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Institution	Date	Title	Author
國立彰化師範大學	1999	Wafer-bonded InGaAlP/AuBe/glass Light-emitting Diodes	Horng, R. H. ; Wuu, D. S. ; Tseng, H. W. ; Wei, S. C. ; Huang, Man-Fang; Chang, K. H. ; Liu, P. H. ; Lin, K. C.
國立交通大學	2014-12-08T15:20:30Z	WAFER-LEVEL CHIP SCALE FLEXIBLE WIRELESS MICROSYSTEM FABRICATION	Chao, Tzu-Yuan; Cheng, Y. T.
國立交通大學	2014-12-08T15:21:23Z	Wafer-level Cu-Cu bonding technology	Tang, Ya-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng
國立交通大學	2017-04-21T06:49:09Z	Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application	Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng
國立交通大學	2014-12-08T15:38:24Z	Wafer-Level Self-Aligned Nano Tubular Structures and Templates for Device Applications	Chen, K. N.; Arnold, J. C.
國立交通大學	2014-12-08T15:21:13Z	Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies	Lai, Ming-Fang; Li, Shih-Wei; Shih, Jian-Yu; Chen, Kuan-Neng
臺大學術典藏	2018-09-10T18:04:51Z	Wafer-scale bioactive substrate patterning by chemical lift-off lithography	Chen, Chong-You;Wang, Chang-Ming;Li, Hsiang-Hua;Chan, Hong-Hseng;Liao, Wei-Ssu; Chen, Chong-You; Wang, Chang-Ming; Li, Hsiang-Hua; Chan, Hong-Hseng; Liao, Wei-Ssu; WEI-SSU LIAO
國立成功大學	2024-01-25	Wafer-Scale Fabrication of Al/MoS2/Poly-Si Memristors and Insight of Mechanism on the Resistive Switching	Li;Kuan-Sheng;Huang;Min-Kun;Wang;Yeong-Her;Tseng;Yuan-Chieh;Su;Chun-Jung
國立交通大學	2014-12-08T15:28:21Z	Wafer-scale MoS2 thin layers prepared by MoO3 sulfurization	Lin, Yu-Chuan; Zhang, Wenjing; Huang, Jing-Kai; Liu, Keng-Ku; Lee, Yi-Hsien; Liang, Chi-Te; Chu, Chih-Wei; Li, Lain-Jong
臺大學術典藏	2012	Wafer-scale MoS2 thin layers prepared by MoO3 sulfurization	Lin, Y.-C.; Zhang, W.; Huang, J.-K.; Liu, K.-K.; Lee, Y.-H.; Liang, C.-T.; Chu, C.-W.; Li, L.-J.; CHI-TE LIANG

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