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Showing items 873061-873085 of 2348719  (93949 Page(s) Totally)
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Institution Date Title Author
國立成功大學 2011-08-02 Thermal-Aware Bus-Driven Floorplanning Wu, Po-Hsun; Ho, Tsung-Yi
臺大學術典藏 2018-09-10T14:58:25Z Thermal-aware Dynamic Buffer Allocation for Proactive routing algorithm on 3D Network-on-Chip systems Lee, Y.-S.;Hsin, H.-K.;Chen, K.-C.;Chang, E.-J.;Wu, A.-Y.A.; Lee, Y.-S.; Hsin, H.-K.; Chen, K.-C.; Chang, E.-J.; Wu, A.-Y.A.; AN-YEU(ANDY) WU
國立成功大學 2021-05 Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation Lin;Jai-Ming;Chen;Tai-Ting;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming
國立成功大學 2021-09 Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC Lin;Jai-Ming;Chang;Wei-Yi;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming
元智大學 2014-10-07 Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su
國立交通大學 2014-12-08T15:23:05Z Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation Huang, Juinn-Dar; Huang, Ya-Shih; Hsu, Mi-Yu; Chang, Han-Yuan
國立臺灣科技大學 2016 Thermal-aware MapReduce real-time scheduling in heterogeneous server systems Tang, Tang T.-C;Chen, Y.-S.
元智大學 2015-08-04 Thermal-aware Memory Mapping for Three-dimensional Block-based SRAM Architecture Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su
國立臺灣科技大學 2012 Thermal-aware real-time task scheduling for three-dimensional multicore chip Tsai, T.-H.;Chen, Y.-S.
臺大學術典藏 2020-06-16T06:36:16Z Thermal-aware router-sharing architecture for 3D network-on-chip designs Huang, Y.-R.;Pan, J.-H.;Lu, Y.-C.; Huang, Y.-R.; Pan, J.-H.; Lu, Y.-C.; YI-CHANG LU
國立臺灣科技大學 2012 Thermal-aware service rate adjustment for cyber-physical systems Chu, H.-H.;Tsai, T.-H.;Chen, Y.-S.
元智大學 2014-04-11 Thermal-aware task mapping for reconfigurable channel decoding Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su
元智大學 2014-08-05 Thermal-aware task mapping for three-dimensional reconfigurable channel decoding Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su
臺大學術典藏 2018-09-10T09:25:31Z Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI
淡江大學 2012-10-18 Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC Shih, Chi-Jih; Hsu, Chih-Yao; Kuo, Chun-Yi; Li, James; Rau, Jiann-Chyi; Krishnendu Chakrabarty
臺大學術典藏 2018-09-10T08:47:25Z Thermal-aware Test scheduling for 3D ICs CY Hsu; JCM Li; K. Chakrbarty; CHIEN-MO LI
臺大學術典藏 2020-01-06T03:05:17Z Thermal-capillary analysis of floating-zone growth of tube crystals: steady-state and conduction dominated calculations Lan, C.W.; CHUNG-WEN LAN
中華大學 2003 Thermal-chemical polishing device and method thereof 馬廣仁; Ma, Kung-Jen
淡江大學 2003-05-27 Thermal-chemical polishing devices and method thereof 趙崇禮; Chao, Choung-lii; Ma, Kung-jeng; Lin, Hung-yi
元智大學 May-22 Thermal-constrained memory management for three-dimensional DRAM-PCM memory with deep neural network applications Shu-Yen Lin; Shao-Cheng Wang
國立交通大學 2015-12-02T02:59:38Z Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization Liao, Chien-Hui; Wen, Charles H. -P.
元智大學 Mar-17 Thermal-controlled Design Flow for the Three-dimensional Dual-mode Forward Error Correction Architecture Shu-Yen Lin; Ho-Yun Su; Cheng-Hung Lin
國立臺灣科技大學 2011 THERMAL-DIFFUSION AND DIFFUSION-THERMO EFFECTS ON NATURAL CONVECTION ALONG AN INCLINED STRETCHING SURFACE IN A POROUS MEDIUM WITH CHEMICAL REACTION Huang, J.S.;Tsai, R.;Huang, K.H.;Huang, C.H.
臺大學術典藏 2018-09-10T07:36:54Z Thermal-driven analog placement considering device matching Lin, P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W.; Lin, P.-H.; Zhang, H.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG
臺大學術典藏 2018-09-10T08:42:36Z Thermal-driven analog placement considering device matching YAO-WEN CHANG; Chang, Y.-W.; Wong, M.D.F.; Lin, M.P.-H.; Zhang, H.; Lin, M.P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W.

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