|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
52798882
在线人数 :
656
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
显示项目 463126-463135 / 2348719 (共234872页) << < 46308 46309 46310 46311 46312 46313 46314 46315 46316 46317 > >> 每页显示[10|25|50]项目
| 國立成功大學 |
2003-09 |
Heat conduction in a cylindrically anisotropic tube of a functionally graded material
|
Tarn, Jiann-Quo; Wang, Yung-Ming |
| 國立成功大學 |
2013-12 |
Heat conduction in a functionally graded medium with an arbitrarily oriented crack
|
Chiu, Tz-Cheng; Tsai, Shang-Wu; Chue, Ching-Hwei |
| 國立成功大學 |
2014-02 |
Heat Conduction in Functionally Graded Circular Hollow Cylinders with General Time-dependent Boundary Conditions
|
Lee, Sen Yung; Huang, Chih Cheng |
| 朝陽科技大學 |
2023-06-01 |
Heat Conductivity Test of Carbon Fiber Sandwich Panel with Flame-Retardant Core
|
顏安呈; Yen, An Cheng |
| 臺大學術典藏 |
2018-09-10T09:50:20Z |
Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz Communication
|
RUEY-BEEI WU; HSIN-CHIA LU; R.-B. Wu; H.-C. Cheng;W.-R. Ciou;W.-H. Chen;J.-L. Kuo;H.-C. Lu;R.-B. Wu; H.-C. Cheng; W.-R. Ciou; W.-H. Chen; J.-L. Kuo; H.-C. Lu |
| 國立成功大學 |
2017 |
Heat dissipation analysis of continuously-moving plate undergoing thermal processing using Laplace Adomian decomposition method
|
Chen, Chen C.K.;Chang, Y.-S.;Liu, C.-C.;Chen, B.-S. |
| 國立臺灣科技大學 |
2012 |
Heat dissipation analysis of high power multi-chip cob package leds
|
Wu, H.-H.;Lin, K.-H.;Lin, S.-T. |
| 國立臺灣科技大學 |
2014 |
Heat dissipation capacity of heat sink assembly with/without vortex generators
|
Lin S.-C., Chang C.-J., Wang F.-Y., Hsiao H.-C., Yang S.-K., Hsiao C.-Y. |
| 臺大學術典藏 |
2018-09-10T09:22:35Z |
Heat dissipation consideration of high-power mid-infrared quantum cascade laser arrays
|
Chen, X.; Cheng, L.; Guo, D.; Li, J.-Y.; Choa, F.-S.; JIUN-YUN LI |
| 元智大學 |
2015-10-21 |
Heat Dissipation Improvement Design For QSFP Connector
|
Ming-Chun Hsu; Hungwen Lin |
显示项目 463126-463135 / 2348719 (共234872页) << < 46308 46309 46310 46311 46312 46313 46314 46315 46316 46317 > >> 每页显示[10|25|50]项目
|