| 臺大學術典藏 |
2022-03-22T08:28:45Z |
High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry
|
Chen L.-C;Tan P.-J;Wu G.-W;Lin C.-J;Nguyen D.T.; Chen L.-C; Tan P.-J; Wu G.-W; Lin C.-J; Nguyen D.T.; LIANG-CHIA CHEN |
| 臺大學術典藏 |
2022-03-22T08:28:45Z |
High-speed chromatic confocal microscopy using multispectral sensors for sub-micrometer-precision microscopic surface profilometry
|
Chen L.-C;Tan P.-J;Wu G.-W;Lin C.-J;Nguyen D.T.; Chen L.-C; Tan P.-J; Wu G.-W; Lin C.-J; Nguyen D.T.; LIANG-CHIA CHEN |
| 國立臺灣大學 |
2006 |
High-Speed Circuit Designs for Transmitters in Broadband Data Links
|
Lee, Jri |
| 臺大學術典藏 |
2018-09-10T06:03:21Z |
High-Speed Circuit Designs for Transmitters in Broadband Data Links
|
Jri Lee; JRI LEE |
| 臺大學術典藏 |
2018-09-10T06:37:57Z |
High-speed clock and data recovery circuit
|
Jri Lee; Behzad Razavi; JRI LEE |
| 國立交通大學 |
2014-12-08T15:03:23Z |
HIGH-SPEED CLOSEST CODEWORD SEARCH ALGORITHMS FOR VECTOR QUANTIZATION
|
LEE, CH; CHEN, LH |
| 臺大學術典藏 |
2018-09-10T03:50:57Z |
High-Speed CMOS Circuits for Gigabit Ethernet
|
T. C. Lee; TAI-CHENG LEE |
| 國立成功大學 |
2019 |
High-Speed Concurrent Transmission Scheme for Full Duplex Multi-Hop Relay Assisted mmWave WPAN Networks
|
Chang;Wenson;Wu;Chien-Wen |
| 臺大學術典藏 |
2018-09-10T06:56:30Z |
High-speed continuous time digitizer using a two-level multiphase sampling technique
|
Hwang, C.-S.; Sung, C.-W.; Tsao, H.-W.; HEN-WAI TSAO |
| 元智大學 |
Jun-17 |
High-speed Cu Electrodeposition and Its Solderability
|
Pei-Tzu Lee; Ying-Syuan Wu; Pin-Chung Lin; Chang-Chih Chen; Wan-Zhen Hsieh; Cheng-En Ho |
| 元智大學 |
Oct-18 |
High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage
|
Pei-Tzu Lee; Ying-Syuan Wu; Cheng-Yu Lee; Hung-Cheng Liu; Cheng-En Ho |
| 國立中山大學 |
2009 |
High-speed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies
|
E.H. Wong;S.K.W. Seah;C.S. Selvanayagam;R. Rajoo;W.D. van Driel;J.F.J.M. Caers;X.J. Zhao;N. Owens;M. Leoni;L.C. Tan;Y.S. Lai;C.L. Yeh |
| 國立交通大學 |
2019-10-05T00:08:44Z |
High-speed data-plane packet aggregation and disaggregation by P4 switches
|
Wang, Shie-Yuan; Wu, Chia-Ming; Lin, Yi-Bing; Huang, Ching-Chun |
| 國立交通大學 |
2014-12-08T15:04:17Z |
HIGH-SPEED DECODER OF REED-SOLOMON CODES
|
WEI, SW; WEI, CH |
| 國立交通大學 |
2014-12-12T02:08:31Z |
HIGH-SPEED DECODING ALGORITHMS OF CYCLIC CODES AND THEIR INTEGRATED-CIRCUIT DESIGNS
|
魏; WEI, SHYUE-WIN; 魏哲和; WEI, ZHE-HE |
| 國立交通大學 |
2014-12-12T02:08:49Z |
HIGH-SPEED DECODING ALGORITHMS OF CYCLIC CODES AND THEIR INTEGRATED-CIRCUIT DESIGNS
|
魏; Wei,; 魏哲和; Wei, Zhe-Huo |
| 國立高雄應用科技大學 |
2013-06 |
High-Speed Decoding of the Binary Golay Code
|
Lee, H. P.; Chang, C. H.; Chu, S. I. |
| 國立成功大學 |
2006-02 |
High-speed design of Montgomery inverse algorithm over GF(2(m))
|
Shieh, Ming-Der; Chen, Jun-Hong; Wu, Chien-Ming |
| 淡江大學 |
20170424 |
High-speed digital color fringe projection technique for three-dimensional facial measurements
|
Liu, Cheng-Yang;Chang, Li-Jen;Wang, Chung-Yi |
| 國立臺灣大學 |
1997-09 |
High-speed divide-by-4/5 counter for a dual-modulus prescaler
|
Yang, Ching-Yuan; Dehng, Guang-Kaai; Liu, Shen-Iuan |
| 國立交通大學 |
2014-12-08T15:11:27Z |
High-speed divide-by-4/5 prescalers with merged and gates using gainp/gaas hbt and sige hbt technolmes
|
Wei, Hung-Ju; Meng, Chinchun; Chang, YuWen; Lin, Yi-Chen; Huan, Guo-Wei |
| 國立暨南國際大學 |
2004 |
High-speed driving scheme and compact high-speed low-power rail-to-rail class-B buffer amplifier for LCD applications?
|
盧志文; Lu, CW |
| 淡江大學 |
2004-05-23 |
High-speed EBCOT with dual context-modeling coding architecture for JPEG2000
|
Chiang, Jen-Shiun; Chang, Chun-Hau; Lin, Yu-Sen; Hsieh, Chang-You; Hsia ,Chih-Hsien |
| 國立交通大學 |
2019-01-01 |
High-Speed Electro-Absorption Modulated Laser at 1.3 mu m Wavelength Based on Selective Area Growth Technique
|
Wei, Chia-Chien; Shi, Jin-Wei; Hung, Yung-Jr; Chen, Jyehong; Chao, Rui-Lin; Ahmad, Zohauddin |
| 元智大學 |
Aug-21 |
High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF)
|
Pei-Tzu Lee; Chih-Hao Chang; Cheng-Yu Lee; Ying-Syuan Wu; Cheng-Hsien Yang; Cheng-En Ho |
