| 國立成功大學 |
2021-04 |
Effect of air pollution on health care expenditure: Evidence from respiratory diseases
|
Liu;Ya-Ming;Ao;Chon-Kit |
| 國立成功大學 |
2021-04 |
Effect of air pollution on health care expenditure: Evidence from respiratory diseases
|
區俊傑; Ao, Chon-Kit; Liu, Ya-Ming |
| 國立臺灣大學 |
1993 |
Effect of Air Pollution on Sustainable Agriculture
|
周昌弘; Chou, Chang-Hung |
| 臺大學術典藏 |
2017 |
Effect of air-lifting on the stemness, junctional protein formation, and cytokeratin expression of in vitro cultivated limbal epithelial cell sheets
|
Chen L.; Chen Y.-M.; Lu C.-J.; Chen M.-Y.; Lin S.-Y.; Hu F.-R.; WEI-LI CHEN |
| 臺大學術典藏 |
2022-07-15T08:17:23Z |
Effect of air-lifting on the stemness, junctional protein formation, and cytokeratin expression of in vitro cultivated limbal epithelial cell sheets
|
Chen L.; Chen Y.-M.; Lu C.-J.; Chen M.-Y.; Lin S.-Y.; FUNG-RONG HU; Chen W.-L. |
| 淡江大學 |
2010-09 |
Effect of air-sparging on the cross-flow microfiltration of microbe/protein bio-suspension
|
Hwang, Kuo-Jen; Chen, Ling |
| 淡江大學 |
2007-09-24 |
Effect of air-sparging on the performance of cross-flow microfiltration
|
鄭東文 |
| 淡江大學 |
2009-10-15 |
Effect of Air-Sparging on the Performance of Cross-Flow Microfiltration of Yeast Suspension
|
黃國楨; Hwang, K.J.; Hsu, C.E. |
| 國立成功大學 |
2002-08 |
Effect of Al addition on formation of layer-structured LiNiO2
|
Lin, Shih-Pin; Fung, Kuan-Zong; Hon, Yi-Ming; Hon, Min-Hsiung |
| 國立東華大學 |
2006 |
Effect of Al and Mn Content on the Mechanical Properties of Various ECAE Processed Mg-Li-Zn Alloys
|
Wang,Jian-Yih; Chang,T. C.; Lee,S.; Chang, L. Z. |
| 國立中山大學 |
1992 |
Effect of Al composition on the deep level donors of AlXGa1-XSb/InAs single quantum wells
|
Ikai Lo;W.C. Mitchel;M.O. Manasreh;C.E. Stutz;K.R. Evans |
| 國立中山大學 |
1992 |
Effect of Al composition on the deep level donors of AlXGa1-XSb/InAs single quantum wells
|
Ikai Lo;W.C. Mitchel;M.O. Manasreh;C.E. Stutz;K.R. Evans |
| 國立中山大學 |
1992 |
Effect of Al composition on the negative persistent photoconductivity in AlxGa1-xSb/InAs single quantum wells
|
Ikai Lo;W.C. Mitchel;M.O. Manasreh;C.E. Stulz;K.R. Evans |
| 臺大學術典藏 |
2019-12-27T07:49:46Z |
Effect of Al incorporation in the thermal stability of atomic-layer- deposited HfO2 for gate dielectric applications
|
Chiou, Y.-K.; Chang, C.-H.; Wang, C.-C.; Lee, K.-Y.; Wu, T.-B.; Kwo, R.; Hong, M.; MINGHWEI HONG |
| 臺大學術典藏 |
2018-09-10T06:28:13Z |
Effect of Al incorporation in the thermal stability of atomic-layer-deposited HfO2 for gate dielectric applications
|
MINGHWEI HONG; Hong, Minghwei; Kwo, Raynien; Wu, Tai-Bor; Chiou, Yan-Kai; Chang, Che-Hao; Wang, Chen-Chan; Lee, Kun-Yu |
| 亞洲大學 |
2014-07-30 |
Effect of Al Mole Fraction on the Electrical Characteristics of AlGaN/GaN HEMTs with Recessed Gate Structure
|
Chang, Yi-Sheng |
| 義守大學 |
2012-03 |
Effect of Al Nanoparticles on the Microstructure, Electrical, and Optical Properties of AZO/Al/AZO Trilayer Thin Film
|
Yen-Sheng Lin;Wei-Chih Tseng |
| 國立成功大學 |
2005-06-15 |
Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立東華大學 |
2008 |
Effect of Al substitution on the transport properties of SrSi2
|
Kuo, Y. K. |
| 國立交通大學 |
2014-12-08T15:15:51Z |
Effect of al trace dimension on electromigration failure time of flip-chip solder joints
|
Chiu, S. H.; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:12:12Z |
Effect of Al(III) speciation on coagulation of highly turbid water
|
Lin, Jr-Lin; Huang, Chihpin; Pan, Jill Ruhsing; Wang, Dongsheng |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
|
Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:48Z |
Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
|
Liang, SW; Chang, YW; Chen, C |
| 國立交通大學 |
2014-12-08T15:48:13Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:15Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
