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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 432551-432560 / 2348262 (共234827页)
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每页显示[10|25|50]项目
| 淡江大學 |
2025-02-26 |
Flight Safety Management: Quantitative and AI Approaches
|
Cheng;Chi-Bin;Shyur;Huan-Jyh |
| 國立臺灣科技大學 |
1997 |
Flight Simulation of a Waverider-Based Hypersonic Vehicle
|
Lin, S. C. ; Shen, M. C. |
| 國立成功大學 |
2020 |
Flight test validation of ground based augmentation system prototype in Taiwan
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Lin, Y.-W.;Sung, Y.-T.;Yeh, S.-J.;Jan, S.-S. |
| 國立成功大學 |
2020 |
Flight test validation of ground based augmentation system prototype in Taiwan for ION GNSS+ 2020, virtual
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Lin, Y.-W.;Sung, Y.-T.;Yeh, S.-J.;Jan, S.-S. |
| 國立交通大學 |
2014-12-08T15:13:23Z |
Flip CRC modification for message length detection
|
Shieh, Shin-Lin; Chen, Po-Ning; Han, Yunghsiang S. |
| 國立交通大學 |
2014-12-08T15:47:49Z |
Flip visual cryptography (FVC) with perfect security, conditionally-optimal contrast, and no expansion
|
Lin, Sian-Jheng; Chen, Shang-Kuan; Lin, Ja-Chen |
| 國立交通大學 |
2019-04-02T06:00:33Z |
Flip visual cryptography (FVC) with perfect security, conditionally-optimal contrast, and no expansion
|
Lin, Sian-Jheng; Chen, Shang-Kuan; Lin, Ja-Chen |
| 元培科技大學 |
2013 |
Flip Visual Cryptography(FVC) with perfect security,conditionally optimal contrast,and no expansion
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Sian-Jheng Lina, Shang-Kuan Chenb,Ja-Chen Lina |
| 國立中山大學 |
2005 |
Flip-Chip Ball Grid Array Lead-Free Solder Joint under Reliability Test
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M.H.R. Jen; L.C. Liu; J.D. Wu |
| 國立臺灣大學 |
2008 |
Flip-chip bonded MEMS capacitor applied on tuning superconductive resonator
|
Chen, Yi-Jie; Kao, Cheng-Kai; Shih, Wen-Pin; Chung, Sheng-Yuan; Chang, Pei-Zen |
显示项目 432551-432560 / 2348262 (共234827页)
<< < 43251 43252 43253 43254 43255 43256 43257 43258 43259 43260 > >>
每页显示[10|25|50]项目
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