| 國立交通大學 |
2014-12-08T15:47:49Z |
Flip visual cryptography (FVC) with perfect security, conditionally-optimal contrast, and no expansion
|
Lin, Sian-Jheng; Chen, Shang-Kuan; Lin, Ja-Chen |
| 國立交通大學 |
2019-04-02T06:00:33Z |
Flip visual cryptography (FVC) with perfect security, conditionally-optimal contrast, and no expansion
|
Lin, Sian-Jheng; Chen, Shang-Kuan; Lin, Ja-Chen |
| 元培科技大學 |
2013 |
Flip Visual Cryptography(FVC) with perfect security,conditionally optimal contrast,and no expansion
|
Sian-Jheng Lina, Shang-Kuan Chenb,Ja-Chen Lina |
| 國立中山大學 |
2005 |
Flip-Chip Ball Grid Array Lead-Free Solder Joint under Reliability Test
|
M.H.R. Jen; L.C. Liu; J.D. Wu |
| 國立臺灣大學 |
2008 |
Flip-chip bonded MEMS capacitor applied on tuning superconductive resonator
|
Chen, Yi-Jie; Kao, Cheng-Kai; Shih, Wen-Pin; Chung, Sheng-Yuan; Chang, Pei-Zen |
| 臺大學術典藏 |
2018-09-10T06:58:58Z |
Flip-chip bonded MEMS capacitor applied on tuning superconductive resonator
|
Chen, Yi-Jie;Kao, Cheng-Kai;Shih, Wen-Pin;Chung, Sheng-Yuan;Chang, Pei-Zen; Chen, Y.-J. and Kao, C.-K. and Shih, W.-P. and Chung, S.-Y. and Chang, P.-Z.; WEN-PIN SHIH; Chen, Yi-Jie; Kao, Cheng-Kai; Shih, Wen-Pin; Chung, Sheng-Yuan; Chang, Pei-Zen |
| 元智大學 |
Dec-14 |
Flip-Chip Bonding Packaged THz Photodiode With Broadband High-Power Performance
|
J.-M. Wun; C.-H. Lai; Nan-Wei Chen; J. E. Bowers; J.-W. Shi |
| 國立彰化師範大學 |
2008-12 |
Flip-Chip LED Design Based on PSO Algorithm
|
Wan, Yi-Chih; Wang, Chuen-Ching; Chen, Jin-Jia; Shih, Wei-Wen |
| 南台科技大學 |
2006-08 |
Flip-chip p(GaN)-i(GaN)-n(AlGaN) narrow-band UV-A photo sensors
|
T. K. Ko; S. C. Shei; S. J. Chang; Y. K. Su; Y. Z. Chiou; Y. C. Lin; C. S. Chang; W. S. Chen; C. K. Wang; J. K. Sheu; W. C. Lai;林永春 |
| 國立成功大學 |
2006-08 |
Flip-chip p(GaN)-i(GaN)-n(AlGaN) narrowband UV-A photosensors
|
Ko, T. K.; Shei, Shih-Chang; Chang, Shoou-Jinn; Su, Yan-Kuin; Chiou, Yu-Zung; Lin, Y. C.; Chang, C. S.; Chen, W. S.; Wang, C. K.; Sheu, Jinn-Kong; Lai, W. C. |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
|
Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:27:17Z |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
|
Wang, Chin-Te; Kuo, Chien-I; Hsu, Heng-Tung; Chang, Edward Yi; Hsu, Li-Han; Lim, Wee-Chin; Miyamoto, Yasuyuki |
| 元智大學 |
2011-09 |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
|
Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto |
| 元智大學 |
2011-09 |
Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate
|
Chin-Te Wang; Chien-I Kuo; Heng-Tung Hsu; Edward Yi Chang; Li-Han Hsu; Wee-Chin Lim; Yasuyuki Miyamoto |
| 國立臺灣科技大學 |
2019 |
Flip-chip routing with i/o planning considering practical pad assignment constraints
|
Yu, T.-C.;Shih, A.-J.;Fang, S.-Y. |
| 國立臺灣科技大學 |
2018 |
Flip-chip routing with IO planning considering practical pad assignment constraints
|
Yu T.-C.; Fang S.-Y. |
| 臺大學術典藏 |
2009 |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
|
Fang, J.-W.;Wong, M.D.F.;Chang, Y.-W.; Fang, J.-W.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Flip-chip routing with unified area-I/O pad assignments for package-board co-design.
|
Fang, Jia-Wei;Wong, Martin D. F.;Chang, Yao-Wen; Fang, Jia-Wei; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
| 國立虎尾科技大學 |
2007 |
Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects
|
Lin, Chao-Ming;Chang, Win-Jin;Fang, Te-Hua |
| 臺大學術典藏 |
2018-09-10T09:17:59Z |
Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration
|
Hsin-Chia Lu;Che-Chung Kuo;Po-An Lin;Chen-Fang Tai;Yi-Long Chang;Yu-Sian Jiang;Jeng-Han Tsai;Yue-Ming Hsin;Huei Wang; Hsin-Chia Lu; Che-Chung Kuo; Po-An Lin; Chen-Fang Tai; Yi-Long Chang; Yu-Sian Jiang; Jeng-Han Tsai; Yue-Ming Hsin; Huei Wang; HSIN-CHIA LU |
| 臺大學術典藏 |
2018-09-10T09:18:00Z |
Flip-chip-assembled W-band CMOS chip modules on ceramic integrated passive device with transition compensation for millimeter-wave system-in-package integration
|
Lu, H.-C.; Kuo, C.-C.; Lin, P.-A.; Tai, C.-F.; Chang, Y.-L.; Jiang, Y.-S.; Tsai, J.-H.; Hsin, Y.-M.; Wang, H.; HSIN-CHIA LU |
| 國立交通大學 |
2014-12-08T15:48:22Z |
Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation
|
Hsu, Li-Han; Kuylenstierna, Dan; Kozhuharov, Rumen; Gavell, Marcus; Karnfelt, Camilla; Lim, Wee-Chin; Zirath, Herbert; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:44:54Z |
Flip-flop selection for mixed scan and reset design based on test generation and structure of sequential circuits
|
Liang, HC; Lee, CL |
| 中原大學 |
2000-09 |
Flip-Flop Selection for Mixed Scan and Reset Design Based on Test Generation and Structure of Sequential Circuits
|
Hsing-Chung Liang;Chung Len Lee |
| 國立交通大學 |
2014-12-08T15:20:53Z |
Flip-Up Micro Scanning Mirror with Vertical Comb Drive Assembled by Simple Push Operations
|
Chen, Cheng-An; Chiu, Yi |
