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Showing items 558871-558880 of 2348487 (234849 Page(s) Totally) << < 55883 55884 55885 55886 55887 55888 55889 55890 55891 55892 > >> View [10|25|50] records per page
| 國立成功大學 |
2000-04 |
Low-pressure deposition of diamond by electron cyclotron resonance microwave plasma chemical vapor deposition
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Chiang, Ming-Jeng; Lung, B. H.; Hon, Min-Hsiung |
| 國立臺灣大學 |
1995 |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
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Yeh, M. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:26Z |
Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer
|
Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 元智大學 |
Nov-14 |
Low-pressure ethane/nitrogen gas mixture plasma surface modification effect on the wetting and electrochemical performance of polymeric separator for lithium-ion batteries
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Ruey-Shin Juang; Chia-Han Liang; Wei-Chun Ma; Ching-Yuan Tsai; Chun Huang |
| 國立成功大學 |
2016-04-22 |
Low-Pressure Hybrid Chemical Vapor Growth for Efficient Perovskite Solar Cells and Large-Area Module
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Shen, Po-Shen;Chen, Jia-Shin;Chiang, Yu-Hsien;Li, Ming-Hsien;Guo, Tzung-Fang;Chen, Peter |
| 國立成功大學 |
2022-01 |
Low-pressure hydrodistension induces bladder glomerulations in female patients with interstitial cystitis/bladder pain syndrome
|
Hsu;Lin-Nei;Tsai;Yuh-Shyan;Tong;Yat-Ching |
| 臺大學術典藏 |
2021-11-21T23:18:57Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
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Tsai, Chin Hao; Huang, Wei Chen; Chew, Ly May; Schmitt, Wolfgang; Li, Jiahui; Nishikawa, Hiroshi; Kao, C. R. |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
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Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
Showing items 558871-558880 of 2348487 (234849 Page(s) Totally) << < 55883 55884 55885 55886 55887 55888 55889 55890 55891 55892 > >> View [10|25|50] records per page
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