; Tsai, H.-R.; Lai, S.-H.; Lee, S.J.; Chen, I.-C.; Huang, C.L.; Peng, S.-M.; Wang, W.-Z.; SHIE-MING PENG |
| 臺北醫學大學 |
1995 |
Bonding Characteristic of CD Spinal Instrumentation Component
|
黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立臺灣海洋大學 |
2018-05 |
Bonding characteristics and chemical inertness of Zr–Si–N coatings with a high Si content in glass molding
|
Li-Chun Chang; Yu-Zhe Zheng; Yung-I Chen; Shan-Chun Chang; Bo-Wei Liu |
| 國立臺灣大學 |
2001-01 |
Bonding Characterization and Nano-indentation Study of Amorphous SiCxNy Films with and without Hydrogen Incorporation
|
Lo, H. C.; Wu, J.-J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C. |
| 國立臺灣科技大學 |
2001 |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
K.H. Chen;L.C. Chen;S.T. Lin;H.C. Lo;C.Y. Wen;T.S. Wong;J.J. Wu |
| 臺大學術典藏 |
2020-01-06T03:11:08Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
Lo, H. C.; Wu, J. J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C.; SHIANG-TAI LIN |
| 臺大學術典藏 |
2022-08-09T03:50:44Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; LI-CHYONG CHEN |
| 國立臺灣大學 |
2002-11 |
Bonding Characterization, Density Measurement and Thermal Diffusivity Studies of Amorphous Silicon Carbon Nitride and Boron Carbon Nitride Thin Films
|
Chattopadhyay S; Chen LC; Chien SC |
| 臺大學術典藏 |
2020-01-06T03:11:07Z |
Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films
|
Chattopadhyay, S.; Chen, L. C.; Chien, S. C.; Lin, S. T.; Chen, K. H.; SHIANG-TAI LIN |
| 朝陽科技大學 |
2010 |
BONDING FRACTIONATION OF ANIONIC / CATIONIC CHROMIUM IN SOIL AND INFLUENCE OF pH ON SOIL WASHING EFFICIENCY
|
章日行; S. F. Cheng; Y. T. Tu; C. M. Kao; J. H. Chang; C. Y. Huang ; C.W. Chen |
| 國立成功大學 |
2000-08-18 |
Bonding geometry and reactivity of methoxy and ethoxy groups adsorbed on powdered TiO2
|
Wu, Wen-Chun; Chuang, Chih-Chung; Lin, Jong-Liang |
| 臺大學術典藏 |
2003 |
Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4)
|
Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures
|
Liu, PC; Wu, YCS |
| 臺北醫學大學 |
1994 |
Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations
|
黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
|
Chen Kuan-Neng; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-16T06:15:00Z |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
|
CHEN KUAN-NENG; Hsu Sheng-Yao |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen, Guan Ren; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:27:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:56Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
| 國立成功大學 |
2009-11 |
Bonding of a complicated polymer microchannel system for study of pressurized liquid flow characteristics with the electric double effect
|
Ko, H. S.; Gau, C. |
| 臺大學術典藏 |
2019-11-27T02:02:19Z |
Bonding of copper pillars using electroless Au plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A.; Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:13Z |
Bonding of Copper Pillars Using Electroless Cu Plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y.; Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:24Z |
Bonding of copper pillars using electroless Ni plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO |
