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显示项目 621081-621090 / 2348570 (共234857页)
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每页显示[10|25|50]项目
| 臺大學術典藏 |
2022-03-22T08:28:00Z |
Novel method for identifying residual prestress force in simply supported concrete girder-bridges
|
Bonopera M;Chang K.-C.; Bonopera M; Chang K.-C.; KUO-CHUN CHANG |
| 元智大學 |
2005-10 |
Novel method for in situ monitoring of thickness of quartz during wet etching
|
李其源; 李碩仁; Pei-Zen-Chang; Yung-Yu Cheni; Ching-Liang-Da; Ping-Hei-Chen |
| 臺大學術典藏 |
2005 |
Novel Method for in situ Monitoring of Thickness of Quartz during Wet Etching
|
Dai, Ching-Liang; Chen, Ping-Hei; Lee, Shuo-Jen; Chen, Yung-Yu; Chang, Pei-Zen; Lee, Chi-Yuan; Lee, Chi-Yuan; Chang, Pei-Zen; Chen, Yung-Yu; Dai, Ching-Liang; Chen, Ping-Hei; Lee, Shuo-Jen |
| 國立臺灣大學 |
2005 |
Novel Method for in situ Monitoring of Thickness of Quartz during Wet Etching
|
Lee, Chi-Yuan; Chang, Pei-Zen; Chen, Yung-Yu; Dai, Ching-Liang; Chen, Ping-Hei; Lee, Shuo-Jen |
| 臺大學術典藏 |
2018-09-10T05:18:48Z |
Novel method for in situ monitoring of thickness of quartz during wet etching
|
Lee, C.-Y.; Chang, P.-Z.; Chen, Y.-Y.; Dai, C.-L.; Chen, P.-H.; Lee, S.-J.; PING-HEI CHEN |
| 國立臺灣大學 |
2005-10 |
Novel Method for In-situ Monitoring of Thickness of Quartz during Wet Etching
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Lee, C. Y.; Cheng, Y. C.; Wu, T. T.; Chen, Y. Y.; Chen, W. J.; Pao, S. Y.; Chang, P. Z.; Chen, Ping Hei |
| 元智大學 |
2006-03 |
Novel method for in-situ monitoring of thickness of silicon wafer during wet etching
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李其源; 李碩仁; Pei-Zen Chang; Yung-Yu Chen; Ching-Liang Dai; Xuan-Yu Wang; Ping-Hei Chen |
| 臺大學術典藏 |
2006-05 |
Novel Method for In-Situ Monitoring of Thickness of Silicon Wafer during Wet Etching
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Lee, Shuo-Jen; Chen, Ping-Hei; Wang, Xuan-Yu; Dai, Ching-Liang; Chen, Yung-Yu; Lee, Chi-Yuan; Chang, Pei-Zen; Chen, Yung-Yu; Dai, Ching-Liang; Wang, Xuan-Yu; Chen, Ping-Hei; Lee, Shuo-Jen; Lee, Chi-Yuan; Chang, Pei-Zen |
| 國立臺灣大學 |
2006-05 |
Novel Method for In-Situ Monitoring of Thickness of Silicon Wafer during Wet Etching
|
Lee, Chi-Yuan; Chang, Pei-Zen; Chen, Yung-Yu; Dai, Ching-Liang; Wang, Xuan-Yu; Chen, Ping-Hei; Lee, Shuo-Jen |
| 臺大學術典藏 |
2018-09-10T05:53:35Z |
Novel method for in-situ monitoring of thickness of silicon wafer during wet etching
|
LEE, CY; CHANG, PZ; CHEN, YY; et al.; PING-HEI CHEN |
显示项目 621081-621090 / 2348570 (共234857页)
<< < 62104 62105 62106 62107 62108 62109 62110 62111 62112 62113 > >>
每页显示[10|25|50]项目
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