| 義守大學 |
2012-10 |
Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging
|
Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu |
| 義守大學 |
2014-02 |
Failure analysis of EOS-induced damage at final electrical testing
|
Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu |
| 國立交通大學 |
2014-12-08T15:26:28Z |
Failure analysis of ESD damage in a high-voltage driver IC and the effective ESD protection solution
|
Ker, MD; Peng, JJ; Jiang, HC |
| 國立成功大學 |
2015-12-15 |
Failure analysis of fiber-reinforced composite laminates subjected to biaxial loads
|
Hu, Hsuan-Teh; Lin, Wen-Pin; Tu, Fang-Tai |
| 國立交通大學 |
2017-04-21T06:48:54Z |
Failure Analysis of Gate-all-around Nanowire Field Effect Transistor Under TLP Test
|
Zhang, Guoyan; Dong, Aihua; Liu, Nie; Tian, Rui; Yang, Xuejiao; Liu, Zhiwei; Lee, Kohui; Lin, Horng-Chih; Liou, Juin J.; Wang Yuxin |
| 國立成功大學 |
2012-03 |
Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
|
Chang, Hung-Jen; Zhan, Chau-Jie; Chang, Tao-Chih; Chou, Jung-Hua |
| 國立高雄應用科技大學 |
2008 |
Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films
|
Lin, Chao-Ming; Lin, Tzu-Chao; Fang, Te-Hua; Chao, Kuo-Sheng |
| 亞洲大學 |
2012-09 |
Failure Analysis of Power MOSFETs based on Multi-finger Configuration under Unclamped Inductive Switching (UIS) Stress Condition
|
楊紹明;Yang, Shao-Ming;蔡宗叡;Tsai, Jung-Ruey;許健;Sheu, Gene |
| 亞洲大學 |
2012-09 |
Failure Analysis of Power MOSFETs based on Multifinger Configuration under Unclamped Inductive
|
楊紹明;Yang, Shao-Ming;許健;Sheu, Gene |
| 國立勤益科技大學 |
2008-02 |
Failure Analysis of Reverse Shaft in the Transmission System of All-Terrain Vehicles
|
Lin, Chun-Yuan;Hung, Jui-Pin;Hsu, Tze-Chi |
| 國立交通大學 |
2014-12-08T15:21:42Z |
Failure Analysis of Small Composite Sandwich Turbine Blade Subjected to Extreme Wind Load
|
Chen, C. P.; Kam, T. Y. |
| 國立臺灣科技大學 |
2012 |
Failure analysis of the oil transport spiral welded pipe
|
Lin, M.-B.;Gao, K.;Wang, C.-J.;Volinsky, A.A. |
| 國立臺灣科技大學 |
2013 |
Failure analysis of wind turbine blade under critical wind loads
|
Chou, J.-S.;Chiu, C.-K.;Huang, I.-K.;Chi, K.-N. |
| 國立交通大學 |
2014-12-08T15:28:41Z |
Failure Analysis on Gate-Driven ESD Clamp Circuit after TLP Stresses of Different Voltage Steps in a 16-V CMOS Process
|
Dai, Chia-Tsen; Chiu, Po-Yen; Ker, Ming-Dou; Tsai, Fu-Yi; Peng, Yan-Hua; Tsai, Chia-Ku |
| 國立交通大學 |
2020-10-05T02:00:30Z |
Failure Analysis on TiAl Metallization Process for Ohmic Contact on 4H-SiC pMOSFET
|
Hung, Chia-Lung; Cheng, Jung-Chien; Tsui, Bing-Yue |
| 臺大學術典藏 |
1990 |
Failure Analysis:Principles and Case Studies
|
單秋成; 單秋成; Shin, Chow-Ching |
| 國立臺灣大學 |
1990 |
Failure Analysis:Principles and Case Studies
|
單秋成; Shin, Chow-Ching |
| 國立交通大學 |
2014-12-08T15:06:37Z |
Failure and degradation mechanisms of high-power white light emitting diodes
|
Yang, Shih-Chun; Lin, Pang; Wang, Chien-Ping; Huang, Sheng Bang; Chen, Chiu-Ling; Chiang, Pei-Fang; Lee, An-Tse; Chu, Mu-Tao |
| 國立臺灣大學 |
1989 |
Failure and Stability of Rock Slopes Alone the Central Cross-Island Highway, Taiwan
|
洪如江; Lin, Chii-Wen; Hung, Ju-Jiang; Lin, Chii-Wen |
| 國立臺灣大學 |
1990 |
Failure and Stability of Rock Slopes Alone the Central Cross-Island Highway, Taiwan
|
洪如江; Lin, Chii-Wen; Hung, Ju-Jiang; Lin, Chii-Wen |
| 國立臺灣大學 |
1989-01 |
Failure and Stability of Rock Slopes Alone the Central Cross-Island Highway, Taiwan
|
洪如江; Lin, Chii-Wen; Hung, Ju-Jiang; Lin, Chii-Wen |
| 臺大學術典藏 |
2019-12-24T09:06:08Z |
Failure assessments of polymeric structure for electronic connectors
|
Huang D.-C.;Juo Y.-T.;Liao K.-C.; Huang D.-C.; Juo Y.-T.; Liao K.-C.; KUO-CHI LIAO |
| 國立臺灣科技大學 |
2011 |
Failure Assessments of Porous Aluminum Sheets Under Stretching Procedures
|
Liao, K.C.;Chen, C.L.;Chang, K.M. |
| 國立臺灣科技大學 |
2004 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test
|
Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
| 國立成功大學 |
2004-08 |
Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test
|
Liu, Yeh-Hsiu; Chuang, Chiang-Ming; Lin, Kwang-Lung |
