| 國立成功大學 |
2024 |
Thermal Loading Analysis of Hypersonic Flight Object with Re-Entry Trajectory by Time-Adaptive Weakly Coupled Conjugate Heat Transfer
|
Chen;Y, -H.;Leu;T, -S. |
| 國立成功大學 |
2020 |
Thermal management and uniform temperature regulation of photovoltaic modules using hybrid phase change materials-nanofluids system
|
Hassan, A.;Wahab, A.;Qasim, M.A.;Janjua, M.M.;Ali, M.A.;Ali, H.M.;Jadoon, T.R.;Ali, E.;Raza, A.;Javaid, N. |
| 國立成功大學 |
2011-05 |
Thermal management of a proton exchange membrane fuel cell stack with pyrolytic graphite sheets and fans combined
|
Wen, Chih-Yung;Lin, Yu-Sheng;Lu, Chien-Heng;Luo, Tei-Wei |
| 國立交通大學 |
2020-03-02T03:23:29Z |
Thermal Management of GaN-on-Si High Electron Mobility Transistor by Copper Filled Micro-Trench Structure
|
Mohanty, Srikant Kumar; Chen, Yu-Yan; Yeh, Ping-Hung; Horng, Ray-Hua |
| 臺大學術典藏 |
2021-10-07T08:52:33Z |
Thermal Management of Ground Heat Exchangers Applied in High Power LED
|
Yuan-Ching Chiang; Chien-Yeh Hsu; Chih-Hao Chen; Sih-Li Chen; SIH-LI CHEN |
| 南台科技大學 |
2021 |
Thermal management of high temperature polymer electrolyte membrane fuel cells by using flattened heat pipes
|
Krerkkiat Sasiwimonrit;Wei-Chin Chang |
| 國立臺灣科技大學 |
2008 |
Thermal management of the LED headlamp module for a motorcycle
|
Lin S.-C.; Hong J.-T.; Tsai M.-L.; Shih H.-C.; Leong J.C.; Chen W.-L. |
| 臺大學術典藏 |
2020-02-26T01:36:47Z |
Thermal manipulation utilizing micro-cantilever probe in scanning electron microscopy
|
Wang, A.Y.-T.; Huang, C.-C.; Tsai, Y.-C.; Wu, M.-D.; Liang, D.; Shih, P.-J.; Shih, W.-P.; PO-JEN SHIH |
| 元智大學 |
2019/8/6 |
Thermal Mapping of Systolic Array Based Accelerator for Three-Dimensional Multiple Convolution Neural Network Application
|
Shu-Yen Lin; Chun-Kuan Tsai; Yu-Hsuan Lee |
| 國立中山大學 |
2007 |
Thermal Mechanical Properties of Mg58Cu31Nd5Y6 Bulk Metallic Glass within the Supercooled Liquid Temperature Region
|
J.S.C. Jang;C.C. Tseng;L.J. Chang;J.C. Huang;C.Y. Tsao |
| 國立交通大學 |
2019-04-03T06:47:56Z |
Thermal Model Based Power-Generated Prediction by Using Meteorological Data in BIPV System
|
Huang, C. Y.; Chen, H. J.; Chan, C. C.; Chou, C. P.; Chiang, C. M. |
| 臺大學術典藏 |
2020-01-13T08:25:38Z |
Thermal model of the wet grinding process
|
Liao, Y.S.; Luo, S.Y.; Yang, T.H.; YUNN-SHIUAN LIAO |
| 臺大學術典藏 |
2018-09-10T08:39:30Z |
Thermal modeling and analysis for 3-D ICs with integrated microchannel cooling
|
Mizunuma, H.; Lu, Y.-C.; Yang, C.-L.; YI-CHANG LU; CHIA-LIN YANG |
| 國立臺灣大學 |
1999-11 |
Thermal modeling and chronological constraints of granitic plutonism in Zhangzhou igenous complex, SE China.
|
Lu, H.-Y.; Tien, J.-L.; Lo, C.-H.; Chen, C.H |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Thermal Modeling and Design on Smartphones with Heat Pipe Cooling Technique
|
Chiou, Hong-Wen; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia |
| 臺大學術典藏 |
2009 |
Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology
|
Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-Chang; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W.; Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-chang; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W. |
| 國立臺灣大學 |
2009 |
Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology
|
Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-chang; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W. |
| 臺大學術典藏 |
2020-06-16T06:36:20Z |
Thermal modeling and device oise properties of three-dimensional-SOI technology
|
Chen, T.W.;Chun, J.-H.;Lu, Y.-C.;Navid, R.;Wang, W.;Chen, C.-L.;Dutton, R.W.; Chen, T.W.; Chun, J.-H.; Lu, Y.-C.; Navid, R.; Wang, W.; Chen, C.-L.; Dutton, R.W.; YI-CHANG LU |
| 國立中山大學 |
2005 |
Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding
|
C.H. Chien; T.P. Chen; Y.J. Chao |
| 國立中山大學 |
2004-12 |
Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding
|
C.H. Chien; T.P. Chen; Y.J. Chao |
| 國立臺灣大學 |
2003 |
Thermal modeling and performance analysis of a thermoacoustic refrigerator
|
Holmberg, David G.; Chen, G. S.; Lin, H. T.; Wo, Andrew M. |
| 臺大學術典藏 |
2020-04-28T07:11:18Z |
Thermal modeling and performance analysis of a thermoacoustic refrigerator
|
Holmberg, D.G.; Chen, G.S.; Lin, H.T.; Wo, A.M.; ANDREW WO |
| 臺大學術典藏 |
2018-09-10T07:33:28Z |
Thermal modeling for 3D-ICs with integrated microchannel cooling
|
Mizunuma, H.;Yang, C.-L.;Lu, Y.-C.; Mizunuma, H.; Yang, C.-L.; Lu, Y.-C.; CHIA-LIN YANG |
| 臺大學術典藏 |
2018-09-10T07:37:14Z |
Thermal modeling for 3D-ICs with integrated microchannel cooling
|
Mizunuma, Hitoshi;Yang, Chia-Lin;Lu, Yi-Chang; Mizunuma, Hitoshi; Yang, Chia-Lin; Lu, Yi-Chang; YI-CHANG LU |
| 臺大學術典藏 |
2020-05-04T07:27:48Z |
Thermal modeling for 3D-ICs with integrated microchannel cooling.
|
Lu, Yi-Chang; Yang, Chia-Lin; Mizunuma, Hitoshi;Yang, Chia-Lin;Lu, Yi-Chang; Mizunuma, Hitoshi; CHIA-LIN YANG |
