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Showing items 872401-872410 of 2348719 (234872 Page(s) Totally) << < 87236 87237 87238 87239 87240 87241 87242 87243 87244 87245 > >> View [10|25|50] records per page
| 國立臺灣大學 |
1990 |
Thermal Degradation of Poly[3-Dimethyl (Acryloyloxyethyl) Ammonium Propanesulfonate]
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廖德章; 林美枝; 李魁然; Liaw, Der-Jang; Lin, Mei-Chin; Lee, Kueir-Rarn |
| 國立臺灣科技大學 |
2010 |
Thermal degradation studies on polyaniline-polypyrrole copolymers prepared by microemulsion methods
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Prasannan A.; Somanathan N.; Hong P.-D. |
| 國立交通大學 |
2014-12-08T15:39:27Z |
Thermal denaturation of beta-lactoglobulin as probed by an monoclomal antibody
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Chen, WL; Huang, MT; Li, CW; Liu, HC; Mao, SJT |
| 國立臺灣科技大學 |
2020 |
Thermal Dependence of the Mesoscale Ionic Diode: Modeling and Experimental Verification
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Peng, Peng P.-H.;Ou, Yang H.-C.;Tsai, P.-C.;Yeh, L.-H. |
| 元智大學 |
2017-08-23 |
Thermal depolymerization of lignin with catalyst, , proceeding of the abstracts of paper ,
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Damayanti; Ho Shing Wu |
| 義守大學 |
2002 |
Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates
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Hsiang-Chen Hsu; Lih-Shan Chen; Lee-Wei Chu |
| 義守大學 |
2002/12/04 |
Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates
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Hsiang-Chen Hsu ; Lih-Shan Chen ; Lee-Wei Chu |
| 國立交通大學 |
2020-05-05T00:02:19Z |
Thermal design aspects for improving temperature homogeneity of silicon wafer during thermal processing in microlithography
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Wang, Chi-Chuan; Muneeshwaran, M. |
| 國立中山大學 |
1985-06-23 |
Thermal Design Considerations o?n Helical Type Heat Exchangers
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S.S. Hsieh; C.C. Chen |
| 國立中山大學 |
1986 |
Thermal Design Data for Double Pipe Heat Exchangers with Asymmetrically Heating
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S.S. Hsieh; C. Ku; C.T. Liauh; W.S. Han |
Showing items 872401-872410 of 2348719 (234872 Page(s) Totally) << < 87236 87237 87238 87239 87240 87241 87242 87243 87244 87245 > >> View [10|25|50] records per page
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