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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 353831-353840 / 2348719 (共234872页)
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每页显示[10|25|50]项目
| 亞洲大學 |
2014-07-30 |
Effect of Al Mole Fraction on the Electrical Characteristics of AlGaN/GaN HEMTs with Recessed Gate Structure
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Chang, Yi-Sheng |
| 義守大學 |
2012-03 |
Effect of Al Nanoparticles on the Microstructure, Electrical, and Optical Properties of AZO/Al/AZO Trilayer Thin Film
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Yen-Sheng Lin;Wei-Chih Tseng |
| 國立成功大學 |
2005-06-15 |
Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
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Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立東華大學 |
2008 |
Effect of Al substitution on the transport properties of SrSi2
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Kuo, Y. K. |
| 國立交通大學 |
2014-12-08T15:15:51Z |
Effect of al trace dimension on electromigration failure time of flip-chip solder joints
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Chiu, S. H.; Chen, Chih; Yao, D. J. |
| 國立交通大學 |
2014-12-08T15:12:12Z |
Effect of Al(III) speciation on coagulation of highly turbid water
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Lin, Jr-Lin; Huang, Chihpin; Pan, Jill Ruhsing; Wang, Dongsheng |
| 國立交通大學 |
2014-12-08T15:14:40Z |
Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints
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Liang, S. W.; Chiu, S. H.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:16:48Z |
Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration
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Liang, SW; Chang, YW; Chen, C |
| 國立交通大學 |
2014-12-08T15:48:13Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
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Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:15Z |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
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Liang, S. W.; Hsiao, H. Y.; Chen, Chih |
显示项目 353831-353840 / 2348719 (共234872页)
<< < 35379 35380 35381 35382 35383 35384 35385 35386 35387 35388 > >>
每页显示[10|25|50]项目
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