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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 557831-557840 / 2348487 (共234849页)
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| 國立交通大學 |
2020-01-02T00:04:24Z |
Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper
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Wu, Yu-Ting; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films
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Chen, Fu-Chian; Wu, Yu-Ting; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:27:23Z |
Low temperature deposited highly-conductive N-type SiC thin films
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Cheng, KL; Cheng, HC; Lee, WH; Lee, C; Yew, TR |
| 國立交通大學 |
2020-10-05T01:59:48Z |
Low temperature deposition of high quality single crystalline AlN thin films on sapphire using highly oriented monolayer MoS 2 as a buffer layer
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Lu, Li-Syuan; Chueh, Wei-Chen; Chang, Wen-Hao; Chen, Meei-Ru; Chien, Hung-Yi; Kuo, Po-Chun; Kao, Hui-Ling; Chen, Jyh-Shin |
| 臺大學術典藏 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
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Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 國立臺灣大學 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
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Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Low temperature direct electroless nickel plating on silicon wafer
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TUNG-HAN CHUANG; Yang, S.-R.; Chuang, T.-H.; Wang, S.-S.; Jain, C.-C. |
| 國立中山大學 |
1987 |
Low temperature effects of flow in sandbed streams
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Jin Wu;Ruo-Shan Tseng |
| 國立臺灣海洋大學 |
2006 |
Low Temperature Electrical Resistivity Study of Deformed Inconel Alloy 600
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Feng Shiu Chan;Yeong Der Yao;Shing Hoa Wang |
| 臺大學術典藏 |
2022-04-25T06:29:49Z |
LOW TEMPERATURE ELECTRICAL TRANSPORT IN70GE:GA SAMPLE IN MAGNETIC FIELDS
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Errai M;Amrane S;Liang C.T.; Errai M; Amrane S; Liang C.T.; CHI-TE LIANG |
显示项目 557831-557840 / 2348487 (共234849页)
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每页显示[10|25|50]项目
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