|
|
Taiwan Academic Institutional Repository >
Browse by Title
|
Showing items 520061-520085 of 2346288 (93852 Page(s) Totally)
<< < 20798 20799 20800 20801 20802 20803 20804 20805 20806 20807 > >>
View [10|25|50] records per page
| 國立臺灣大學 |
2006-08 |
INTERMEDIATE-TERM OUTCOME OF PSYCHIATRIC INPATIENTS WITH MAJOR DEPRESSION
|
曾美智; 鄭懿之; 李宇宙; 李明濱 |
| 國立臺灣大學 |
2006 |
Intermediate-term Outcome of Psychiatric Inpatients with Major Depression.
|
Tseng, Mei-Chih; Cheng, I-Chih; Lee, Yue-Joe; Lee, Ming-Been |
| 高雄醫學大學 |
2010 |
Intermediate-term outcomes associated with kidney transplantation in recipients 80 years and older: an analysis of the OPTN/UNOS database.
|
郭弘典; Huang E;Poommipanit N;Sampaio MS;Kuo HT;Reddy P;Gritsch HA;Pham PT;Wilkinson A;Danovitch G;Bunnapradist S |
| 國立臺北護理健康大學 |
2003-01 |
Intermediate-term results of endoscopic transaxillary T2-sympathectomy for primary palmar hyperhidrosis
|
Chiou, TS, M;Chen, S, C |
| 國立交通大學 |
2018-08-21T05:54:24Z |
Intermediate-Valence Ytterbium Compound Yb4Ga24Pt9: Synthesis, Crystal Structure, and Physical Properties
|
Sichevych, Olga; Prots, Yurii; Utsumi, Yuki; Akselrud, Lev; Schmidt, Marcus; Burkhardt, Ulrich; Coduri, Mauro; Schnelle, Walter; Bobnar, Matej; Wang, Yu-Ting; Wu, Yu-Han; Tsuei, Ku-Ding; Tjeng, Liu Hao; Grin, Yuri |
| 臺大學術典藏 |
2018-09-10T04:50:40Z |
Intermetal oxo transfer: Isomerization of tungsten-rhenium carbonyl complexes containing oxo and acetylide ligands
|
Lai, N.-S.;Tu, W.-C.;Chi, Y.;Peng, S.-M.;Lee, G.-H.; Lai, N.-S.; Tu, W.-C.; Chi, Y.; Peng, S.-M.; Lee, G.-H.; SHIE-MING PENG |
| 國立臺灣大學 |
1994 |
Intermetal Oxo Transfer:Isomerization of Tungsten-Rhenium Carbonyl Complexes Containing Oxo and Acetylide Ligands
|
Lai, N.; Tu, W.; Chi, Y.; 彭旭明; Lee, G.; Lai, N.; Tu, W.; Chi, Y.; Peng, Shie-Ming; Lee, G. |
| 國立成功大學 |
2004-12 |
Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate
|
Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2003-03-24 |
Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立聯合大學 |
2004 |
Intermetallic Compounds Formation of the Sn-9Zn-xAg Lead-free Solders Hot-dipped on Cu Substrate
|
T.C. Chang , . M.C. Wang(王木琴) and M..H. Hon |
| 國立成功大學 |
2003-04-30 |
Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C. L.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
|
Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2009-01-06T01:29:28Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
|
Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
|
Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2004 |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:29Z |
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)
|
TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:15Z |
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages
|
Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages
|
Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG |
Showing items 520061-520085 of 2346288 (93852 Page(s) Totally)
<< < 20798 20799 20800 20801 20802 20803 20804 20805 20806 20807 > >>
View [10|25|50] records per page
|
