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Showing items 919091-919115 of 2351361 (94055 Page(s) Totally)
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| 國立臺灣大學 |
2007-09 |
??W?Wsf^UPi
|
f; eY |
| 國立臺灣大學 |
1992 |
?w?r酮藥物之藥理學研究
|
蔡明正; Tsai, Ming-Cheng |
| 國立臺灣大學 |
1992 |
?w?r酮類衍生物對神經冗傳導之作用
|
蔡明正; Tsai, Ming-Cheng |
| 國立成功大學 |
2018-07-05 |
W2/過氧化氫液旋式噴注器之設計與分析
|
莊博凱; Chuang, Po-Kai |
| 國立成功大學 |
2018-07-05 |
W2/過氧化氫液旋式噴注器之設計與分析
|
莊博凱; Chuang, Po-Kai |
| 臺大學術典藏 |
2020-07-10T08:16:29Z |
W4M - A tool to simplify psychophysical research
|
Carney, T.;Hill, T.;Chen, C.-C.; Carney, T.; Hill, T.; Chen, C.-C.; CHIEN-CHUNG CHEN |
| 臺大學術典藏 |
2021-08-20T08:19:55Z |
W?nderlich syndrome from lupus-associated vasculitis
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CHIA-TER CHAO; Wang W.-J.; Ting J.-T. |
| 元智大學 |
2007-12 |
Wabi-Sabi
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謝慧中 |
| 元智大學 |
2007-12 |
Wabi-Sabi
|
謝慧中 |
| 國立政治大學 |
1996 |
WAC'96
|
趙玉 |
| 國立臺灣體育運動大學 |
2000-11-15 |
WADA(國際反禁藥組織)計劃在7城市設址
|
未知 |
| 國立臺灣科技大學 |
1999 |
WADGPS廣域修正信號之研究
|
陳志忠 |
| 臺大學術典藏 |
2022-04-26T06:17:51Z |
Wafer Bin Map Recognition with Autoencoder-based Data Augmentation in Semiconductor Assembly Process
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Shen P;Lee C.; Shen P; Lee C.; CHIA-YEN LEE |
| 國立成功大學 |
2022 |
Wafer Bin Map Recognition with Autoencoder-Based Data Augmentation in Semiconductor Assembly Process
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Shen, P.-C.;Lee, C.-Y. |
| 國立交通大學 |
2014-12-08T15:44:55Z |
Wafer bonding by low-temperature soldering
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Lee, C; Huang, WF; Shie, JS |
| 國立交通大學 |
2014-12-08T15:40:21Z |
Wafer bonding by Ni-induced crystallization of amorphous silicon
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Chao, CP; Wu, YCS; Lee, TL; Wang, YH |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
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Liu, PC; Hou, CY; Wu, YCS |
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
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Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
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Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
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Liu, PC; Hou, CY; Wu, YCS |
| 國立臺灣海洋大學 |
2009-12 |
Wafer Defect Inspection by Neural Analysis of Region Features
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Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng |
| 國立交通大學 |
2014-12-08T15:09:01Z |
Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index
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Chao, Li-Chang; Tong, Lee-Ing |
| 國立高雄第一科技大學 |
2012.05 |
Wafer Identification Recognition by Stroke Analysis and Template Matching
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Hsu, Wei-Chih;Yu, Tsan-Ying;Chen, Kuan-Liang |
| 國立交通大學 |
2017-04-21T06:49:36Z |
Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
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Hsiao, Sheng-Yi; Lee, Chih-Chun; Chiu, Yi; Shih, Hsi-Fu; Chiou, Jin-Chem; Shieh, Han-Ping D.; Fang, Weileun |
| 中華大學 |
2007 |
Wafer Level MEMS Vertical Probe Card Design
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林君明; Lin, Jium-Ming |
Showing items 919091-919115 of 2351361 (94055 Page(s) Totally)
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