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显示项目 353836-353845 / 2348674 (共234868页)
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机构 日期 题名 作者
國立交通大學 2014-12-08T15:14:40Z Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints Liang, S. W.; Chiu, S. H.; Chen, Chih
國立交通大學 2014-12-08T15:16:48Z Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration Liang, SW; Chang, YW; Chen, C
國立交通大學 2014-12-08T15:48:13Z Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints Liang, S. W.; Hsiao, H. Y.; Chen, Chih
國立交通大學 2019-04-02T06:00:15Z Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints Liang, S. W.; Hsiao, H. Y.; Chen, Chih
臺大學術典藏 2020-06-16T06:32:10Z Effect of Al/Cu ratios on the optical, electrical, and electrochemical properties of Cu-Al-Ca-O thin films Cheng, I.-C.;Chang, S.-H.;Lin, G.-W.;Chi, C.-T.;Hsiao, S.-H.;Chen, J.-Z.; Cheng, I.-C.; Chang, S.-H.; Lin, G.-W.; Chi, C.-T.; Hsiao, S.-H.; Chen, J.-Z.; I-CHUN CHENG
國立聯合大學 2004 Effect of Al2O3 addition on pure structure and flow characteristics of kaolin ceramics Y.F. Chen , Y.H. Chang , M.C. Wang(王木琴) and M.H. Hon
中華大學 2011 Effect of Al2O3 Coated Glass Preform on Glass-Mold Sticking Behaviour 簡錫新; Chien, H. H.
中華大學 2011 Effect of Al2O3 Coated Glass Preform on Glass-Mold Sticking Behaviour 馬廣仁; Ma, Kung-Jen
南台科技大學 2005-08 Effect of Al2O3 Nanoparticle on the Microstructure and Magnetic Properties of Co Films Prepared by Composite Plating 王聖璋; Sheng-Chang Wang; Chih-Hsiung Tseng; Chun-Rong Lin
亞洲大學 2017-10 Effect of alcohol intoxication on the risk of venous thromboembolism: A nationwide retrospective cohort study. Chih-Jung Sh;Chih-Jung Shen;高嘉鴻;Chia-Hung Kao;Tai-Yi Hsu;Tai-Yi Hsu;Chih-Yu Chen;Chih-Yu Chen;Cheng-Li Lin;Cheng-Li Lin;Hong-Mo Shih;Hong-Mo Shih

显示项目 353836-353845 / 2348674 (共234868页)
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每页显示[10|25|50]项目