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显示项目 229811-229860 / 2348638 (共46973页)
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机构 日期 题名 作者
國立成功大學 2001-01-05 Bond types of molecular orbitals and the photoelectron spectrum Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang
國立成功大學 2020 Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3 Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S.
國立成功大學 2016-01 Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures Lin, Wallace
國立臺灣科技大學 2017 Bond-slip responses of stainless reinforcing bars in grouted ducts Zhou, Y;Ou, Y.-C;Lee, G.C.
臺大學術典藏 2018-09-10T06:25:23Z Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues Kawakami, T. and Kamo, M. and Takamoto, K. and Miyazaki, K. and Chow, L.-P. and Ueno, Y. and Tsugita, A.; LU-PING CHOW
臺大學術典藏 2020-01-22T04:48:05Z Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues Kawakami T.; Kamo M.; Takamoto K.; Miyazaki K.; LU-PING CHOW; Ueno Y.; Tsugita A.
國立交通大學 2014-12-08T15:03:31Z BOND-STRUCTURE CHANGES OF LIQUID-PHASE DEPOSITED OXIDE (SIO2-XFX) ON N2 ANNEALING YEH, CF; CHEN, CL; LUR, W; YEN, PW
義守大學 2007-10 Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh
中華大學 2008 Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder 陳精一; Chen, Ching-I
國立臺灣大學 2000 Bonded Amalgam Restorations: Using a Glass-Ionomer as an Adhesive Liner 陳瑞松; 林俊彬; CHEN, RUEY-SONG; LIN, CHUN-PIN
臺大學術典藏 2018-09-10T03:24:21Z Bonded amalgam restorations: using a glass-ionomer as an adhesive liner. CHUN-PIN LIN; Chen, R.S.;Liu, C.C.;Cheng, M.R.;Lin, C.P.
臺大學術典藏 2021-07-26T06:53:24Z Bonded amalgam restorations: using a glass-ionomer as an adhesive liner. Chen R.S.; Liu C.C.; Cheng M.R.; CHUN-PIN LIN
國立交通大學 2014-12-08T15:10:06Z Bonding anisotropy in multiferroic TbMnO(3) probed by polarization dependent x-ray absorption spectroscopy Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.
國立臺灣大學 2009-01 Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R.S.
國立交通大學 2019-04-02T05:59:44Z Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy Chen, J. M.; Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.
臺大學術典藏 2018-09-10T07:28:09Z Bonding anisotropy in multiferroic TbMnO3 probed by polarization dependent x-ray absorption spectroscopy Lee, J. M.; Chen, C. K.; Chou, T. L.; Lu, K. T.; Haw, S. C.; Liang, K. S.; Chen, C. T.; Jeng, H. T.; Huang, S. W.; Yang, T. J.; Shen, C. C.; Liu, R. S.; Lin, J. Y.; Hu, Z.; Chen, J. M.; RU-SHI LIUet al.
國立臺灣大學 2011 Bonding between Chromium Atoms in Metal-String Complexes from Raman Spectra and Surface-Enhanced Raman Scattering: Vibrational Frequency of the Chromium Quadruple Bond Huang, Yu-Min; Tsai, Huei-Ru; Lai, Szu-Hsueh; Lee, Sheng Jui; Chen, I-Chia; Huang, Cheng Liang; Peng, Shie-Ming; Wang, Wen-Zhen
臺大學術典藏 2018-09-10T08:38:27Z Bonding between chromium atoms in metal-string complexes from Raman spectra and surface-enhanced Raman scattering: Vibrational frequency of the chromium quadruple bond Huang, Y.-M.;Tsai, H.-R.;Lai, S.-H.;Lee, S.J.;Chen, I.-C.;Huang, C.L.;Peng, S.-M.;Wang, W.-Z.; Huang, Y.-M.; Tsai, H.-R.; Lai, S.-H.; Lee, S.J.; Chen, I.-C.; Huang, C.L.; Peng, S.-M.; Wang, W.-Z.; SHIE-MING PENG
臺北醫學大學 1995 Bonding Characteristic of CD Spinal Instrumentation Component 黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M.
國立臺灣海洋大學 2018-05 Bonding characteristics and chemical inertness of Zr–Si–N coatings with a high Si content in glass molding Li-Chun Chang; Yu-Zhe Zheng; Yung-I Chen; Shan-Chun Chang; Bo-Wei Liu
國立臺灣大學 2001-01 Bonding Characterization and Nano-indentation Study of Amorphous SiCxNy Films with and without Hydrogen Incorporation Lo, H. C.; Wu, J.-J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C.
國立臺灣科技大學 2001 Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation K.H. Chen;L.C. Chen;S.T. Lin;H.C. Lo;C.Y. Wen;T.S. Wong;J.J. Wu
臺大學術典藏 2020-01-06T03:11:08Z Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation Lo, H. C.; Wu, J. J.; Wen, C. Y.; Wong, T. S.; Lin, S. T.; Chen, K. H.; Chen, L. C.; SHIANG-TAI LIN
臺大學術典藏 2022-08-09T03:50:44Z Bonding characterization and nano-indentation study of the amorphous SiCxNy films with and without hydrogen incorporation Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; Lo H.C; Wu J.J; Wen C.Y; Wong T.S; Lin S.T; Chen K.H; Chen L.C; LI-CHYONG CHEN
國立臺灣大學 2002-11 Bonding Characterization, Density Measurement and Thermal Diffusivity Studies of Amorphous Silicon Carbon Nitride and Boron Carbon Nitride Thin Films Chattopadhyay S; Chen LC; Chien SC
臺大學術典藏 2020-01-06T03:11:07Z Bonding characterization, density measurement, and thermal diffusivity studies of amorphous silicon carbon nitride and boron carbon nitride thin films Chattopadhyay, S.; Chen, L. C.; Chien, S. C.; Lin, S. T.; Chen, K. H.; SHIANG-TAI LIN
朝陽科技大學 2010 BONDING FRACTIONATION OF ANIONIC / CATIONIC CHROMIUM IN SOIL AND INFLUENCE OF pH ON SOIL WASHING EFFICIENCY 章日行; S. F. Cheng; Y. T. Tu; C. M. Kao; J. H. Chang; C. Y. Huang ; C.W. Chen
國立成功大學 2000-08-18 Bonding geometry and reactivity of methoxy and ethoxy groups adsorbed on powdered TiO2 Wu, Wen-Chun; Chuang, Chih-Chung; Lin, Jong-Liang
臺大學術典藏 2003 Bonding interaction, low-lying states and excited charge-transfer states of pyridine-metal clusters: Pyridine-Mn (M = Cu, Ag, Au; n = 2-4) Wu, D. Y.; Hayashi, M.; Chang, C. H.; Liang, K. K.; Lin, S. H.
國立交通大學 2014-12-08T15:37:06Z Bonding line-patterned In0.5Ga0.5P layer on GaP substrate for the successive growth of high-brightness LED structures Liu, PC; Wu, YCS
臺北醫學大學 1994 Bonding Mechanism Between the Components of the Cortrel Dubousset Instrumentations 黃豪銘; Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M.
國立交通大學 2014-12-16T06:13:59Z Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof Chen Kuan-Neng; Hsu Sheng-Yao
國立交通大學 2014-12-16T06:15:00Z BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF CHEN KUAN-NENG; Hsu Sheng-Yao
臺大學術典藏 2021-09-21T23:19:31Z Bonding microwave absorbing ferrites to thermal conducting copper Chen, Guan Ren; WEI-HSING TUAN
臺大學術典藏 2022-03-22T08:27:54Z Bonding microwave absorbing ferrites to thermal conducting copper Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN
臺大學術典藏 2022-03-22T08:30:54Z Bonding microwave absorbing ferrites to thermal conducting copper Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN
臺大學術典藏 2022-03-22T08:30:56Z Bonding microwave absorbing ferrites to thermal conducting copper Chen G.-R;Tuan W.-H.; Chen G.-R; Tuan W.-H.; WEI-HSING TUAN
國立成功大學 2009-11 Bonding of a complicated polymer microchannel system for study of pressurized liquid flow characteristics with the electric double effect Ko, H. S.; Gau, C.
臺大學術典藏 2019-11-27T02:02:19Z Bonding of copper pillars using electroless Au plating C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A.; Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:13Z Bonding of Copper Pillars Using Electroless Cu Plating C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y.; Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2019-11-27T02:02:24Z Bonding of copper pillars using electroless Ni plating C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
國立臺灣大學 1992-05 Bonding of Structural Plywood with PMF System 蔡金木; Tsai, Ching-Mu
中國文化大學 2012-11 Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters Hung, YM (Hung, Yu-Ming); Ho, GM (Ho, Gong-Ming); Zhang, ZF (Zhang, Zhen-Feng)
中國文化大學 2012-09-19 Bonding Properties and Isomeric Conversion Pathways from Exohedral to Endohedral BeGe8 Clusters Hung, Yu-Ming; Ho, Gong-Ming; Zhang, Zhen-Feng
中國文化大學 2012 Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters 洪祐明等著
中國文化大學 2012 Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters 洪祐明
中國文化大學 2013-03-15 Bonding properties and isomeric conversion pathways of singlet BeSi4 clusters Hung, YM (Hung, Yu-Ming); Chen, SS (Chen, Shih-Sun); Huang, YC (Huang, Yen-Chang)
淡江大學 2005-04-18 Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; 彭維鋒; Pong, W. F.; Tsai, M. H.; Jong, C. A.; Chin, T. S.
淡江大學 2005-04 Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; Pong, W. F.; Tsai, M.-H.; Jong, C. A.; Chin, T. S.
國立中山大學 2005 Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy J.C. Jan;P.D. Babu;H.M. Tsai;C.W. Pao;J.W. Chiou;S.C. Ray;K.P. Krishna Kumar;W.F. Pong;M.H. Tsai;C.A. Jong;T.S. Chin

显示项目 229811-229860 / 2348638 (共46973页)
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