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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 254446-254455 / 2346788 (共234679页)
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| 國立交通大學 |
2014-12-12T03:05:59Z |
Chip-on-Glass（COG）彈性凸塊電性與可靠度之研究
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林宗寬; Chung Kuang Lin; 陳智; Chih Chen |
| 臺大學術典藏 |
2018-09-10T07:02:57Z |
Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective
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Lin, Y.-H.; Chou, J.; Lu, Y.-C.; Wu, T.-L.; Chen, H.-S.; YI-CHANG LU; HSIN-SHU CHEN |
| 國立高雄師範大學 |
2005-06 |
Chip-package-board codesign of highly linear 3G-CDMA upconverter modules
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Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu; 吳建銘 |
| 國立中山大學 |
2005-06 |
Chip-package-board codesign of highly linear 3G-CDMA upconverter modules
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F.Y. Han;J.M. Wu;T.S. Horng;C.C. Tu;R. Chen;C.H. Chu |
| 國立高雄師範大學 |
2005-10 |
Chip-Package-Board Codesign of W-CDMA RFICs
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Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘 |
| 國立中山大學 |
2005-10 |
Chip-Package-Board Codesign of W-CDMA RFICs
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F.Y. Han;J.M. Wu;T.S. Horng |
| 國立交通大學 |
2017-04-21T06:49:57Z |
Chip-Scale Nanophotonic Chemical and Biological Sensors using CMOS Process
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Bollschweiler, Lincoln; English, Alex; Baker, R. Jacob; Kuang, Wan; Chang, Zi-Chang; Shih, Ming-Hsiung; Knowlton, William B.; Hughes, William L.; Lee, Jeunghoon; Yurke, Bernard; Cockerham, Nankyung Suh; Tyree, Vance C. |
| 國立交通大學 |
2019-04-03T06:47:17Z |
Chip-size wavelength detector based on a gradient grating period guided-mode resonance filter
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Lin, Hsin-An; Hsu, Hsin-Yun; Huang, Cheng-Sheng |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
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Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2014-12-16T06:15:14Z |
CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDUCTIVE LAYER
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SU Chau-Chin; Ho Ying-Chieh; Huang Po-Hsiang |
显示项目 254446-254455 / 2346788 (共234679页)
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每页显示[10|25|50]项目
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