| 淡江大學 |
2018-10-04 |
Package mTEXO for testing the presence of outliers in exponential samples
|
Lin, Chien-Tai;Lee, Ying-Chen;Balakrishnan, Narayanaswamy |
| 淡江大學 |
2018-07-28 |
Package mTEXO for testing the presence of outliers in exponential samples
|
Lin, C. T.;Lee, Y. C.;Balakrishnan, N. |
| 淡江大學 |
2018-10-04 |
Package mTEXO for testing the presence of outliers in exponential samples.
|
Chien-Tai Lin, Ying Chen Lee, and N. Balakrishnan |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design
|
Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2014-12-08T15:31:26Z |
Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs
|
Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2015-12-04T07:03:11Z |
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
|
LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu |
| 國立交通大學 |
2017-02-09 |
PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
|
Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin |
| 國立臺灣科技大學 |
2020 |
Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity
|
Su, J.-C.;Huang, S.-B. |
| 義守大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
|
Han-Jan Chen;Tsung-Hui Huang;Chin-Sheng Chang;Lih-Shan Chen;Jui-Hong Horng;Yeong-Her Wang;Mau-Phon Houng |
| 國立成功大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
|
Chen, Han-Jan; Huang, Tsung-Hui; Chang, Chin-Sheng; Chen, Lih-Shan; Horng, Jui-Hong; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2016-08-03 |
Package-on-Package封裝體之熱傳研究
|
周景弘; Chou, Ching-Hung |
| 國立成功大學 |
2016-07-08 |
Package-on-Package封裝體之熱傳研究
|
周景弘; Chou, Ching-Hung |
| 臺大學術典藏 |
2018-09-10T04:55:28Z |
Package-strain-enhanced device and circuit performance
|
Maikap, S.;Liao, M.H.;Yuan, F.;Lee, M.H.;Huang, C.-F.;Chang, S.T.;Liu, C.W.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W.; CHEE-WEE LIU |
| 臺大學術典藏 |
2019-03-11T08:00:57Z |
Package-strain-enhanced device and circuit performance
|
Liu, C.W.;Chang, S.T.;Huang, C.-F.;Lee, M.H.;Yuan, F.;Maikap, S.;Liao, M.H.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W. |
| 臺大學術典藏 |
2018-09-10T07:42:41Z |
Packaged Symmetric/Asymmetric Corrugated Long Period Fiber Gratings for Refractive Index Sensing Applications
|
Chih-Yu Huang,;Wen-Lin Chan,;Shih-Min Chuo,;Jer-Haur Chang,;Li-Lun Chen,;Lon A. Wang,; Chih-Yu Huang,; Wen-Lin Chan,; Shih-Min Chuo,; Jer-Haur Chang,; Li-Lun Chen,; Lon A. Wang,; LON A. WANG |
| 國立成功大學 |
2003-05 |
Packaging a fiber Bragg grating with metal coating for an athermal design
|
Lo, Yu-Lung; Kuo, Chih-Ping |
| 國立成功大學 |
2002-02 |
Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device
|
Lo, Yu-Lung; Kuo, Chih-Ping |
| 南台科技大學 |
2003 |
Packaging design for e-commerce: Identifyingnew challenges and opportunities for online packaging
|
黃國禮; HUANG, K.L.;RUST, C.;PRESS, M. |
| 義守大學 |
2004-03 |
Packaging Design for Implantable Microstimulator
|
Chi-Chan Hung;Cho-Liang Chung;Gin-Shu Young;Kang-Ping Lin;Jia-Jin Chen; 鍾卓良 |
| 國立交通大學 |
2019-04-02T06:04:52Z |
Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors
|
Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi |
| 國立中山大學 |
2009-05 |
Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond
|
F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung |
| 國立中山大學 |
2009-06 |
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond
|
F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung |
| 國立臺灣科技大學 |
2014 |
Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy
|
Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y. |
| 國立臺灣大學 |
2005 |
Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications
|
Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L. |
| 國立臺灣大學 |
2005-02 |
Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications
|
Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L. |
