| 國立交通大學 |
2019-04-02T05:58:32Z |
Thermal reactions of Pd/AlxGa1-xAs contacts
|
Chuang, HF; Lee, CP; Tsang, JS; Fan, JC |
| 國立交通大學 |
2014-12-08T15:46:45Z |
Thermal reactions of phosphine with Si(100): a combined photoemission and scanning-tunneling-microscopy study
|
Lin, DS; Ku, TS; Sheu, TJ |
| 臺大學術典藏 |
2000 |
Thermal reconstruction behavior of the quenched hydroxyapatite powder during reheating in air
|
Chen, Ko-Shao; Sun, Jui-Sheng; Lin, Feng-Huei; Liao, Chun-Jen; Lin, Feng-Huei;Liao, Chun-Jen;Chen, Ko-Shao;Sun, Jui-Sheng |
| 國立臺灣大學 |
2000 |
Thermal reconstruction behavior of the quenched hydroxyapatite powder during reheating in air
|
Lin, Feng-Huei; Liao, Chun-Jen; Chen, Ko-Shao; Sun, Jui-Sheng |
| 臺大學術典藏 |
2020-02-07T03:43:54Z |
Thermal reconstruction behavior of the quenched hydroxyapatite powder during reheating in air
|
Lin F.-H.;Chun-Jen L.;Ko-Shao C.;Jui-Sheng Sun; Lin F.-H.; Chun-Jen L.; Ko-Shao C.; JUI-SHENG SUN |
| 國立成功大學 |
2008-09-15 |
Thermal recordable novel cholesteric liquid crystalline polyacrylates containing various chiral moieties
|
Liu, Jui-Hsiang; Hung, Hsien-Jung; Yang, Po-Chih; Tien, Kai-Hsin |
| 國立臺灣大學 |
1994 |
Thermal recovery of spectral holes of dye molecules in polymer films. Site distribution in two-level systems
|
Chang, Ta-Chau; Chiang, Chien-Chih; Small, Gerald J.; Chou, Shiow-Hwa |
| 國立成功大學 |
2023 |
Thermal Recovery of the Electrochemically Degraded LiCoO2/Li7La3Zr2O12:Al,Ta Interface in an All-Solid-State Lithium Battery
|
Ihrig, M.;Kuo, L.-Y.;Lobe, S.;Laptev, A.M.;Lin, C.-A.;Tu, C.-H.;Ye, R.;Kaghazchi, P.;Cressa, L.;Eswara, S.;Lin, S.-K.;Guillon, O.;Fattakhova-Rohlfing, D.;Finsterbusch, M. |
| 元智大學 |
2007 |
Thermal regeneration of activated carbons exhausted with phenol compound
|
謝建德; M.-Y. Cheng; S.-C. Yang |
| 國立高雄應用科技大學 |
2013 |
Thermal relaxation and deformation of indented graphene
|
Fan, Yu-Cheng; Wu, Cheng-Da; Fang, Te-Hua; Chen, Tao-Hsing |
| 國立臺灣大學 |
1995 |
Thermal relaxation in arrays of coupled ferromagnetic particles
|
Klik, Ivo; Chang, Ching-Ray |
| 臺大學術典藏 |
2019-12-20T01:17:41Z |
Thermal Relaxation in Arrays of Coupled Ferromagnetic Particles
|
Klik, I.;Chang, Cr; Klik, I.; Chang, Cr; CHING-RAY CHANG |
| 臺大學術典藏 |
2019-12-19T08:38:44Z |
Thermal Relaxation in Magnetic Materials: A Survey
|
Klik, Ivo;Chang, Ching-Ray; Klik, Ivo; Chang, Ching-Ray; CHING-RAY CHANG |
| 真理大學 |
2000 |
Thermal relaxation of interacting fine magnetic particles-field-cooled and zero-field-cooled magnetization variation
|
鄧鴻源 |
| 國立交通大學 |
2020-07-01T05:21:18Z |
Thermal Relaxation Spectra for Evaluating Luminescence Quantum Efficiency of CASN:Eu2+ Measured by Balanced-Detection Sagnac-Interferometer Photothermal Deflection Spectroscopy
|
Chima, Hiromichi; Shiokawa, Naoyuki; Seto, Keisuke; Takahashi, Kohsei; Hirosaki, Naoto; Kobayashi, Takayoshi; Tokunaga, Eiji |
| 國立勤益科技大學 |
2012-04 |
Thermal reliability of thin SiGe epilayers
|
江東源 |
| 國立交通大學 |
2014-12-08T15:21:50Z |
Thermal reliability of thin SiGe epilayers
|
Wu, Ming-Jhang; Wen, Hua-Chiang; Chiang, Tun-Yuan; Tsai, Chien-Huang; Hsu, Wen-Kuang; Chou, Chang-Pin |
| 國立中山大學 |
1994 |
Thermal Residual Strains in Carbon Fiber-Reinforced Aluminum Laminates
|
C.T. Lin; P.W. Kao; M.H.R. Jen |
| 國立中山大學 |
1994 |
Thermal Residual Strains in Carbon Fibre-Reinforced Aluminum Laminates
|
C.T. Lin;P.W. Kao;M.H.R. Jen |
| 中國醫藥大學 |
2010-08 |
Thermal resistance and dynamic damping properties of poly (styrene–butadiene–styrene)/thermoplastic polyurethane composites elastomer material
|
(Jyh-Horng Wu); (Chia-Hao Li); (Yao-Tsu Wu); (Ming-Tsong Leu); 蔡育勳(Yuhsin Tsai)* |
| 國立成功大學 |
2024 |
Thermal resistance prediction model for IC packaging optimization and design cycle reduction
|
Chen;G, -W.;Lin;Y, -C.;Hsu;C, -H.;Chen;T, -Y.;Wang;C, -C.;Hung;C, -P.;Wang;H, -K. |
| 國立成功大學 |
2003-11 |
Thermal resistance variation of HBT with high junction temperature and bias condition
|
Su, Yan-Kuin; Wei, Sun-Chin; Chang, Lee-Sheng; Wang, Ray-Lu; Wang, Charles J. |
| 國立高雄師範大學 |
2003 |
Thermal resistance variation of HBT with high junction temperature and bias condition
|
Yan-Kuin Su;Sun-Chin Wei;Lee-Sheng Chang;Ruey-Lu Wang;Charles J. Wang; 王瑞祿 |
| 淡江大學 |
1999-02 |
Thermal response analyses for spherical LPG storage tank
|
陳錫仁; Chen, Hsi-jen; Lin, Mann-hsing; Chao, Fu-yuan |
| 淡江大學 |
1999 |
Thermal Response Analyses of Spherical LPG Storage Tank
|
陳錫仁; Chen, Hsi-jen; Lin, Mann-hsing; Chao, Fu-yuan |
| 淡江大學 |
1998-01 |
Thermal Response Model and Thermal Risk Analysis for LPG Storage
|
陳錫仁; Chen, H. J.; 林興; Lin , M. H.; 趙富源; Chao, F. Y. |
| 臺大學術典藏 |
2020-04-28T07:11:30Z |
Thermal response of grain boundaries in graphene sheets under shear strain from atomistic simulations
|
Chang, C.-C.; CHIEN-CHENG CHANG; Pao, C.-W.; Liu, T.-H. |
| 臺大學術典藏 |
2022-01-07T02:14:15Z |
Thermal Response of Microcantilever Modified with Self-Assembled Monolayers
|
TH Chang and CS Chen; CHUIN-SHAN CHEN |
| 臺大學術典藏 |
2021-10-07T08:50:19Z |
Thermal responses of continuous and patterned multilayer films in the presence of a nanoscale hot spot
|
Jia-Yang Juang; Jinglin Zheng; JIA-YANG JUANG |
| 國立中山大學 |
1988 |
Thermal Responses of Ventromedial Hypothalamic Neurons in Vivo and in Vitro
|
K.I. Matsumura;K. Matsumura;C.L. Tsai;T. Nakayama |
| 嘉南藥理大學 |
2013-09 |
Thermal runaway analyses for two organic peroxides with H2O and dry fire-extinguishing chemicals by DSC and VSP2
|
Li, Ang-Cian; Tsai, Yun-Ting; Wu, Sheng-Hung; Chiu, Chen-Wei; Shen, Sun-Ju; Chang, Ron-Hsin; Shu, Chi-Min |
| 國立彰化師範大學 |
2009-02 |
Thermal Runaway Evaluation of α-methylstyrene and Trans-β-methylstyrene with Benzaldehyde
|
Lin, S. Y. ; Tseng, J. M. ; Lee, M. K. ; Wu, Tsung-Chih; Shu, C. M. |
| 大葉大學 |
2013-08-01 |
Thermal runaway reaction evaluation of benzoyl peroxide using calorimetric approaches
|
Huang, Yi-Hao;Yet-Pole, I;Chen, Nan-Chi;Wu, Sheng-Hung;Horng, Jao-Jia;Wen, I-Jyh |
| 大葉大學 |
2013-08-1 |
Thermal runaway reaction evaluation of benzoyl peroxide using calorimetric approaches
|
Huang, Yi-Hao;Yet-Pole, I;Chen, Nan-Chi;Wu, Sheng-Hung;Horng, Jao-Jia;Wen, I-Jyh |
| 亞洲大學 |
2016-01 |
Thermal runaway reaction for highly exothermic material in safe storage temperature
|
林駿憑；Chun-Ping Lina；Jin-Shuh Lic； Jo-Ming Tsengd；Sam Mannane |
| 亞洲大學 |
2016-01 |
Thermal runaway reaction for highly exothermic material in safe storage temperature
|
林駿憑;LIN, CHUN-PING;Tsen, Jo-Ming;Tseng, Jo-Ming;* |
| 嘉南藥理大學 |
2009-08-12 |
Thermal sensitivity simulation of wet-type fire suppression sprinkler system
|
Chung-Hwei Su; Sheng-Hung Wu; Sun-Ju Shen; Chi-Min Shu |
| 建國科技大學 |
2011 |
Thermal shock behavior of plasma sprayed Al2O3/TiO2 coatings
|
高文顯 |
| 建國科技大學 |
2011 |
Thermal Shock Performance of Al2O3/TiO2 Air Plasma Spray Coatings
|
高文顯 |
| 國立成功大學 |
2016-01-08 |
Thermal simulation device and method for integrated circuits
|
Chiou, Lih-Yih;Lu, Liang-Ying |
| 大葉大學 |
2008-11-21 |
Thermal Simulation of a New Design PC Chassis
|
;Chang, Ming-Shong |
| 國立成功大學 |
2012-06 |
Thermal simulation of thermoelectric material by zone-melting technique
|
Chen, Yi-Ru; Hwang, Weng-Sing; Hsieh, Huey-Lin; Huang, Tsai-Kun; Hwang, Jenn-Dong; Hung, Min-Hsiun |
| 國立臺灣科技大學 |
2012 |
Thermal Solution Process for the Formation of Thin Films for Photovoltaic Materials
|
Solomon, Muluken Aklilu |
| 臺大學術典藏 |
2018-09-10T09:18:13Z |
Thermal spin transport and applications
|
SSU-YEN HUANG; Chien, C.L.; Kwo, J.; Lee, S.F.; Qu, D.; Wang, W.G.; Huang, S.Y. |
| 淡江大學 |
2011-11-01 |
Thermal spreader for simultaneously enhancing capillary effect and structural strength
|
康尚文; Kang, Shung-wen; Tsai, Meng-chang |
| 臺大學術典藏 |
2020-01-13T08:21:49Z |
Thermal spreading resistance of heat sources on rectangular flux channel under non-uniform convective cooling
|
Huang, M.-J.; Shaw, Y.-R.; Chien, H.-C.; MEI-JIAU HUANG |
| 亞洲大學 |
2009 |
Thermal Spring Bath Participant?s Self-Reported Health
|
CHIA-CHANG,LO |
| 國立成功大學 |
2004-12-22 |
Thermal stability and bonding configuration of fluorine-modified low-k SiOC : H composite films
|
JangJian, Shiu-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu |
| 國立成功大學 |
2022-06-1 |
Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper
|
Ou;Jou-Chun;Tsai;Yi-Yun;Lin;Ting-Chun;Kao;Chin-Li;Hsiao;Shih-Chieh;Huang;Fei-Ya;Kuo;Jui-Chao |
| 國立成功大學 |
2022 |
Thermal stability and bonding interface in Cu/SiO2hybrid bonding on nano-Twinned copper
|
Ou, J.-C.;Tsai, Y.-Y.;Lin, T.-C.;Kao, C.-L.;Hsiao, S.-C.;Huang, F.-Y.;Kuo, J.-C. |
