| 國立成功大學 |
2006-12-25 |
Interfacial and quantum well effects on ac magnetotransport of La0.7Sr0.3MnO3/La1.4Sr1.6Mn2O7 composites
|
Hsu, C. Y.; Chou, Hsiung; Liao, B. Y.; Huang, Jung-Chun Andrew |
| 臺大學術典藏 |
2022-03-22T08:27:11Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng Y.-T;Tsao H.-K;Sheng Y.-J.; Cheng Y.-T; Tsao H.-K; Sheng Y.-J.; YU-JANE SHENG |
| 臺大學術典藏 |
2022-03-22T08:30:07Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng Y.-T;Tsao H.-K;Sheng Y.-J.; Cheng Y.-T; Tsao H.-K; Sheng Y.-J.; YU-JANE SHENG |
| 臺大學術典藏 |
2022-03-22T08:30:08Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng Y.-T;Tsao H.-K;Sheng Y.-J.; Cheng Y.-T; Tsao H.-K; Sheng Y.-J.; YU-JANE SHENG |
| 臺大學術典藏 |
2021-09-14T23:19:20Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng, Yi Ting; Tsao, Heng Kwong; YU-JANE SHENG |
| 元智大學 |
Oct-14 |
Interfacial atomic structure analysis at sub-angstrom resolution using aberration-corrected STEM
|
Chien-Nan Hsiao; Shou-Yi Kuo; Fang-I Lai; Wei-Chun Chen |
| 國立臺灣大學 |
2002 |
Interfacial Behavior between BZN-V and Ag
|
Su, W-F; Lin, S-C |
| 國立東華大學 |
2006-07 |
Interfacial Behaviour between Bi-Ag based Solders and Ni substrate
|
Song,J. M.; Chuang,H. Y. |
| 國立東華大學 |
2007 |
Interfacial Behaviour between Bi-Ag Solders and the Ni substrate
|
宋振銘; 莊鑫毅 |
| 臺大學術典藏 |
2018-06-28T21:48:08Z |
Interfacial behaviour between Bi1.5ZnNb1.5O7.0.02V2O5 and Ag
|
Lin, Shin-Chih; Su, Wei-Fang; Su, Wei-Fang; Lin, Shin-Chih |
| 國立臺灣大學 |
2003 |
Interfacial behaviour between Bi1.5ZnNb1.5O7.0.02V2O5 and Ag
|
Su, Wei-Fang; Lin, Shin-Chih |
| 臺大學術典藏 |
2003 |
Interfacial behaviour between Bi1.5ZnNb1.5O7·0.02V2O5and Ag
|
Lin, S.-C.; WEI-FANG SU; Su, W.-F.; WEI-FANG SU;Lin, S.-C.;Su, W.-F.;WEI-FANG SU |
| 國立東華大學 |
2006 |
Interfacial behaviour between molten Bi based solders and Cu substrate
|
宋振銘; 莊鑫毅 |
| 國立成功大學 |
2005-01 |
Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立臺灣科技大學 |
2009 |
Interfacial bonding strength between brazing alloys and CVD diamond
|
Hsieh Y.-C.; Lin S.-T. |
| 國立臺灣大學 |
1993 |
Interfacial characterisation of Al2O3-Ni composites
|
Chang, L.; Chen, S.C.; Tuan, W.H.; Brook, R.J. |
| 臺大學術典藏 |
2020-05-12T02:54:02Z |
Interfacial characterisation of Al2O3-Ni composites
|
Chang, L.; Chen, S.C.; Tuan, W.H.; Brook, R.J.; WEI-HSING TUAN |
| 國立臺灣大學 |
1997 |
Interfacial Characteristics for Active Brazing of Alumina to Superalloys
|
Weng, W. P.; Wu, H. W.; Chai, Y. H.; Chuang, T. H. |
| 國立臺灣大學 |
1997 |
Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals
|
Weng, W. P.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:23Z |
Interfacial characteristics for brazing of aluminum matrix composites with Al-12Si filler metals
|
Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2018-09-10T04:51:57Z |
Interfacial characteristics of AlGaAs after insitu electron cyclotron resonance plasma etching and molecular beam epitaxial regrowth
|
Hong, M;Mannaerts, JP;Grober, L;Chu, SNG;Luftman, HS;Choquette, KD;Freund, RS; Hong, M; Mannaerts, JP; Grober, L; Chu, SNG; Luftman, HS; Choquette, KD; Freund, RS; MINGHWEI HONG |
| 國立交通大學 |
2014-12-08T15:05:27Z |
INTERFACIAL CHARACTERISTICS OF HIGH-PERFORMANCE CARBON-FIBER THERMOPLASTIC COMPOSITES WITH POLYIMIDE COUPLING AGENTS
|
WHANG, WT; LIU, WL |
| 臺大學術典藏 |
2019-12-27T07:49:14Z |
Interfacial characteristics of Y2O3/GaSb(001) grown by molecular beam epitaxy and atomic layer deposition
|
Lin, Y.H.; Lin, K.Y.; Hsueh, W.J.; Young, L.B.; Chang, T.W.; Chyi, J.I.; Pi, T.W.; Kwo, J.; Hong, M.; MINGHWEI HONG |
| 臺大學術典藏 |
1994 |
Interfacial Characterization of Al2O3/Ni Composites
|
Tuan, Wei-Hsing; Chen, S. C.; Chang, L.; 段維新; Chang, L.; Chen, S. C.; Tuan, Wei-Hsing; Chang, L.; Chen, S. C. |
| 國立臺灣大學 |
1994 |
Interfacial Characterization of Al2O3/Ni Composites
|
Chang, L.; Chen, S. C.; 段維新; Chang, L.; Chen, S. C.; Tuan, Wei-Hsing |
