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Institution Date Title Author
國立交通大學 2014-12-08T15:11:01Z Failure mechanism and bearing capacity of shallow foundation on poorly cemented sandstone Chang, J. -C.; Liao, J. -J.; Pan, Y. -W.
國立中山大學 1999-12 Failure Mechanism and Mechanical Properties of Carbon/PEEK Composite Laminates due to Notch and Temperature Effects S.C. Chang; W.H. Lin; H.K. Kung; M.H.R. Jen
國立成功大學 2014-06-01 Failure Mechanism for GaN-Based High-Voltage Light-Emitting Diodes Chang, Shoou-Jinn; Chang, Chung-Ying; Tseng, Chun-Lung; Shen, Ching-Shing; Chen, Bing-Yang
國立交通大學 2020-03-02T03:23:30Z Failure mechanism of a mudstone slope embedded with steep anti-dip layered sandstones: case of the 2016 Yanchao catastrophic landslide in Taiwan Lin, Cheng-Han; Hung, Ching; Weng, Meng-Chia; Lin, Ming-Lang; Uzuoka, Ryosuke
國立成功大學 2019-11 Failure mechanism of a mudstone slope embedded with steep anti-dip layered sandstones: case of the 2016 Yanchao catastrophic landslide in Taiwan Lin;Cheng-Han;Hung;Ching;Weng;Meng-Chia;Lin;Ming-Lang;Uzuoka;Ryosuke
國立成功大學 2004 Failure mechanism of amorphous and crystalline Ta-N films in the Cu/Ta-N/Ta/SiO2 structure Chang, Ching-Chun; Chen, Jen-Sue; Hsu, Wu-Shiung
國立交通大學 2017-04-21T06:48:57Z Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration Lin, Wan-Hsuan; Chao, Shu-Han; Zhan, Chau-Jie; Huang, Yu-wei; Chen, Chih
南台科技大學 2006 Failure Mechanism of Electromigration (EM) in Via Sidewall for Copper Dual Damascene Interconnection Y. L.Hsu; Y. K. Fang; Y. T. Chiang; S.F. Chen; C. Y Lin.; T. H. Chou; S. H. Chang;陳世芳
國立成功大學 2006 Failure mechanism of electromigration in via sidewall for copper dual damascene interconnection Hsu, Y. L.; Fang, Yean-Kuen; Chiang, Yen-Ting; Chen, Shih-Fang; Lin, C. Y.; Chou, T. H.; Chang, S. H.
臺大學術典藏 2018-09-10T18:03:09Z Failure mechanism of hollow tree trunks due to cross-sectional flattening JIA-YANG JUANG; JIA-YANG JUANG

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