| 臺大學術典藏 |
2022-04-26T06:17:51Z |
Wafer Bin Map Recognition with Autoencoder-based Data Augmentation in Semiconductor Assembly Process
|
Shen P;Lee C.; Shen P; Lee C.; CHIA-YEN LEE |
| 國立成功大學 |
2022 |
Wafer Bin Map Recognition with Autoencoder-Based Data Augmentation in Semiconductor Assembly Process
|
Shen, P.-C.;Lee, C.-Y. |
| 國立交通大學 |
2014-12-08T15:44:55Z |
Wafer bonding by low-temperature soldering
|
Lee, C; Huang, WF; Shie, JS |
| 國立交通大學 |
2014-12-08T15:40:21Z |
Wafer bonding by Ni-induced crystallization of amorphous silicon
|
Chao, CP; Wu, YCS; Lee, TL; Wang, YH |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
|
Liu, PC; Hou, CY; Wu, YCS |
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
|
Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
|
Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
|
Liu, PC; Hou, CY; Wu, YCS |
| 國立臺灣海洋大學 |
2009-12 |
Wafer Defect Inspection by Neural Analysis of Region Features
|
Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng |
| 國立交通大學 |
2014-12-08T15:09:01Z |
Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index
|
Chao, Li-Chang; Tong, Lee-Ing |
| 國立高雄第一科技大學 |
2012.05 |
Wafer Identification Recognition by Stroke Analysis and Template Matching
|
Hsu, Wei-Chih;Yu, Tsan-Ying;Chen, Kuan-Liang |
| 國立交通大學 |
2017-04-21T06:49:36Z |
Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
|
Hsiao, Sheng-Yi; Lee, Chih-Chun; Chiu, Yi; Shih, Hsi-Fu; Chiou, Jin-Chem; Shieh, Han-Ping D.; Fang, Weileun |
| 中華大學 |
2007 |
Wafer Level MEMS Vertical Probe Card Design
|
林君明; Lin, Jium-Ming |
| 國立交通大學 |
2014-12-16T06:14:01Z |
Wafer level packaging method and a packaging structure using thereof
|
Chen Tsung-Lin; Lien Jui-Chien |
| 中華大學 |
2008 |
Wafer Level Test Vertical Probe Design
|
林君明; Lin, Jium-Ming |
| 元智大學 |
2010-11 |
WAFER LITHOGRAPHIC MASK AND WAFER LITHOGRAPHY METHOD USING THE SAME
|
Shih-Cheng Tsai; Lin R.-B. |
| 元智大學 |
2010-11 |
WAFER LITHOGRAPHIC MASK AND WAFER LITHOGRAPHY METHOD USING THE SAME
|
Shih-Cheng Tsai; Lin R.-B. |
| 朝陽科技大學 |
2006-05 |
Wafer lot output time prediction with a hybrid artificial neural network
|
吳欣潔; Tsai, H.R.; Wu, H.C.; Chen, T. |
| 臺大學術典藏 |
2018-09-10T15:21:11Z |
Wafer map failure pattern recognition and similarity ranking for large-scale data sets
|
Wu, M.-J.;Jang, J.-S.R.;Chen, J.-L.; Wu, M.-J.; Jang, J.-S.R.; Chen, J.-L.; JYH-SHING JANG |
| 國立交通大學 |
2014-12-08T15:43:46Z |
Wafer rework strategies at the photolithography stage
|
Sha, DY; Hsieh, LF; Chen, KJ |
| 中原大學 |
2002-03-26 |
Wafer rinse tank for metal etching and method for using
|
陳志吉;鍾子揚;王思堯;潘昇良 |
| 國立交通大學 |
2017-04-21T06:56:39Z |
Wafer Scale Phase-Engineered 1T-and 2H-MoSe2/Mo Core-Shell 3D-Hierarchical Nanostructures toward Efficient Electrocatalytic Hydrogen Evolution Reaction
|
Qu, Yindong; Medina, Henry; Wang, Sheng-Wen; Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Manikandan, Arumugam; Wang, Kuangye; Shih, Yu-Chuan; Chang, Je-Wei; Kuo, Hao-Chung; Lee, Chi-Yung; Lu, Shih-Yuan; Shen, Guozhen; Wang, Zhiming M.; Chueh, Yu-Lun |
| 國立交通大學 |
2018-08-21T05:56:49Z |
WAFER SIZE MOS2 WITH FEW MONOLAYER SYNTHESIZED BY H2S SULFURIZATION
|
Ho, Yen-Teng; Chu, Yung-Ching; Wei, Lin-Lung; Luong, Tien-Tung; Lin, Chih-Chien; Cheng, Chun-Hung; Hsu, Hung-Ru; Tu, Yung-Yi; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:47:47Z |
Wafer Sort Bitmap Data Analysis Using the PCA-Based Approach for Yield Analysis and Optimization
|
Hsieh, Yeou-lang; Tzeng, Gwo-hshiung; Lin, T. R.; Yu, Hsiao-cheng |
| 國立彰化師範大學 |
2000-04 |
Wafer-Bonded AlGaInP/Au/AuBe/SiO2/Si Light-Emitting Diodes
|
Horng, Ray-Hua; Wuu, Dong-Sing; Wei, Sun-Chin; Tseng, Chung-Yang; Huang, Man-Fang; Chang, Kuo-Hsiung; Liu, Pin-Hui; Lin, Kun-Chuan |
| 國立彰化師範大學 |
1999 |
Wafer-bonded InGaAlP/AuBe/glass Light-emitting Diodes
|
Horng, R. H. ; Wuu, D. S. ; Tseng, H. W. ; Wei, S. C. ; Huang, Man-Fang; Chang, K. H. ; Liu, P. H. ; Lin, K. C. |
| 國立交通大學 |
2014-12-08T15:20:30Z |
WAFER-LEVEL CHIP SCALE FLEXIBLE WIRELESS MICROSYSTEM FABRICATION
|
Chao, Tzu-Yuan; Cheng, Y. T. |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Wafer-level Cu-Cu bonding technology
|
Tang, Ya-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:09Z |
Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application
|
Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:38:24Z |
Wafer-Level Self-Aligned Nano Tubular Structures and Templates for Device Applications
|
Chen, K. N.; Arnold, J. C. |
| 國立交通大學 |
2014-12-08T15:21:13Z |
Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies
|
Lai, Ming-Fang; Li, Shih-Wei; Shih, Jian-Yu; Chen, Kuan-Neng |
| 臺大學術典藏 |
2018-09-10T18:04:51Z |
Wafer-scale bioactive substrate patterning by chemical lift-off lithography
|
Chen, Chong-You;Wang, Chang-Ming;Li, Hsiang-Hua;Chan, Hong-Hseng;Liao, Wei-Ssu; Chen, Chong-You; Wang, Chang-Ming; Li, Hsiang-Hua; Chan, Hong-Hseng; Liao, Wei-Ssu; WEI-SSU LIAO |
| 國立成功大學 |
2024-01-25 |
Wafer-Scale Fabrication of Al/MoS2/Poly-Si Memristors and Insight of Mechanism on the Resistive Switching
|
Li;Kuan-Sheng;Huang;Min-Kun;Wang;Yeong-Her;Tseng;Yuan-Chieh;Su;Chun-Jung |
| 國立交通大學 |
2014-12-08T15:28:21Z |
Wafer-scale MoS2 thin layers prepared by MoO3 sulfurization
|
Lin, Yu-Chuan; Zhang, Wenjing; Huang, Jing-Kai; Liu, Keng-Ku; Lee, Yi-Hsien; Liang, Chi-Te; Chu, Chih-Wei; Li, Lain-Jong |
| 臺大學術典藏 |
2012 |
Wafer-scale MoS2 thin layers prepared by MoO3 sulfurization
|
Lin, Y.-C.; Zhang, W.; Huang, J.-K.; Liu, K.-K.; Lee, Y.-H.; Liang, C.-T.; Chu, C.-W.; Li, L.-J.; CHI-TE LIANG |
| 臺大學術典藏 |
2022-03-22T08:30:37Z |
Wafer-scale nanocracks enable single-molecule detection and on-site analysis
|
Chang Y.-L;Lai I.-C;Lu L.-C;Chang S.-W;Sun A.Y;Wan D;Chen H.-L.; Chang Y.-L; Lai I.-C; Lu L.-C; Chang S.-W; Sun A.Y; Wan D; Chen H.-L.; HSUEN-LI CHEN |
| 臺大學術典藏 |
2022-03-22T08:30:38Z |
Wafer-scale nanocracks enable single-molecule detection and on-site analysis
|
Chang Y.-L;Lai I.-C;Lu L.-C;Chang S.-W;Sun A.Y;Wan D;Chen H.-L.; Chang Y.-L; Lai I.-C; Lu L.-C; Chang S.-W; Sun A.Y; Wan D; Chen H.-L.; HSUEN-LI CHEN |
| 臺大學術典藏 |
2022-01-22T00:04:06Z |
Wafer-scale nanocracks enable single-molecule detection and on-site analysis
|
YU-LING CHANG; Lai, I. Chun; Lu, Li Chia; Chang, Sih Wei; Sun, Aileen Y.; Wan, Dehui; HSUEN-LI CHEN |
| 臺大學術典藏 |
2022-03-22T08:27:38Z |
Wafer-scale nanocracks enable single-molecule detection and on-site analysis
|
Chang Y.-L;Lai I.-C;Lu L.-C;Chang S.-W;Sun A.Y;Wan D;Chen H.-L.; Chang Y.-L; Lai I.-C; Lu L.-C; Chang S.-W; Sun A.Y; Wan D; Chen H.-L.; HSUEN-LI CHEN |
| 國立交通大學 |
2020-03-01 |
Wafer-scale single-crystal hexagonal boron nitride monolayers on Cu (111)
|
Li, Lain-Jong; Chang, Wen-Hao; Yakobson, Boris I.; Fu, Qiang; Zhang, Yanfeng; Chueh, Wei-Chen; Chao, Tzu-Ang; Li, Rongtan; Pan, Shuangyuan; Wong, H. -S. Philip; Wen, Chao-Kai; Tseng, Chien-Chih; Chuu, Chih-Piao; Chen, Tse-An |
| 國立交通大學 |
1970-01-01 |
Wafer-scale single-crystal hexagonal boron nitride monolayers on Cu (111)
|
Li, Lain-Jong; Chang, Wen-Hao; Fu, Qiang; Yakobson, Boris I.; Zhang, Yanfeng; Chueh, Wei-Chen; Chao, Tzu-Ang; Pan, Shuangyuan; Li, Rongtan; Wong, H. -S. Philip; Tseng, Chien-Chih; Chuu, Chih-Piao; Wen, Chao-Kai; Chen, Tse-An |
| 國立交通大學 |
2014-12-08T15:29:01Z |
Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
|
Lee, Sang Hwui; Chen, Kuan-Neng; Lu, James Jian-Qiang |
| 國立聯合大學 |
2010 |
Wafer-transfer Robot for Ultrahigh Vacuum Processing Equipments
|
Hsien-Chung Chen, San-Ming Huang |
| 臺大學術典藏 |
2021-01-27T07:18:10Z |
WAF_TEST
|
Anonymous |
| 臺大學術典藏 |
2021-01-27T07:18:56Z |
WAF_TEST
|
Anonymous |
| 臺大學術典藏 |
2021-01-27T07:20:47Z |
WAF_TEST
|
Anonymous |
| 臺大學術典藏 |
2021-01-27T07:46:49Z |
WAF_TEST
|
Anonymous |
| 臺大學術典藏 |
2021-02-05T04:44:21Z |
Wage and employment effects of privatization in Taiwan: A longitudinal data analysis
|
Lin, B.-H.;Huang, F.-M.; Lin, B.-H.; Huang, F.-M.; FUNG-MEY HUANG |
| 臺大學術典藏 |
2018-09-10T07:45:14Z |
Wage Bargaining and Strategic Delegation Under Unionized Duopoly
|
Liao, Pei-Cheng; Liao, Pei-Cheng; PEI-CHENG LIAO |
| 國立臺灣大學 |
2009 |
Wage Bargaining and Strategic Delegation Under Unionized Duopoly.
|
Liao, Pei-Cheng |
