|
English
|
正體中文
|
简体中文
|
总笔数 :2854037
|
|
造访人次 :
45294614
在线人数 :
947
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
显示项目 336646-336655 / 2346288 (共234629页) << < 33660 33661 33662 33663 33664 33665 33666 33667 33668 33669 > >> 每页显示[10|25|50]项目
| 淡江大學 |
2024-08-07T04:07:24Z |
Dissolution of nanoprecipitate on aluminum-alloy anode for high discharging performance in Al battery applications
|
Yung, Tung-yuan;Du, Chao-hung |
| 淡江大學 |
2023-09-05 |
Dissolution of nanoprecipitate on aluminum-alloy anode for high discharging performance in Al battery applications
|
Yu-Chih Tzeng, Tung-Yuan Yung, Chun-Cheng Lin, Cheng-Yu Lin, Chao-Hung Du, Jeng-Shiung Chen, Po-Tuan Chen |
| 淡江大學 |
2023-04-18 |
Dissolution of Nanoprecipitate on Aluminum-Alloy Anode for High Discharging Performance in Al Battery Applications
|
Yu-Chih Tzeng, Tung-Yuan Yung, Chao-hung Du, Cheng-Yu Lin, Jeng-Shiung Chen, Po-Tuan Chen |
| 臺大學術典藏 |
2021-01-19T12:08:30Z |
Dissolution of PbS, CuS, and ZnS in oxic waters: effects of adsorbed natural organic matter
|
YI-PIN LIN; Li, I. Chia; Chou, Ping I. |
| 臺大學術典藏 |
2021-08-05T02:41:29Z |
Dissolution of PbS, CuS, and ZnS in oxic waters: effects of adsorbed natural organic matter
|
Lin Y.-P;Li I.-C;Chou P.-I.; Lin Y.-P; Li I.-C; Chou P.-I.; YI-PIN LIN |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 臺大學術典藏 |
1991 |
Dissolution of Solid Particles in Liquids
|
Lin, M. J.; Hsu, Jyh-Ping; 徐治平; Lin, M. J.; Hsu, Jyh-Ping |
| 國立臺灣大學 |
1991 |
Dissolution of Solid Particles in Liquids
|
徐治平; Lin, M. J.; Hsu, Jyh-Ping; Lin, M. J. |
| 臺大學術典藏 |
2020-01-06T03:08:50Z |
Dissolution of solid particles in liquids: A reaction-diffusion model
|
Hsu, J.-P.; Liu, B.-T.; JYH-PING HSU |
| 臺大學術典藏 |
2020-01-06T03:08:50Z |
Dissolution of solid particles in liquids: A surface layer model
|
hsu, J.-P.; Lin, D.-L.; Lin, M.-J.; JYH-PING HSU |
显示项目 336646-336655 / 2346288 (共234629页) << < 33660 33661 33662 33663 33664 33665 33666 33667 33668 33669 > >> 每页显示[10|25|50]项目
|