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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 557006-557015 / 2346275 (共234628页)
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每页显示[10|25|50]项目
| 國立中山大學 |
1990 |
Low Temperature and High Strain Rate Deformation of Ni and Ni-C Alloys and Analysis of the Constitutive Behavior According to an Internal State Variable Model
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P.S. Follansbee;J.C. Huang;G.T. Gray |
| 國立中山大學 |
2002 |
Low Temperature and High Strain Rate Superplasticity in AZ31 Mg Alloys
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H.K. Lin;C.J. Li;J.C. Huang |
| 臺大學術典藏 |
2019-11-27T02:02:12Z |
Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections
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C. ROBERT KAO;Kao C.R.;Chen Y.-H.;Weng I.-A.;Yang S.;Hung H.-T.; Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO |
| 國立成功大學 |
2013-07-15 |
Low temperature and rapid deposition of ZnO nanorods on Si(100) substrate with tunable optical emissions
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Brahma, Sanjaya; Huang, J-L; Liu, C. P.; Kukreja, L. M.; Shivashankar, S. A. |
| 臺大學術典藏 |
2020-05-12T02:53:33Z |
Low temperature and rapid formation of high quality metal oxide thin film: Via a hydroxide-assisted energy conservation strategy
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WEI-FANG SU;Su, W.-F.;Hsiao, K.-C.;Lu, C.-F.;Cheng, C.-C.;Jao, M.-H.; Jao, M.-H.; Cheng, C.-C.; Lu, C.-F.; Hsiao, K.-C.; Su, W.-F.; WEI-FANG SU |
| 國立臺灣科技大學 |
2016 |
Low temperature annealing effect on photoresponse of the bilayer structures of ZnO nanorod/nanodiamond films based on ultraviolet photodetector
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Huang, B.-R;Ke, W.-C;Peng, Y.-H;Liou, R.-H. |
| 臺大學術典藏 |
2018-09-10T08:17:49Z |
Low temperature annealing for GaAsSbN grown by gas-source molecular beam epitaxy
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Y. T. Lin,;T. C. Ma,;H. H. Lin; Y. T. Lin,; T. C. Ma,; H. H. Lin; HAO-HSIUNG LIN |
| 國立交通大學 |
2014-12-08T15:07:53Z |
Low Temperature Annealing with Solid-State Laser or UV Lamp Irradiation on Amorphous IGZO Thin-Film Transistors
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Zan, Hsiao-Wen; Chen, Wei-Tsung; Chou, Cheng-Wei; Tsai, Chuang-Chuang; Huang, Ching-Neng; Hsueh, Hsiu-Wen |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low temperature Au-Au direct bonding with highly < 111 >-oriented Au films
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Hsu, Wei-You; Wu, John; Chen, Chih |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler
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Chang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG |
显示项目 557006-557015 / 2346275 (共234628页)
<< < 55696 55697 55698 55699 55700 55701 55702 55703 55704 55705 > >>
每页显示[10|25|50]项目
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