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显示项目 517111-517120 / 2332602 (共233261页)
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| 國立聯合大學 |
2004 |
Intermetallic Compounds Formation of the Sn-9Zn-xAg Lead-free Solders Hot-dipped on Cu Substrate
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T.C. Chang , . M.C. Wang(王木琴) and M..H. Hon |
| 國立成功大學 |
2003-04-30 |
Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder
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Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
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Yu, C. L.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed at the interface between liquid indium and copper substrates
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Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer
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Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2009-01-06T01:29:28Z |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
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Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
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Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 國立臺灣大學 |
2002 |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
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Chiu, M. Y.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
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Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates
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Wang, S. S.; Tseng, Y. H.; Chuang, T. H. |
显示项目 517111-517120 / 2332602 (共233261页)
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