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Institution	Date	Title	Author
中華大學	2008	THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS	陳精一; Chen, Ching-I
國立成功大學	2004-07-30	Thermal chip fabrication with arrays of sensors and heaters for micro-scale impingement cooling heat transfer analysis and measurements	Shen, C. H.; Gau, Chie
國立成功大學	2024-05-15	Thermal Circuit Modeling and Numerical Verification for Concurrent Fluid Flows through an Iso-Flux Heated Concentric Double Tube	Ho;C, J.;Huang;Shih-Hui;Huang;Zai-Ping;Yen;Jung-Yi;Chen;K, S.;Lai;-Ming, Chi
國立彰化師範大學	2005-06	Thermal Comfort Control on Multi-room Fan Coil Unit System Using LEE-based Fuzzy Logic	Chu, Chi-Min; Jong, Tai-Lang; Huang, Yue-Wei
國立成功大學	2013	Thermal Comfort for Urban Parks in Subtropics: Understanding Visitor's Perceptions, Behavior and Attendance	Lin, Chuang-Hung; Lin, Tzu-Ping; Hwang, Ruey-Lung
朝陽科技大學	2021-05-28	Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass	許國威
中國醫藥大學	2007-12	Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions	黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)*
中國醫藥大學	2008.06	Thermal comfort requirements in air-conditioned residences in hot-humid climate	鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)*
國立成功大學	2004-02	Thermal compensation for a chirp fiber bragg grating bonded substrate	Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung
臺大學術典藏	2022-09-21T23:30:34Z	Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface	Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R.

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