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Institution	Date	Title	Author
國立臺灣大學	2008	Flip-chip bonded MEMS capacitor applied on tuning superconductive resonator	Chen, Yi-Jie; Kao, Cheng-Kai; Shih, Wen-Pin; Chung, Sheng-Yuan; Chang, Pei-Zen
元智大學	Dec-14	Flip-Chip Bonding Packaged THz Photodiode With Broadband High-Power Performance	J.-M. Wun; C.-H. Lai; Nan-Wei Chen; J. E. Bowers; J.-W. Shi
國立彰化師範大學	2008-12	Flip-Chip LED Design Based on PSO Algorithm	Wan, Yi-Chih; Wang, Chuen-Ching; Chen, Jin-Jia; Shih, Wei-Wen
南台科技大學	2006-08	Flip-chip p(GaN)-i(GaN)-n(AlGaN) narrow-band UV-A photo sensors	T. K. Ko; S. C. Shei; S. J. Chang; Y. K. Su; Y. Z. Chiou; Y. C. Lin; C. S. Chang; W. S. Chen; C. K. Wang; J. K. Sheu; W. C. Lai;林永春
國立成功大學	2006-08	Flip-chip p(GaN)-i(GaN)-n(AlGaN) narrowband UV-A photosensors	Ko, T. K.; Shei, Shih-Chang; Chang, Shoou-Jinn; Su, Yan-Kuin; Chiou, Yu-Zung; Lin, Y. C.; Chang, C. S.; Chen, W. S.; Wang, C. K.; Sheu, Jinn-Kong; Lai, W. C.
國立交通大學	2014-12-08T15:29:06Z	Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications	Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi
國立交通大學	2014-12-08T15:27:17Z	Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate	Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki
元智大學	2011-09	Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate	Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
元智大學	2011-09	Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate	Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto
國立臺灣科技大學	2019	Flip-chip routing with i/o planning considering practical pad assignment constraints	Yu, T.-C.;Shih, A.-J.;Fang, S.-Y.

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