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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:05:51Z	WETTABILITY IN ZRO2-NI AND ZRO2-CU BONDING	DUH, JG; CHIEN, WS; CHIOU, BS
臺大學術典藏	2018-09-10T09:13:04Z	Wettability of amorphous diamond-like carbons deposited on Si and PMMA in pulse-modulated plasmas	Sung, T.-L.;Yang, J.H.-C.;Teii, K.;Teii, S.;Liu, C.-M.;Tseng, W.-Y.;Lin, L.-D.;Ono, S.; LI-DEH LIN
臺大學術典藏	2018-09-10T09:21:19Z	Wettability of Amorphous Diamond-Like Carbons Deposited on Si and PMMA in Pulse-Modulated Plasmas	Ta-Lun Sung;Jason Hsiao-Chun Yang;Kungen Teii;Shinriki Teii;Chung-Ming Liu;Wan-Yu Tseng;Li-Deh Lin;Shigeru Ono; LI-DEH LIN
臺大學術典藏	2021-07-05T06:23:13Z	Wettability of amorphous diamond-like carbons deposited on Si and PMMA in pulse-modulated plasmas	Sung T.-L.; Yang J.H.-C.; Teii K.; Teii S.; Liu C.-M.; Tseng W.-Y.; LI-DEH LIN; Ono S.
臺大學術典藏	2021-07-06T03:43:51Z	Wettability of amorphous diamond-like carbons deposited on Si and PMMA in pulse-modulated plasmas	Sung T.-L.; Yang J.H.-C.; Teii K.; Teii S.; Liu C.-M.; WAN-YU TSENG; Lin L.-D.; Ono S.
國立交通大學	2014-12-08T15:43:53Z	Wettability of electroless Ni in the under bump metallurgy with lead free solder	Young, BL; Duh, JG; Chiou, BS
國立交通大學	2014-12-08T15:17:40Z	Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder	Lin, YC; Duh, JG; Chiou, BS
臺大學術典藏	2020-01-14T05:15:50Z	Wettability of laser-textured copper surface after a water-bath process	Cheng, Hui-Chung; Chang, Tien-Li; Lin, Chao-Sung; PING-HEI CHEN
國立臺灣科技大學	2020	Wettability, electron work function and corrosion behavior of CoCrFeMnNi high entropy alloy films	Wang, Z.;Li, D.Y.;Yao, Yao Y.-Y.;Kuo, Y.-L.;Hsueh, C.-H.
國立交通大學	2014-12-16T06:15:27Z	Wetted wall venturi scrubber with a 2-stage venturi throat	Tsai, Chuen-Jinn

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