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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 298506-298515 / 2348487 (共234849页)
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每页显示[10|25|50]项目
| 國立臺灣科技大學 |
2007 |
Curing behavior of anionic poly(urethane urea) dispersions crosslinked with partially methylated melamine formaldehyde
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Chiu, H.-T.;Huang, Y.-C.;Chiang, C.-H. |
| 國立交通大學 |
2014-12-08T15:03:05Z |
CURING BEHAVIOR OF FULLY AND SEMIINTERPENETRATING POLYMER NETWORKS BASED ON EPOXY AND ACRYLICS
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LIN, MS; LEE, ST |
| 國立臺灣大學 |
1996-01 |
Curing Behavior, Compatibility and Fracture Toughness of Bismaleimide/Tetrafunctional Epoxy Resin Blends
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Lin, K.F.; Chen, J.C. |
| 國立臺灣科技大學 |
2006 |
Curing behavior, mechanical properties, intermolecular interaction, and morphology of silicone/polypyrrole/polymer electrolyte composites
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Chiu, H.-T.;Wu, J.-H. |
| 國立交通大學 |
2014-12-08T15:01:16Z |
Curing behaviour of compatible interpenetrating polymer networks based on epoxy and methacrylated epoxy
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Wang, MW; Lee, CT; Lin, MS |
| 國立臺灣科技大學 |
2001 |
Curing characteristics of photopolymer used in the Solid Laser-diode Plotter RP System
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Jeng, J.Y.; Wong, Y.S.; Ho, C.T. |
| 國立成功大學 |
2009-12 |
Curing conditions of polyarylacetylene prepolymers to obtain thermally resistant materials
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Tseng, Wei-Chieh; Chen, Yun; Chang, Geng-Wen |
| 國立成功大學 |
2005-01 |
Curing kinetics and reaction-induced homogeneity in networks of poly(4-vinyl phenol) and diglycidylether epoxide cured with amine
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Su, Chean-Cheng; Woo, Eamor M.; Huang, Yin-Ping |
| 國立交通大學 |
2014-12-08T15:44:49Z |
Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process
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Lee, CL; Wei, KH |
| 國立中山大學 |
1995 |
Curing Kinetics of Cyanated Poly(ether sulfone)s of Different Molecular Weight
|
J.Y. Chang;J.L. Hong |
显示项目 298506-298515 / 2348487 (共234849页)
<< < 29846 29847 29848 29849 29850 29851 29852 29853 29854 29855 > >>
每页显示[10|25|50]项目
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