| 臺大學術典藏 |
2021-11-29T08:01:55Z |
Grain and Powder Flows
|
F.-L. Yang; K. L. Lee; FU-LING YANG |
| 國立成功大學 |
2024-05-15 |
Grain boundary complexion modification for interface stability in garnet based solid-state Li batteries
|
Wang;Chih-Chieh;Hsu;-Chun, Wei;Chang;-Yu, Chia;Ihrig;Martin;Tran;Thuy, Ngoc Thanh;Lin;Shih-kang;Windmuller;Anna;Tsai;Chih-Long;Eichel;Ruediger-A;Chiu;Kuo-Feng |
| 國立臺灣海洋大學 |
1981 |
Grain Boundary Deformation
|
L.E.Murr；S.H.Wang |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-11-21T23:18:57Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu, Z. X.; Renganathan, Vengudusamy; Kao, C. R. |
| 國立臺灣科技大學 |
2016 |
Grain boundary engineering by shape-control of SrTiO3 nanocrystals
|
Tzeng, W.-L;Sun, T.-L;Shih, Shih S.-J. |
| 國立臺灣科技大學 |
2017 |
Grain boundary engineering for improving conductivity of polycrystalline SrTiO3
|
Tzeng, W.-L;Yen, H.-W;Lin, W.-C;Shih, Shih S.-J. |
| 臺大學術典藏 |
2022-01-07T02:14:14Z |
Grain Boundary Heterogeneity Effects in Ultra-High Temperature Ceramics
|
C-H Yu; C-S Chen; C-W Huang; Y Gao; C-H Hsueh; CHUIN-SHAN CHEN |
| 國立中山大學 |
2003 |
Grain Boundary Imaging, Gallium Diffusion and the Fracture Behavior of Al-Zn Alloy-An in situ Study
|
W.L. Tsai;Y. Hwu;C.H. Chen;L.W. Chang;J.H. Je;H.M. Lin;G. Margaritondo |
| 臺大學術典藏 |
1992 |
Grain Boundary Liquation of Zirconium-Containing Nickel Aluminides
|
Chen, Gen-Huey; Chen, Chun; Chen, Gen-Huey; Chen, Chun |
| 國立臺灣大學 |
1992 |
Grain Boundary Liquation of Zirconium-Containing Nickel Aluminides
|
陳健輝; 陳鈞; Chen, Gen-Huey; Chen, Chun |
| 國立臺灣大學 |
1994 |
Grain boundary melting of hafnium containing Ni3Al intermetallic compounds
|
Chang, T.T.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Grain boundary melting of hafnium containing Ni3Al intermetallic compounds
|
Chang, T.T.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
1991 |
Grain boundary pest of boron- doped Niin3Al at 1200 ?C
|
ChuangTH; Hsu, S. E.; Pan, Y. C.; Chuang, T. H.; Chuang, T. H.; Pan, Y. C.; Hsu, S. E. |
| 國立臺灣大學 |
1991 |
Grain boundary pest of boron- doped Niin3Al at 1200 ?C
|
Chuang, T. H.; Pan, Y. C.; Hsu, S. E. |
| 臺大學術典藏 |
2020-05-12T02:53:27Z |
Grain boundary pest of boron- doped Niin3Al at 1200 °C
|
Chuang, T.H.; Pan, Y.C.; Hsu, S.E.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
1989 |
Grain Boundary Phase in Pressureless Sintered SiA1ON
|
Wei, Wen-Cheng; 韋文誠; Halloran. J. W.; Wei, Wen-Cheng; Halloran. J. W. |
| 國立臺灣大學 |
1989 |
Grain Boundary Phase in Pressureless Sintered SiA1ON
|
韋文誠; Halloran. J. W.; Wei, Wen-Cheng; Halloran. J. W. |
| 臺大學術典藏 |
2008 |
Grain boundary pinning of polycrystalline Al2O3 by Mo inclusions
|
Wei, Wen-Cheng J.; Lin, Ching-Jang; Lin, Ching-Jang; Wei, Wen-Cheng J. |
| 國立臺灣大學 |
2008 |
Grain boundary pinning of polycrystalline Al2O3 by Mo inclusions
|
Lin, Ching-Jang; Wei, Wen-Cheng J. |
| 臺大學術典藏 |
2020-05-12T02:54:18Z |
Grain boundary pinning of polycrystalline Al2O3 by Mo inclusions
|
Lin, C.-J.; Wei, W.-C.J.; WEN-CHENG J. WEI |
| 國立交通大學 |
2014-12-08T15:02:55Z |
Grain boundary precipitation behaviors in an Fe-9.8Al-28.6Mn-0.8Si-1.0C alloy
|
Chao, CY; Hwang, CN; Liu, TF |
| 國立交通大學 |
2014-12-08T15:11:13Z |
Grain boundary precipitation in Fe-30Mn-9Al-5Cr-0.7C alloy
|
Tuan, Yi Hsuan; Lin, Chih Lung; Chao, Chuen Guang; Liu, Tzeng Feng |
