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Showing items 919586-919595 of 2346275 (234628 Page(s) Totally) << < 91954 91955 91956 91957 91958 91959 91960 91961 91962 91963 > >> View [10|25|50] records per page
| 國立交通大學 |
2014-12-08T15:43:53Z |
Wettability of electroless Ni in the under bump metallurgy with lead free solder
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Young, BL; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:17:40Z |
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
|
Lin, YC; Duh, JG; Chiou, BS |
| 臺大學術典藏 |
2020-01-14T05:15:50Z |
Wettability of laser-textured copper surface after a water-bath process
|
Cheng, Hui-Chung; Chang, Tien-Li; Lin, Chao-Sung; PING-HEI CHEN |
| 國立臺灣科技大學 |
2020 |
Wettability, electron work function and corrosion behavior of CoCrFeMnNi high entropy alloy films
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Wang, Z.;Li, D.Y.;Yao, Yao Y.-Y.;Kuo, Y.-L.;Hsueh, C.-H. |
| 國立交通大學 |
2014-12-16T06:14:00Z |
Wetted wall venturi scrubber with a 2-stage venturi throat
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Tsai Chuen-Jinn |
| 國立交通大學 |
2014-12-16T06:15:01Z |
WETTED WALL VENTURI SCRUBBER WITH A 2-STAGE VENTURI THROAT
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TSAI Chuen-Jinn |
| 國立交通大學 |
2014-12-16T06:15:27Z |
Wetted wall venturi scrubber with a 2-stage venturi throat
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Tsai, Chuen-Jinn |
| 國立臺灣科技大學 |
2015 |
Wetting and drying on matric suction of compacted cohesive soil
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Lin, H.-D.;Wang, C.-C.;Kung, J.H.S. |
| 國立成功大學 |
2019 |
Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys
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Sarwono, D.;Lin, K.-L. |
| 國立臺灣科技大學 |
2007 |
Wetting and sealing of interface between 7056 Glass and Kovar alloy
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Chern, T.-S.;Tsai, H.-L. |
Showing items 919586-919595 of 2346275 (234628 Page(s) Totally) << < 91954 91955 91956 91957 91958 91959 91960 91961 91962 91963 > >> View [10|25|50] records per page
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