| 國立臺灣大學 |
2011 |
Chip Implementation with a Combined Wireless Temperature Sensor and Reference Devices Based on the DZTC Principle
|
Chang, Ming-Hui; Huang, Yu-Jie; Huang, Han-Pang; Lu, Shey-Shi |
| 臺大學術典藏 |
2020-01-13T08:18:21Z |
Chip implementation with a combined wireless temperature sensor and reference devices based on the DZTC principle
|
Chang, M.-H.; Huang, Y.-J.; Huang, H.-P.; Lu, S.-S.; HAN-PANG HUANG |
| 國立臺灣大學 |
2010 |
Chip implementation with combined temperature sensor and reference devices based on DZTC principle
|
Chang, M-H.; Liu, C-P.; Huang, H-P. |
| 臺大學術典藏 |
2020-01-13T08:18:25Z |
Chip implementation with combined temperature sensor and reference devices based on DZTC principle
|
Chang, M.-H.; Liu, C.-P.; Huang, H.-P.; HAN-PANG HUANG |
| 亞洲大學 |
2013.10 |
CHIP inhibits lipopolysaccharide-induced cardiomyocyte hypertrophy by promoting the proteasomal degradation of NFATc3.
|
黃志揚;HUANG, CHIH-YANG |
| 國立交通大學 |
2014-12-08T15:26:06Z |
Chip interleaving for performance improvement of coded DS-CDMA systems in Rayleigh fading channels
|
Lin, YN; Lin, DW |
| 臺大學術典藏 |
2020-06-16T06:35:54Z |
Chip Last Fan-Out Packaging for Millimeter Wave Application
|
Lu, H.-C.;Wang, Y.-H.;Leou, J.-L.;Chan, H.;Chen, S.; Lu, H.-C.; Wang, Y.-H.; Leou, J.-L.; Chan, H.; Chen, S.; HSIN-CHIA LU |
| 國立成功大學 |
2018-11-26 |
Chip packaging device and alignment bonding method thereof
|
Hsieh, Po-Tsung;Yang, Chia-Ming;Chen, In-Gann;Tseng, Shih-Wen;Tsai, Ya-Wen;Chuang, Ya-Wen |
| 臺大學術典藏 |
2021-09-02T00:04:08Z |
Chip Performance Prediction Using Machine Learning Techniques
|
Su M.-Y;Lin W.-C;Kuo Y.-T;Li C.-M;Fang E.J.-W;Hsueh S.S.-Y.; Su M.-Y; Lin W.-C; Kuo Y.-T; Li C.-M; Fang E.J.-W; Hsueh S.S.-Y.; CHIEN-MO LI |
| 義守大學 |
2013-08 |
Chip placement design in capacitive proximity communication
|
Yu-Jung Huang |
| 元智大學 |
2008-01 |
Chip placement in a reticle for multiple-project wafer fabrication
|
林榮彬; Meng-Chiou Wu; Shih-Cheng Tsai |
| 國立臺灣科技大學 |
2009 |
Chip size estimation for effective blending ratio of slurries in wire sawing of silicon wafers for solar cells
|
Chen C.-C.A.; Kuo B.-L.; Liang J.-S. |
| 國立成功大學 |
2014/11/12 |
Chip-based adaptive skin color detection using trajectory constraints on hue
|
Chen, Pei-Yin |
| 國立臺灣海洋大學 |
2017-05 |
Chip-based digital surface plasmon resonance sensing platform for ultrasensitive biomolecular detection
|
Pei-Kuen Wei; Ming-Yang Pan; Kuang-Li Lee; Likarn Wang |
| 國立成功大學 |
2005-05 |
Chip-based microfluidic devices coupled with electrospray ionization-mass spectrometry
|
Sung, Wang-Chou; Makamba, Honest; Chen, Shu-Hui |
| 國立交通大學 |
2014-12-08T15:24:14Z |
Chip-based protein-protein interaction studied by atomic force microscopy
|
Kao, Feng-Sheng; Ger, Waylon; Pan, Yun-Ru; Yu, Hui-Chen; Hsu, Ray-Quen; Chen, Hueih-Min |
| 國立高雄師範大學 |
2004 |
Chip-capacitor loaded dual-band microstrip antenna
|
Chih-Yu Huang;H. F. Tsai;M. H. Lin; 黃智裕 |
| 國立臺灣大學 |
2008-12 |
Chip-CE/MS using a flat low-sheath-flow interface
|
Li, F. A.; Huang, J. L.; Her, G. R. |
| 中華大學 |
2010 |
Chip-implementation of a self-tuning nonlinear function control for DC-DC converters
|
許駿飛; Hsu, Chun-Fei |
| 元智大學 |
2010-03 |
Chip-implementation of a self-tuning nonlinear function control for DC-DC converters
|
林志民; Chun-Fei Hsu; Shuen-Liang Wang; Ming-Chia Li |
| 國立中山大學 |
2009-04 |
Chip-inductor-embedded small-size printed strip monopole for WWAN operation in the mobile phone
|
T.W. Kang;K.L. Wong |
| 國立交通大學 |
2014-12-08T15:25:56Z |
Chip-interleaved WCDMA with parallel-interference-cancellation receiver in multipath Rayleigh fading channels
|
Lin, YN; Lin, DW |
| 國立暨南國際大學 |
2009 |
Chip-Level Channel Estimation for the Downlink of a WCDMA System in Very High Mobility Environment?
|
張進福; Chang, JF |
| 國立交通大學 |
2019-08-02T02:24:17Z |
Chip-Level Characterization and RTN-Induced Error Mitigation beyond 20nm Floating Gate Flash Memory
|
Lin, T. W.; Ku, S. H.; Cheng, C. H.; Lee, C. W.; Ijen-Huang; Tsai, Wen-Jer; Lu, T. C.; Lu, W. P.; Chen, K. C.; Wang, Tahui; Lu, Chih-Yuan |
| 臺大學術典藏 |
2018-09-10T04:59:35Z |
Chip-level model of switching noise coupling on integrated system combining package and printed circuit board
|
S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU |
