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显示项目 517071-517080 / 2332495 (共233250页)
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机构 日期 题名 作者
臺大學術典藏 2009-01-06T01:29:28Z Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學 2006 Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學 2002 Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates Chiu, M. Y.; Wang, S. S.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:18Z Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學 2006 Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:14Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG
國立臺灣大學 2004 Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D.
臺大學術典藏 2020-05-12T02:53:15Z Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG

显示项目 517071-517080 / 2332495 (共233250页)
<< < 51703 51704 51705 51706 51707 51708 51709 51710 51711 51712 > >>
每页显示[10|25|50]项目