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Institution Date Title Author
臺大學術典藏 2022-03-22T08:28:39Z Crack behavior in nacre-like composites: A phase-field method Tsai H.-C;Chen C.-H;Shu Y.-C.; Tsai H.-C; Chen C.-H; Shu Y.-C.; YI-CHUNG SHU
臺大學術典藏 2022-03-22T08:31:43Z Crack behavior in nacre-like composites: A phase-field method Tsai H.-C;Chen C.-H;Shu Y.-C.; Tsai H.-C; Chen C.-H; Shu Y.-C.; YI-CHUNG SHU
臺大學術典藏 2022-03-22T08:31:45Z Crack behavior in nacre-like composites: A phase-field method Tsai H.-C;Chen C.-H;Shu Y.-C.; Tsai H.-C; Chen C.-H; Shu Y.-C.; YI-CHUNG SHU
國立中山大學 1981 Crack Closure and Crack Propagation Rates in 7050 Aluminum D. Gan;J. Weertman
美和科技大學 2018-09-03 Crack Detection for Metal Injection Molded Parts Wang1, Hsing-Meng;Wu, Pei-Hsuan;Lee, Wen-Tzong
國立臺灣大學 2002 Crack detection for the graphite slab using the high-Tc SQUID in unshielded environment Jeng, Jen-Tzong; Horng, Herng-Er; Yang, Hong-Chang
國立交通大學 2014-12-08T15:21:54Z Crack detection in photovoltaic cells by interferometric analysis of electronic speckle patterns Wen, Tzu-Kuei; Yin, Ching-Chung
國立交通大學 2014-12-08T15:25:08Z Crack detection in photovoltaic cells using electronic speckle pattern interferometry Wen, Tzu-Kuei; Yin, Ching-Chung
元智大學 Jan-16 Crack detection in randomly textured surfaces using spiral search Du-Ming Tsai; Y. J. Xie
淡江大學 2013-09 Crack Filling of Cover Glasses by Sol-gel Coatings Ma, Kung-Jeng; Chien, Hsi-Hsin; Huang, Su-Wei; Chen, Shi-Chang; Chao, Choung-Lii
國立成功大學 2018-06 Crack Formation and Corrosion Behavior of 6061 Al Alloy in Sulfuric Acid Chung;I-Chun;Chung;Chen-Kuei;Su;Yan-Kuin
國立成功大學 2018 Crack Formation and Corrosion Behavior of 6061 Al Alloy in Sulfuric Acid [6061鋁合金於硫酸溶液中進行陽極氧化處理的薄膜裂痕形成與耐腐蝕行為之研究] Chung, I.-C.;Chung, Chung C.-K.;Su, Y.-K.
國立中山大學 1999 Crack Formation Mechanism in Laser-Welded Au-Coated Invar Materials for Semiconductor Laser Packages J.K. Kuang; M.T. Sheen; S.C. Wang; C.H. Chen; W.H. Cheng
國立中山大學 1999 Crack Formation Mechanism in Laser-Welded Au-Coated Invar Materials for Semiconductor Laser Packaging J.H. Kuang; M.T. Sheen; S.C. Wang; C.H. Chen; W.H. Cheng
國立中山大學 2009 Crack formation on Pd-plated Cu wire/Al Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學 2009 Crack formation on Pd-plated Cu wire/Al pad interface Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立成功大學 1999-08 Crack growth prediction by manifold method Tsay, Ren-Jow; Chiou, Yaw-Jeng; Chuang, Wai-Lin
國立成功大學 2000-02-29 Crack growth resistance of Cr3C2/Al2O3 composites Huang, Jow-Lay; Lin, Ho-Don; Jeng, Ching-An; Lii, Ding-Fwu
臺大學術典藏 2022-01-07T02:14:50Z Crack Growth Simulation and Residual Strength Prediction in Airplane Fuselages Chen; C.-S.; Wawrzynek; P.A.; and Ingraffea; A. R.; CHUIN-SHAN CHEN
大葉大學 2003-06 Crack Identification of a Beam on Measurements of Natural Frequencies Ping, Lin Hai
大葉大學 2003-12 Crack Identification of a Rod from Measurements of Natural Frequencies Lin, Hai-Ping
國立臺灣大學 2011 Crack Induced Self-Assembled Grooves for Liquid Crystal Molecules Alignment Lin, Tzu-Chieh; Huang, Li-Chen; Chou, Tsu-Ruey; Chao, Chih-Yu
臺大學術典藏 2018-09-10T08:36:31Z Crack induced self-assembled grooves for liquid crystal molecules alignment Lin, T.-C.;Huang, L.-C.;Chou, T.-R.;Chao, C.-Y.; Lin, T.-C.; Huang, L.-C.; Chou, T.-R.; Chao, C.-Y.; CHIH-YU CHAO
臺大學術典藏 2019-12-19T08:38:22Z Crack induced self-assembled grooves for liquid crystal molecules alignment Lin, T.-C.;Huang, L.-C.;Chou, T.-R.;Chao, C.-Y.; Lin, T.-C.; Huang, L.-C.; Chou, T.-R.; Chao, C.-Y.; CHIH-YU CHAO
國立臺灣大學 1992-03 Crack Initiation and Propagation of Austempered Ductile Iron and Its Properties Weng, B. J.; 張順太; Liu H. N.; 許樹恩; Weng, B. J.; Chang, Shun-Tai; Liu H. N.; Hsu, Shu-En
國立臺灣大學 1992-03 Crack Initiation and Propagation of SiC-fiber Reinforced Aluminum Composites Weng, B. J.; 張順太; 許樹恩; Weng, B. J.; Chang, Shun-Tai; Hsu, Shu-En
國立中山大學 1995 Crack Initiation Direction for a Crack under Mixed Mode Loading J.H. Kuang; Y.C. Chen
中華大學 2005 Crack initiation life prediction for solid cylinders with transverse circular holes under in-phase and out-of-phase multiaxial loading 任貽明; Jen, Yi-Ming
國立臺灣海洋大學 2005 Crack Initiation Life Prediction for Solid Cylinders with Transverse Circular Holes under In-Phase and Out-of-Phase Multiaxial Loading Jen, Yi-Ming;Wang, Wei-Wei
國立中山大學 1996 Crack Initiation Load Characterization Using Critical Energy J.H. Kuang; Y.C. Chen
淡江大學 2002-09 Crack Propagation Analysis of Statically Indeterminate Beam by Elastic-Plastic Fracture Mechanics Liu, Sung-po; Shih, C. J.; Kuo, Liang-yu
國立成功大學 1999-04 Crack propagation behavior of A356 and Al-1Si-0.3Mg aluminum alloys under resonant vibration Jiang, Don-Son; Lui, Truan-Sheng; Chen, Li-Hui
臺大學術典藏 2022-09-21T23:30:06Z Crack Resistance Index and Mechanical Properties of New Generation High Performance Concrete WEN-CHENG LIAO; Jhang, Jia Wei; Wu, Cheng Jun
國立交通大學 2014-12-08T15:04:03Z CRACK SIZE IDENTIFICATION USING AN EXPANDED MODE METHOD KAM, TY; LEE, TY
淡江大學 1993-02-15 Crack tip elements for interface cracks in composite materials 劉昭華; Liu, Chao-hwa; Tsai, J. D.
國立中山大學 1998 Crack Tip Plastic Zones Estimation Using Bueckner's Superposition J.H. Kuang; C.K. Chen
國立臺灣科技大學 2015 Crack-based damage assessment method for HSRC shear-critical beams and columns Chiu, C.-K.;Sihotang, F.;Darwin, D.
國立臺灣科技大學 2019 Crack-based damage quantification for shear-critical HSRC column members using piezoceramic transducers Chiu, Chiu C.-K.;Sugianto, Sugianto S.;Liao, W.-I.;Ho, C.-E.
國立臺灣大學 2005 Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip Cheng, Ji-Yen; Yen, Meng-Hua; Wei, Cheng-Wey; Chuang, Yung-Chuan; Young, Tai-Horng
臺大學術典藏 2020-02-27T03:57:38Z Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip Cheng J.-Y;Yen M.-H;Wei C.-W;Chuang Y.-C;Tai-Horng Young; Cheng J.-Y; Yen M.-H; Wei C.-W; Chuang Y.-C; Tai-Horng Young
臺大學術典藏 2018-09-10T14:54:52Z Crack-free GaN deposition on Si substrate with temperature-graded AlN buffer growth and the emission characteristics of overgrown InGaN/GaN quantum wells Chang, W.-M.; Chung, W.-L.; Hsieh, C.; Liao, C.-H.; Ting, S.-Y.; Chen, K.-Y.; Kiang, Y.-W.; Yang, C.C.; Su, W.-S.; Cheng, Y.-C.; Chen, C.-Y.; CHIH-CHUNG YANG et al.
臺大學術典藏 2020-06-11T06:12:06Z Crack-free GaN deposition on Si substrate with temperature-graded AlN buffer growth and the emission characteristics of overgrown InGaN/GaN quantum wells Chen, C.-Y.;Chang, W.-M.;Chung, W.-L.;Hsieh, C.;Liao, C.-H.;Ting, S.-Y.;Chen, K.-Y.;Kiang, Y.-W.;Yang, C.C.;Su, W.-S.;Cheng, Y.-C.; Chen, C.-Y.; Chang, W.-M.; Chung, W.-L.; Hsieh, C.; Liao, C.-H.; Ting, S.-Y.; Chen, K.-Y.; Kiang, Y.-W.; Yang, C.C.; Su, W.-S.; Cheng, Y.-C.; YEAN-WOEI KIANG
國立交通大學 2014-12-08T15:17:23Z Crack-free GaN/AlN distributed Bragg reflectors incorporated with GaN/AlN superlattices grown by metalorganic chemical vapor deposition Huang, GS; Lu, TC; Yao, HH; Kuo, HC; Wang, SC; Lin, CW; Chang, L
國立成功大學 2007 Crack-free high-brightness InGaN/GaN LEDs on Si(111) with initial AlGaN buffer and two LT-Al interlayers Hsu, Y. P.; Chang, Shoou-Jinn; Chen, W. S.; Sheu, Jinn-Kong; Chu, J. Y.; Kuo, C. T.
臺大學術典藏 2020-02-27T03:57:40Z Crack-free laser direct-writing on quartz and glass for microfluidic chip development Yen M.-H;Cheng J.-Y;Wei C.-W;Chuang Y.-C;Tai-Horng Young; Yen M.-H; Cheng J.-Y; Wei C.-W; Chuang Y.-C; Tai-Horng Young
臺大學術典藏 2020-02-27T03:57:40Z Crack-free laser direct-writing on quartz and glass for microfluidic chip development Yen M.-H;Cheng J.-Y;Wei C.-W;Chuang Y.-C;Tai-Horng Young; Yen M.-H; Cheng J.-Y; Wei C.-W; Chuang Y.-C; Tai-Horng Young
國立臺灣海洋大學 2006-09 Crack-free micromachining on glass using an economic Q-switched 532 nm laser Ji-Yen Cheng; Meng-Hua Yen; Tai-Horng Young
臺大學術典藏 2020-02-27T03:57:31Z Crack-free micromachining on glass using an economic Q-switched 532 nm laser Cheng J.-Y;Yen M.-H;Tai-Horng Young; Cheng J.-Y; Yen M.-H; Tai-Horng Young
臺大學術典藏 2021-07-08T01:23:26Z Cracked teeth: Distribution and survival at 6 months, 1 year and 2 years after treatment Liao W.-C.; Tsai Y.-L.; Chen K.-L.; Blicher B.; Chang S.-H.; Yeung S.-Y.; Chang M.-C.; JIIANG-HUEI JENG
臺大學術典藏 2022-05-03T06:19:21Z Cracked teeth: Distribution and survival at 6 months, 1 year and 2 years after treatment Liao W.-C.; Tsai Y.-L.; Chen K.-L.; Blicher B.; SHU-HUI CHANG; Yeung S.-Y.; Chang M.-C.; Jeng J.-H.

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