| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 大葉大學 |
2013-01 |
Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition.
|
HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT |
| 大葉大學 |
2013-10-19 |
Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain.
|
Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang |
| 國立臺灣大學 |
2003-10 |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP |
| 臺大學術典藏 |
2018-09-10T04:25:44Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN |
| 臺大學術典藏 |
2018-09-10T04:25:46Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE |
| 臺大學術典藏 |
2018-09-10T04:25:50Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE |
| 臺大學術典藏 |
2021-07-05T07:35:52Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 臺大學術典藏 |
2021-07-26T06:53:20Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN |
| 臺大學術典藏 |
2021-07-05T03:41:30Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 國立成功大學 |
2008-03 |
Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation
|
Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2001-01-05 |
Bond types of molecular orbitals and the photoelectron spectrum
|
Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang |
| 國立成功大學 |
2020 |
Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3
|
Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S. |
| 國立成功大學 |
2016-01 |
Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures
|
Lin, Wallace |
| 國立臺灣科技大學 |
2017 |
Bond-slip responses of stainless reinforcing bars in grouted ducts
|
Zhou, Y;Ou, Y.-C;Lee, G.C. |
| 臺大學術典藏 |
2018-09-10T06:25:23Z |
Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues
|
Kawakami, T. and Kamo, M. and Takamoto, K. and Miyazaki, K. and Chow, L.-P. and Ueno, Y. and Tsugita, A.; LU-PING CHOW |
| 臺大學術典藏 |
2020-01-22T04:48:05Z |
Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues
|
Kawakami T.; Kamo M.; Takamoto K.; Miyazaki K.; LU-PING CHOW; Ueno Y.; Tsugita A. |
| 國立交通大學 |
2014-12-08T15:03:31Z |
BOND-STRUCTURE CHANGES OF LIQUID-PHASE DEPOSITED OXIDE (SIO2-XFX) ON N2 ANNEALING
|
YEH, CF; CHEN, CL; LUR, W; YEN, PW |
| 義守大學 |
2007-10 |
Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame
|
Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh |
| 中華大學 |
2008 |
Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder
|
陳精一; Chen, Ching-I |
| 國立臺灣大學 |
2000 |
Bonded Amalgam Restorations: Using a Glass-Ionomer as an Adhesive Liner
|
陳瑞松; 林俊彬; CHEN, RUEY-SONG; LIN, CHUN-PIN |
| 臺大學術典藏 |
2018-09-10T03:24:21Z |
Bonded amalgam restorations: using a glass-ionomer as an adhesive liner.
|
CHUN-PIN LIN; Chen, R.S.;Liu, C.C.;Cheng, M.R.;Lin, C.P. |
| 臺大學術典藏 |
2021-07-26T06:53:24Z |
Bonded amalgam restorations: using a glass-ionomer as an adhesive liner.
|
Chen R.S.; Liu C.C.; Cheng M.R.; CHUN-PIN LIN |
| 國立交通大學 |
2014-12-08T15:10:06Z |
Bonding anisotropy in multiferroic TbMnO(3) probed by polarization dependent x-ray absorption spectroscopy
|
Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z. |
| 國立臺灣大學 |
2009-01 |
Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy
|
Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R.S. |
| 國立交通大學 |
2019-04-02T05:59:44Z |
Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy
|
Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z. |
| 臺大學術典藏 |
2018-09-10T07:28:09Z |
Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy
|
Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.; Chen, J. M.; RU-SHI LIUet al. |
| 國立臺灣大學 |
2011 |
Bonding between Chromium Atoms in Metal-String Complexes from Raman Spectra and Surface-Enhanced Raman Scattering: Vibrational Frequency of the Chromium Quadruple Bond
|
Huang, Yu-Min; Tsai, Huei-Ru; Lai, Szu-Hsueh; Lee, Sheng Jui; Chen, I-Chia; Huang, Cheng Liang; Peng, Shie-Ming; Wang, Wen-Zhen |
| 臺大學術典藏 |
2018-09-10T08:38:27Z |
Bonding between chromium atoms in metal-string complexes from Raman spectra and surface-enhanced Raman scattering: Vibrational frequency of the chromium quadruple bond
|
Huang, Y.-M.;Tsai, H.-R.;Lai, S.-H.;Lee, S.J.;Chen, I.-C.;Huang, C.L.;Peng, S.-M.;Wang, W.-Z.; Huang, Y.-M.; Tsai, H.-R.; Lai, S.-H.; Lee, S.J.; Chen, I.-C.; Huang, C.L.; Peng, S.-M.; Wang, W.-Z.; SHIE-MING PENG |
| 臺北醫學大學 |
1995 |
Bonding Characteristic of CD Spinal Instrumentation Component
|
黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立臺灣海洋大學 |
2018-05 |
Bonding characteristics and chemical inertness of Zr–Si–N coatings with a high Si content in glass molding
|
Li-Chun Chang; Yu-Zhe Zheng; Yung-I Chen; Shan-Chun Chang; Bo-Wei Liu |
| 國立臺灣大學 |
2001-01 |
Bonding Characterization and Nano-indentation Study of Amorphous SiCxNy Films with and without Hydrogen Incorporation
|
Lo, H. C.; Wu, J.-J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C. |
| 國立臺灣科技大學 |
2001 |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
K.H. Chen;L.C. Chen;S.T. Lin;H.C. Lo;C.Y. Wen;T.S. Wong;J.J. Wu |
| 臺大學術典藏 |
2020-01-06T03:11:08Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
Lo, H. C.; Wu, J. J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C.; SHIANG-TAI LIN |
| 臺大學術典藏 |
2022-08-09T03:50:44Z |
Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation
|
Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; LI-CHYONG CHEN |
| 國立臺灣大學 |
2002-11 |
Bonding Characterization, Density Measurement and Thermal Diffusivity Studies of Amorphous Silicon Carbon Nitride and Boron Carbon Nitride Thin Films
|
Chattopadhyay S; Chen LC; Chien SC |
| 臺大學術典藏 |
2020-01-06T03:11:07Z |
Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films
|
Chattopadhyay, S.; Chen, L. C.; Chien, S. C.; Lin, S. T.; Chen, K. H.; SHIANG-TAI LIN |
| 朝陽科技大學 |
2010 |
BONDING FRACTIONATION OF ANIONIC / CATIONIC CHROMIUM IN SOIL AND INFLUENCE OF pH ON SOIL WASHING EFFICIENCY
|
章日行; S. F. Cheng; Y. T. Tu; C. M. Kao; J. H. Chang; C. Y. Huang ; C.W. Chen |
| 國立成功大學 |
2000-08-18 |
Bonding geometry and reactivity of methoxy and ethoxy groups adsorbed on powdered TiO2
|
Wu, Wen-Chun; Chuang, Chih-Chung; Lin, Jong-Liang |
| 臺大學術典藏 |
2003 |
Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4)
|
Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H. |
| 國立交通大學 |
2014-12-08T15:37:06Z |
Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures
|
Liu, PC; Wu, YCS |
| 臺北醫學大學 |
1994 |
Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations
|
黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M. |
| 國立交通大學 |
2014-12-16T06:13:59Z |
Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
|
Chen Kuan-Neng; Hsu Sheng-Yao |
| 國立交通大學 |
2014-12-16T06:15:00Z |
BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF
|
CHEN KUAN-NENG; Hsu Sheng-Yao |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen, Guan Ren; WEI-HSING TUAN |
| 臺大學術典藏 |
2022-03-22T08:30:54Z |
Bonding microwave absorbing ferrites to thermal conducting copper
|
Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN |
