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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 519396-519405 / 2346788 (共234679页)
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每页显示[10|25|50]项目
| 國立成功大學 |
2019-03 |
Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application
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Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong |
| 國立中山大學 |
1992 |
Interfacial Reaction Characterization in Aluminum Base Composites
|
Y.S. Lo;J.C. Huang |
| 國立臺灣大學 |
2007 |
Interfacial reaction issues for lead-free electronic solders
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Ho, C. E.; Yang, S. C.; Kao, C. R. |
| 臺大學術典藏 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
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Yang, T.Y.; Wu, S.K.; Shiue, R.K.; SHYI-KAAN WU; SHYI-KAAN WU;Shiue, R.K.;Wu, S.K.;Yang, T.Y.;SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
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Yang, T. Y.; Wu, S. K.; Shiue, R. K. |
| 臺大學術典藏 |
2020-05-12T02:52:55Z |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
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Yang, T.Y.; Wu, S.K.; Shiue, R.K.; REN-KAE SHIUE |
| 國立成功大學 |
2004 |
Interfacial reaction of TiO2/NiCuZn ferrites in multilayer composites
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Hsiang, Hsing-I; Liao, Wen-Chang; Wang, Yu-Ju; Cheng, Ya-Fang |
| 國立交通大學 |
2014-12-08T15:09:55Z |
Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints
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Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立臺灣大學 |
2010 |
Interfacial Reactions and Doping in Organic Light Emitting Diodes Incorporated with Cesium-Based Compounds
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Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I |
| 臺北醫學大學 |
2005 |
Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes
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歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang |
显示项目 519396-519405 / 2346788 (共234679页)
<< < 51935 51936 51937 51938 51939 51940 51941 51942 51943 51944 > >>
每页显示[10|25|50]项目
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