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Showing items 229861-229870 of 2348617 (234862 Page(s) Totally)
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| 國立政治大學 |
2004-05 |
Bonding Shirking and Adverse Selection
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林忠正 |
| 大葉大學 |
2008-02 |
Bonding Strength of Dental Ti-Zr Alloys to Dental Porcelain
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HO, WEN-FU;Hsu, H.C.;Chen, W.K.;Wu, S.C. |
| 元智大學 |
2010-10 |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
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Guan-Wei Wu; Wen-Pin Shih; Chung-Yuen Hui; Sih-Li Chen; Chi-Yuan Lee |
| 國立臺灣大學 |
2010 |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
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Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan |
| 臺大學術典藏 |
2018-09-10T08:11:13Z |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
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Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH;Lee, C.-Y.;Chen, S.-L.;Hui, C.-Y.;Shih, W.-P.;Wu, G.-W.;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan; Wu, G.-W.; Shih, W.-P.; Hui, C.-Y.; Chen, S.-L.; Lee, C.-Y.; WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan |
| 大葉大學 |
2009-02 |
Bonding strength of Ti-20Cr and Ti-10Zr alloys to dental porcelain.
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Wu, S.C.;HO, WEN-FU;Lin, H.C.;Kikuchi, H.;Hsu, H.C. |
| 國立成功大學 |
2011-12-01 |
Bonding Structure, Dehydrogenation, and Dimerization of 1,3-C(6)H(4) from Decomposition of 1,3-C(6)H(4)I(2) on Cu(100)
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Liao, Yung-Hsuan; Lin, Yi-Shiue; Wu, Tz-Shiuan; Lin, Shu-Kuan; Lin, Jong-Liang; Fan, Liang-Jen; Yang, Yaw-Wen; Lin, Jiing-Chyuan |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
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Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
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Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
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Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
Showing items 229861-229870 of 2348617 (234862 Page(s) Totally)
<< < 22982 22983 22984 22985 22986 22987 22988 22989 22990 22991 > >>
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